AP3031 BCDSEMI | Alldatasheet

Document overview

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Technical content

Features

  • Up to 92% Efficiency (VIN=9V , IOUT=260mA)
  • Up to 84% Efficiency (VIN=5V , IOUT=260mA)
  • Fast 1MHz Switching Frequency
  • Wide Input V oltage Range: 2.7V to 16V
  • Low 200mV Feedback V oltage
  • Output Over V oltage Protection
  • Cycle by Cycle Current Limit: 1.4A
  • Built-in Soft-start
  • Built-in Standby Mode to Achieve High Fre- quency PWM Dimming
  • Built-in Thermal Shutdown Function
  • Under V oltage Lockout

Applications

  • 7' to 10' LCD Panels
  • Digital Photo Frame
  • GPS Receiver
  • EPC
  • PDVD

Figure 1. Package Types of AP3031

Figure 2. Pin Configuration of AP3031 (Top View)

Apr. 2009 Rev. 1. 3 BCD Semiconductor Manufacturing Limited WHITE LED STEP-UP CONVERTER AP3031 Σ 1M H z OSCILLATOR RAMP GENERATOR VREF DRIVER 1. 25 V COMPARATOR 200 mV SOFT START VIN CTRL FB GND SW STANDBY OV To Control Logic CONTROL LOGIC OVER TEMPERATURE DETECTOR OV Functional Block Diagram Figure 3. Functional Block Diagram of AP3031

Ordering Information

Range Part Number Marking ID Packing Type SOT-23-6 -40 to 85oC AP3031KTR-G1 GEC Tape & Reel TSOT-23-6 AP3031KTTR-G1 L1E Tape & Reel SOIC-8 AP3031M-G1 3031M-G1 Tube AP3031MTR-G1 3031M-G1 Tape & Reel BCD Semiconductor's Pb-free products, as designated with "G1" suffix in the part number, are RoHS compliant and green. G1: Green 1 (4) 3 (1) 4 (8) 5 (7) 6 (5) A (B) A SOT-23-6/TSOT-23-6 B SOIC-8 (2, 3, 6) KT: TSOT-23-6 M: SOIC-8 TR: Tape and Reel

Apr. 2009 Rev. 1. 3 BCD Semiconductor Manufacturing Limited WHITE LED STEP-UP CONVERTER AP3031 Parameter Symbol Value Unit Input V oltage V IN 20 V SW V oltage V SW 38 V FB V oltage V FB 20 V CTRL V oltage V CTRL 20 V Thermal Resistance (Junction to Ambient, No Heat Sink) θJA SOT-23-6/TSOT-23-6 265 oC/W SOIC-8 120 Operating Junction Temperature T J 150 oC Storage Temperature Range T STG -65 to 150 oC Lead Temperature (Soldering, 10sec) T LEAD 260 oC ESD (Machine Model) 600 V ESD (Human Body Model) 4000 V Note 1: Stresses greater than those listed und er "Absolute Maximum Rati ngs" may cause permanent damage to the device. These are stress ratings only, and functiona l operation of the device at these or any other conditions beyond those indicated under "Recommended Operating Conditions" is not implied. Exposure to "Absolute Maximum Ratings" for extended periods may affect device reliability. Parameter Symbol Min Max Unit Operating Temperature Range T OP -40 85 oC Input V oltage V IN 2.7 16 V CTRL V oltage V CTRL 16 V Recommended Operating Conditions Absolute Maximum Ratings (Note 1)

Apr. 2009 Rev. 1. 3 BCD Semiconductor Manufacturing Limited WHITE LED STEP-UP CONVERTER AP3031 Parameter Symbol Conditions Min Typ Max Unit Operating V oltage V IN 2.7 16 V Feedback V oltage (Note 2) VFB IOUT=20mA, 3 LEDs, TA=-40oC to 85oC 188 200 212 mV FB Pin Bias Current I FB 35 100 nA Quiescent Current I Q VFB=VIN, no switching 3.0 4.0 5.0 mA Shutdown Quiescent Current I SHDN VCTRL=0V 20 50 80 µA Switching Frequency f 0.75 1 1.3 MHz Maximum Duty Cycle D MAX 90 93 % Switch Current Limit (Note 3) I LIMIT D=60% 1.2 1.4 A Switch VCE Saturation V oltage V CESAT ISW=0.6A 300 mV Switch Leakage Current V SW=16V 0.01 5 µA CTRL Pin V oltage VCTRL Active high 1.8 V Active low 0.5 CTRL Pin Bias Current I CTRL 35 60 85 µA OVP V oltage V OVP 17 V Soft-start Time t SS 250 µs Standby Time t STB 0.7 ms Thermal Shutdown T OTSD 155 oC Thermal Resistance (Junction to Case) θJC 60 oC/W (VIN=5.0V , VCTRL =5.0V, TA=25oC, unless otherwise specified.)

Electrical Characteristics

Note 2: The bold type specifications of full temperature range are guaranteed by design (GBD). Note 3: The switch current limit is related to duty cycle. Please refer to Figure 15 for detail.

