AP3030_09 BCDSEMI | Alldatasheet

Document overview

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Technical content

Features

  • Inherently Uniform LED Current
  • High Efficiency up to 84%
  • No Need for External Schottky Diode
  • Output Over-V oltage Protection (OVP)
  • Fixed 1.2MHz Switching Frequency
  • Uses Tiny 1mm Tall Inductor
  • Requires Only 0.22µF Output Capacitor

Applications

  • Cellular Phones
  • Digital Cameras
  • LCD modules
  • GPS Receivers
  • PDAs, Handheld Computers

Figure 1. Package Types of AP3030

Figure 2. Pin Configuration of AP3030 (Top View)

2 GND Ground

4 CTRL

WHITE LED STEP-UP CONVERTER AP3030 Oct. 2009 Rev. 1. 6 BCD Semiconductor Manufacturing Limited Data Sheet Functional Block Diagram Figure 3. Functional Block Diagram of AP3030

Ordering Information

Σ R S Q

1.2 MHz

1.25 V COMPARATOR OVP 200 mV SOFT START Package Temperature Range Part Number Marking ID Packing Type SOT-23-6 -40 to 85oC AP3030KTR-E1 EEB Tape & Reel TSOT-23-6 -40 to 85oC AP3030KTTR-E1 S9G Tape & Reel Circuit Type Package K: SOT-23-6 E1: RoHS AP3030 - TR: Tape and Reel KT: TSOT-23-6 BCD Semiconductor's products as designated with "E1" suffix in the part number are RoHS compliant.

WHITE LED STEP-UP CONVERTER AP3030 Oct. 2009 Rev. 1. 6 BCD Semiconductor Manufacturing Limited Data Sheet Parameter Symbol Value Unit Input V oltage V IN 20 V SW V oltage V SW 38 V FB V oltage V FB 20 V CTRL V oltage V CTRL 20 V Thermal Resistance (Junction to Atmosphere, No Heat Sink) R θJA 265 oC/W Operating Junction Temperature T J 150 oC Storage Temperature Range T STG -65 to 150 oC Lead Temperature (Soldering, 10sec) T LEAD 260 oC ESD (Machine Model) 250 V ESD (Human Body Model) 2000 V Note 1: Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indi- cated under "Recommended Operating Conditi ons" is not implied. Exposure to "A bsolute Maximum Ratings" for extended periods may affect device reliability. Parameter Symbol Min Max Unit Operating Temperature Range T OP -40 85 oC Input V oltage V IN 2.5 16 V CTRL V oltage V CTRL 16 V Recommended Operating Conditions Absolute Maximum Ratings (Note 1)

Oct. 2009 Rev. 1. 6 BCD Semiconductor Manufacturing Limited WHITE LED STEP-UP CONVERTER AP3030 Data Sheet (VIN=3V , VCTRL =3V, TA=25oC, unless otherwise specified.) Parameter Symbol Conditions Min Typ Max Unit Minimum Operating V oltage V IN(min) 2.5 V Maximum Operating V oltage V IN(max) 16 Feedback V oltage VFB IOUT=20mA, 4 LEDs, TA=-40oC to 85oC 188 200 212 mV FB Pin Bias Current I FB 35 100 nA Quiescent Current I Q VFB=VIN, no switching 1.5 2.5 3.2 mA Shutdown Quiescent Current I SHDN VCTRL=0V 2.0 3.2 5.0 µA Switch Frequency f 0.9 1.2 1.5 MHz Maximum Duty Cycle D MAX 90 93 % Switch Current Limit (Note 2) ILIMIT D=40% 550 mA D=80% 550 Switch VCE Saturation V oltage V CESAT ISW=250mA 360 mV Switch Leakage Current V SW=5V 0.01 5 µA CTRL Pin V oltage VCTRL High 1.8 V Low 0.05 CTRL Pin Bias Current I CTRL 40 55 72 µATA=85oC 50 TA=-40oC 75 OVP V oltage V OV 30 V Schottky Forward Drop V DROP ID=150mA 0.7 V Schottky Leakage Current VR=23V 0.1 4 µA VR=27V 150 Soft Start Time t 300 µS Thermal Resistance (Junction to Case) θJC SOT-23-6 60 oC/W TSOT-23-6 60

Electrical Characteristics

Note 2: The switch current limit is related to duty cycle. Please refer to Figure 15 for detail.

