AP3019A BCDSEMI | Alldatasheet

Document overview

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Technical content

Features

  • Inherently Uniform LED Current
  • High Efficiency up to 84%
  • No Need for External Schottky Diode
  • Output Over-voltage Protection (OVP)
  • Fixed 1.2MHz Switching Frequency
  • Uses Tiny 1mm Tall Inductor
  • Requires Only 0.22 µF Output Capacitor

Applications

  • Cellular Phones
  • Digital Cameras
  • LCD modules
  • GPS Receivers
  • PDAs, Handheld Computers

Figure 1. Package Types of AP3019A

Figure 2. Pin Configuration of AP3019A (Top View)

2 GND Ground

4 CTRL

WHITE LED STEP-UP CONVERTER AP3019A Mar. 2010 Rev. 1.7 BCD Semiconductor Manufacturing Limited Functional Block Diagram Figure 3. Functional Block Diagram of AP3019A

Ordering Information

K : S O T - 2 3 - 6 T R : T a p e & R e e l KT: TSOT-23-6 Package Temperature Range Part Number Marking ID Packing Type SOT-23-6 -40 to 85°C AP3019AKTR-G1 GAS Tape & Reel TSOT-23-6 -40 to 85°C AP3019AKTTR-G1 L8E Tape & Reel BCD Semiconductor's Pb-free products, as designated with "G1" suffix in the part number, are RoHS compliant and green. G1: Green

WHITE LED STEP-UP CONVERTER AP3019A Mar. 2010 Rev. 1.7 BCD Semiconductor Manufacturing Limited Absolute Maximum Ratings (Note 1) Parameter Symbol Value Unit Input Voltage V IN 20 V SW Pin Voltage V SW 38 V Feedback Voltage V FB 20 V CTRL Pin Voltage V CTRL 20 V Thermal Resistance (Junction to Ambient, No Heat Sink) θJA 265 °C/W Operating Junction Temperature T J 150 °C Storage Temperature Range T STG -65 to 150 °C Lead Temperature (Soldering, 10sec) T LEAD 260 °C ESD (Machine Model) 250 V ESD (Human Body Model) 2000 V Note 1: Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “Recommended Operating Co nditions” is not implied. Exposure to “Absolute Maximum Ratings” for extended periods may affect device reliability. Recommended Operating Conditions Parameter Symbol Min Max Unit Operating Temperature Range T OP -40 85 °C Input V oltage V IN 2.5 16 V CTRL Pin V oltage V CTRL 16 V

WHITE LED STEP-UP CONVERTER AP3019A Mar. 2010 Rev. 1.7 BCD Semiconductor Manufacturing Limited

Electrical Characteristics

VIN =3V , VCTRL=3V, TA =25°C, unless otherwise specified. Parameter Symbol Conditions Min Typ Max Unit Minimum Operating Voltage V IN (min) 2.5 Maximum Operating Voltage V IN (max) 16 V Feedback Voltage (Note 2) V FB IOUT=20mA, 4 LEDs, TA=-40oC to 85oC 188 200 212 mV FB Pin Bias Current I FB 35 100 nA Quiescent Current I Q V FB=VIN, no switching 1.5 2.5 3.2 mA Shutdown Quiescent Current I SHDN V CTRL=0V 2.0 4.0 6.0 µA Switching Frequency f 0.9 1.2 1.5 MHz Maximum Duty Cycle D MAX 90 93 % D=40% 550 Switch Current Limit (Note 3) I LIMIT D=80% 550 mA Switch VCE Saturation Voltage V CESAT I SW=250mA 360 mV Switch Leakage Current V SW=5V 0.01 5 µA High 1.8 CTRL Pin Voltage V CTRL low 0.5 V CTRL Pin Bias Current I CTRL 100 µA OVP Voltage V OV 30 V Schottky Forward Drop V DROP I D=150mA 0.7 V VR(reverse voltage)=23V 0.1 4 Schottky Leakage Current VR(reverse voltage)=27V 150 µA Soft Start Time t 300 µS SOT-23-6 60 Thermal Resistance (Junction to Case) θJC TSOT-23-6 60 °C/W Note 2: The bold type specifications of full temperature range are guaranteed by design (GBD). Note 3: The switch current limit is related to duty cycle. Please refer to Figure 15 for detail.