Figure 24. Typical Application of AP3031 (3×13 WLEDs)

Apr. 2009 Rev. 1. 3 BCD Semiconductor Manufacturing Limited WHITE LED STEP-UP CONVERTER AP3031 Mechanical Dimensions SOT-23-6 Unit: mm(inch) 2.820(0.111) 3.020(0.119) 2.650(0.104) 2.950(0.116) 1.500(0.059) 1.700(0.067) 0.950(0.037)TYP 1.800(0.071) 2.000(0.079) 0.300(0.012) 0.400(0.016) 0.700(0.028)REF 0.100(0.004) 0.200(0.008) 0.200(0.008) 0.300(0.012) 0.600(0.024) 0.000(0.000) 0.100(0.004) 1.050(0.041) 1.150(0.045) 1.050(0.041) 1.250(0.049) 123 456 Pin 1 Dot by Marking

Apr. 2009 Rev. 1. 3 BCD Semiconductor Manufacturing Limited WHITE LED STEP-UP CONVERTER AP3031 Mechanical Dimensions (Continued) TSOT-23-6 Unit: mm(inch) 2.800(0.110) 3.000(0.118) 1.500(0.059) 1.700(0.067) 2.600(0.102) 3.000(0.118) 0.950(0.037) BSC 1.900(0.075) BSC 0.700(0.028) 0.900(0.035) 0.000(0.000) 0.510(0.020) 0.370(0.015) MIN 0.100(0.004) 0.250(0.010) 0.250(0.010) BSC GAUGE PLANE R0.100(0.004) MIN Pin 1 Dot by Marking 1.000(0.039) MAX

Apr. 2009 Rev. 1. 3 BCD Semiconductor Manufacturing Limited WHITE LED STEP-UP CONVERTER AP3031 Mechanical Dimensions (Continued) SOIC-8 Unit: mm(inch) R0.150(0.006) R0.150(0.006) 1.000(0.039) 0.330(0.013) 0.510(0.020) 1.350(0.053) 1.750(0.069) 0.100(0.004) 0.300(0.012) 0.900(0.035) 0.800(0.031) 0.200(0.008) 3.800(0.150) 4.000(0.157) 20:1 D 1.270(0.050) TYP 0.190(0.007) 0.250(0.010) D 5.800(0.228) 6.200(0.244) 0.675(0.027) 0.725(0.029) 0.320(0.013) 0.450(0.017) 0.800(0.031) 4.700(0.185) 5.100(0.201) Note: Eject hole, oriented hole and mold mark is optional.

BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi- cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or other rights nor the rights of others. - Wafer Fab Shanghai SIM-BCD Semiconductor Manufacturing Limited 800, Yi Shan Road, Shanghai 200233, China Tel: +86-21-6485 1491, Fax: +86-21-5450 0008 BCD Semiconductor Manufacturing Limited MAIN SITE REGIONAL SALES OFFICE Shenzhen Office Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd. Shenzhen Office Advanced Analog Circuits (Shanghai) Corporation Shenzhen Office Room E, 5F, Noble Center, No.1006, 3rd Fuzhong Road, Futian District, Shenzhen 518026, China Tel: +86-755-8826 7951 Fax: +86-755-8826 7865 Taiwan Office BCD Semiconductor (Taiwan) Company Limited 4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei, Taiwan Tel: +886-2-2656 2808 Fax: +886-2-2656 2806 USA Office BCD Semiconductor Corporation 30920 Huntwood Ave. Hayward, CA 94544, U.S.A Tel : +1-510-324-2988 Fax: +1-510-324-2788 - IC Design Group Advanced Analog Circuits (Shanghai) Corporation 8F, Zone B, 900, Yi Shan Road, Shanghai 200233, China Tel: +86-21-6495 9539, Fax: +86-21-6485 9673 BCD Semiconductor Manufacturing Limited http://www.bcdsemi.com BCD Semiconductor Manufacturing Limited IMPORTANT NOTICE BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi- cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or other rights nor the rights of others. - Wafer Fab Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd.

800 Yi Shan Road, Shanghai 200233, China

Tel: +86-21-6485 1491, Fax: +86-21-5450 0008 MAIN SITE REGIONAL SALES OFFICE Shenzhen Office Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd., Shenzhen Office Room E, 5F, Noble Center, No.1006, 3rd Fuzhong Road, Futian District, Shenzhen, 518026, China Tel: +86-755-8826 7951 Fax: +86-755-8826 7865 Taiwan Office BCD Semiconductor (Taiwan) Company Limited 4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei, Taiwan Tel: +886-2-2656 2808 Fax: +886-2-2656 2806 USA Office BCD Semiconductor Corp. 30920 Huntwood Ave. Hayward, CA 94544, USA Tel : +1-510-324-2988 Fax: +1-510-324-2788 - Headquarters BCD Semiconductor Manufacturing Limited No. 1600, Zi Xing Road, Shanghai ZiZhu Science-based Industrial Park, 200241, China Tel: +86-21-24162266, Fax: +86-21-24162277