Oct. 2009 Rev. 1. 6 BCD Semiconductor Manufacturing Limited WHITE LED STEP-UP CONVERTER AP3030 Data Sheet Mechanical Dimensions SOT-23-6 Unit: mm(inch) 2.820(0.111) 3.020(0.119) 2.650(0.104) 2.950(0.116) 1.500(0.059) 1.700(0.067) 0.950(0.037)TYP 1.800(0.071) 2.000(0.079) 0.300(0.012) 0.400(0.016) 0.700(0.028)REF 0.100(0.004) 0.200(0.008) 0.200(0.008) 0.300(0.012) 0.600(0.024) 0.000(0.000) 0.100(0.004) 0.900(0.035) 1.300(0.051) 1.450(0.057) MAX 123 456 Pin 1 Dot by Marking

WHITE LED STEP-UP CONVERTER AP3030 Oct. 2009 Rev. 1. 6 BCD Semiconductor Manufacturing Limited Data Sheet Mechanical Dimensions (Continued) TSOT-23-6 Unit: mm(inch) 2.800(0.110) 3.000(0.118) 1.500(0.059) 1.700(0.067) 2.600(0.102) 3.000(0.118) 0.950(0.037) BSC 1.900(0.075) BSC 0.700(0.028) 0.900(0.035) 0.000(0.000) 0.510(0.020) 0.370(0.015) MIN 0.100(0.004) 0.250(0.010) 0.250(0.010) BSC GAUGE PLANE R0.100(0.004) MIN Pin 1 Dot by Marking 1.000(0.039) MAX

BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi- cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or other rights nor the rights of others. - Wafer Fab Shanghai SIM-BCD Semiconductor Manufacturing Limited 800, Yi Shan Road, Shanghai 200233, China Tel: +86-21-6485 1491, Fax: +86-21-5450 0008 BCD Semiconductor Manufacturing Limited MAIN SITE REGIONAL SALES OFFICE Shenzhen Office Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd. Shenzhen Office Advanced Analog Circuits (Shanghai) Corporation Shenzhen Office Room E, 5F, Noble Center, No.1006, 3rd Fuzhong Road, Futian District, Shenzhen 518026, China Tel: +86-755-8826 7951 Fax: +86-755-8826 7865 Taiwan Office BCD Semiconductor (Taiwan) Company Limited 4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei, Taiwan Tel: +886-2-2656 2808 Fax: +886-2-2656 2806 USA Office BCD Semiconductor Corporation 30920 Huntwood Ave. Hayward, CA 94544, U.S.A Tel : +1-510-324-2988 Fax: +1-510-324-2788 - IC Design Group Advanced Analog Circuits (Shanghai) Corporation 8F, Zone B, 900, Yi Shan Road, Shanghai 200233, China Tel: +86-21-6495 9539, Fax: +86-21-6485 9673 BCD Semiconductor Manufacturing Limited http://www.bcdsemi.com BCD Semiconductor Manufacturing Limited IMPORTANT NOTICE BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi- cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or other rights nor the rights of others. - Wafer Fab Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd.

800 Yi Shan Road, Shanghai 200233, China

Tel: +86-21-6485 1491, Fax: +86-21-5450 0008 MAIN SITE REGIONAL SALES OFFICE Shenzhen Office Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd., Shenzhen Office Room E, 5F, Noble Center, No.1006, 3rd Fuzhong Road, Futian District, Shenzhen, 518026, China Tel: +86-755-8826 7951 Fax: +86-755-8826 7865 Taiwan Office BCD Semiconductor (Taiwan) Company Limited 4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei, Taiwan Tel: +886-2-2656 2808 Fax: +886-2-2656 2806 USA Office BCD Semiconductor Corp. 30920 Huntwood Ave. Hayward, CA 94544, USA Tel : +1-510-324-2988 Fax: +1-510-324-2788 - Headquarters BCD Semiconductor Manufacturing Limited No. 1600, Zi Xing Road, Shanghai ZiZhu Science-based Industrial Park, 200241, China Tel: +86-21-24162266, Fax: +86-21-24162277