WLED forward voltage is 3.45V at IF=20mA, unless otherwise noted. Figure 16. Saturation Voltage vs. Switch C u r r e n t F i g u r e 1 7 . C T R L P i n V o l t a g e v s .

Figure 24. Typical Application of AP3019A

WHITE LED STEP-UP CONVERTER AP3019A Mar. 2010 Rev. 1.7 BCD Semiconductor Manufacturing Limited Mechanical Dimensions SOT-23-6 Unit: mm(inch) 2.820(0.111) 3.020(0.119) 0.950(0.037)TYP 1.800(0.071) 2.000(0.079) 0.300(0.012) 0.400(0.016) 0.700(0.028)REF 0.100(0.004) 0.200(0.008) 0.200(0.008) 0.300(0.012) 0.600(0.024) 0.000(0.000) 0.100(0.004) 0.900(0.035) 1.300(0.051) 1.450(0.057) MAX 123 456 Pin 1 Dot by Marking

WHITE LED STEP-UP CONVERTER AP3019A Mar. 2010 Rev. 1.7 BCD Semiconductor Manufacturing Limited Mechanical Dimensions (Continued) TSOT-23-6 Unit: mm(inch) 2.800(0.110) 3.000(0.118) 1.500(0.059) 1.700(0.067) 2.600(0.102) 3.000(0.118) 0.950(0.037) BSC 1.900(0.075) BSC 0.700(0.028) 0.900(0.035) 0.000(0.000) 0.510(0.020) 0.370(0.015) MIN 0.100(0.004) 0.250(0.010) 0.250(0.010) BSC GAUGE PLANE R0.100(0.004) MIN Pin 1 Dot by Marking 1.000(0.039) MAX

BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi- cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or other rights nor the rights of others. - Wafer Fab Shanghai SIM-BCD Semiconductor Manufacturing Limited 800, Yi Shan Road, Shanghai 200233, China Tel: +86-21-6485 1491, Fax: +86-21-5450 0008 BCD Semiconductor Manufacturing Limited MAIN SITE REGIONAL SALES OFFICE Shenzhen Office Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd. Shenzhen Office Advanced Analog Circuits (Shanghai) Corporation Shenzhen Office Room E, 5F, Noble Center, No.1006, 3rd Fuzhong Road, Futian District, Shenzhen 518026, China Tel: +86-755-8826 7951 Fax: +86-755-8826 7865 Taiwan Office BCD Semiconductor (Taiwan) Company Limited 4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei, Taiwan Tel: +886-2-2656 2808 Fax: +886-2-2656 2806 USA Office BCD Semiconductor Corporation 30920 Huntwood Ave. Hayward, CA 94544, U.S.A Tel : +1-510-324-2988 Fax: +1-510-324-2788 - IC Design Group Advanced Analog Circuits (Shanghai) Corporation 8F, Zone B, 900, Yi Shan Road, Shanghai 200233, China Tel: +86-21-6495 9539, Fax: +86-21-6485 9673 BCD Semiconductor Manufacturing Limited http://www.bcdsemi.com BCD Semiconductor Manufacturing Limited IMPORTANT NOTICE BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi- cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or other rights nor the rights of others. - Wafer Fab Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd.

800 Yi Shan Road, Shanghai 200233, China

Tel: +86-21-6485 1491, Fax: +86-21-5450 0008 MAIN SITE REGIONAL SALES OFFICE Shenzhen Office Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd., Shenzhen Office Unit A Room 1203, Skyworth Bldg., Gaoxin Ave.1.S., Nanshan District, Shenzhen, China Tel: +86-755-8826 7951 Fax: +86-755-8826 7865 Taiwan Office BCD Semiconductor (Taiwan) Company Limited 4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei, Taiwan Tel: +886-2-2656 2808 Fax: +886-2-2656 2806 USA Office BCD Semiconductor Corp. 30920 Huntwood Ave. Hayward, CA 94544, USA Tel : +1-510-324-2988 Fax: +1-510-324-2788 - Headquarters BCD Semiconductor Manufacturing Limited No. 1600, Zi Xing Road, Shanghai ZiZhu Science-based Industrial Park, 200241, China Tel: +86-21-24162266, Fax: +86-21-24162277