AP3012 BCDSEMI | Alldatasheet

Document overview

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Technical content

Features

  • High Efficiency up to 81%
  • Adjustable Output V oltage up to 29V
  • Shutdown Current 1µA Typical
  • 1.5MHz Switching Frequency
  • 36V 500mA Rugged Integrated Bipolar Switch
  • Built-in Soft-Start to Reduce Inrush Current Dur- ing Start-up
  • On-chip Overvoltage Protection
  • Uses Low ESR Ceramic Output Capacitor
  • Uses Smll Inductor

Applications

  • LCD/OLED Display Bias Supply
  • White LED Driver for LCD Display Backlights
  • Cellular Phones

Figure 1. Package Type of AP3012

Figure 2. Pin Configuration of AP3012 (Top View)

4 SHDN

Figure 3. Functional Block Diagram of AP3012

1.5MHz STEP-UP DC-DC CONVERTER AP3012 Jul. 2006 Rev. 1. 2 BCD Semiconductor Manufacturing Limited Data Sheet BCD Semiconductor's Pb-free products, as designated with "E1" suffix in the part number, are RoHS compliant.

Ordering Information

K: SOT-23-5L E1: Lead Free AP3012 - TR: Tape and Reel Package Temperature Range Part Number Marking ID Packing Type Lead Free Lead Free SOT-23-5L -40 to 85oC AP3012KTR-E1 E6B Tape & Reel

1.5MHz STEP-UP DC-DC CONVERTER AP3012 Jul. 2006 Rev. 1. 2 BCD Semiconductor Manufacturing Limited Data Sheet Note 1: Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "Recommended Operating Conditions" is not implied. Exposure to "Absolute Max- imum Ratings" for extended periods may affect device reliability. Parameter Symbol Min Max Unit Input V oltage V IN 2.6 16 V Operating Temperature T OP -40 85 oC Recommended Operating Conditions Absolute Maximum Ratings (Note 1) Parameter Symbol Value Unit Input V oltage V IN 20 V SW V oltage 38 V FB V oltage 5V SHDN V oltage 16 V Thermal Resistance (Junction to Atmosphere, no Heat sink) R θJA 265 oC/W Operating Junction Temperature 150 oC Storage Temperature Range T STG -65 to 150 oC Lead Temperature (Soldering, 10sec) T LEAD 260 oC ESD (Machine Model) 250 V ESD (Human Body Model) 2000 V

1.5MHz STEP-UP DC-DC CONVERTER AP3012 Jul. 2006 Rev. 1. 2 BCD Semiconductor Manufacturing Limited Data Sheet (VIN=3V , VSHDN=3V, TA=25oC, unless otherwise specified.) Parameter Symbol Conditions Min Typ Max Unit Minimum Operating V olt- age 2.6 V Maximum Operating V olt- age 16 V Feedback V oltage V FB VIN=5V , VOUT=24V , IOUT=30mA 1.17 1.25 1.33 V FB Pin Bias Current V FB=1.25V 10 45 100 nA Supply Current I CC VSHDN =VFB=VIN, No switching 2.5 3.5 mA Supply Current I Q VSHDN =0V , VFB=0V 0.1 1.0 µA Switching Frequency f 1.1 1.5 1.9 MHz Maximum Duty Cycle D MAX 85 90 % Switching Current Limit Duty Cycle=80% 500 mA Switch VCESAT V CESAT ISW=250mA 300 mV Switch Leakage Current V SW=5V 0.01 5 µA SHDN V oltage High (ON) V TH 1.5 VSHDN Vo l t a g e L o w ( O F F ) VTL 0.4 SHDN Pin Bias Current 55 µA OVP V oltage Threshold V OVP 29 V Soft-Start Time 550 µS

Electrical Characteristics

Figure 12. LCD/OLED Display Bias Driver Typical Circuit

1.5MHz STEP-UP DC-DC CONVERTER AP3012 Jul. 2006 Rev. 1. 2 BCD Semiconductor Manufacturing Limited Data Sheet SOT-23-5L Unit: mm(inch) Mechanical Dimensions 2.820(0.111) 2.650(0.104) 1.500(0.059) 0.000(0.000) 1.050(0.041) 0.300(0.012) 0.950(0.037) 1.050(0.041) 0.100(0.004) 0.200(0.008) 0.300(0.012) 3.020(0.119) 1.700(0.067) 2.950(0.116) 0.400(0.016) 1.250(0.049) 0.100(0.004) 1.150(0.045) 0.200(0.008) 0.600(0.024) 1.800(0.071) 2.000(0.079) 0.700(0.028) REF TYP

BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi- cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or other rights nor the rights of others. - Wafer Fab Shanghai SIM-BCD Semiconductor Manufacturing Limited 800, Yi Shan Road, Shanghai 200233, China Tel: +86-21-6485 1491, Fax: +86-21-5450 0008 BCD Semiconductor Manufacturing Limited MAIN SITE REGIONAL SALES OFFICE Shenzhen Office Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd. Shenzhen Office Advanced Analog Circuits (Shanghai) Corporation Shenzhen Office 27B, Tower C, 2070, Middle Shen Nan Road, Shenzhen 518031, China Tel: +86-755-8368 3987, Fax: +86-755-8368 3166 Taiwan Office BCD Semiconductor (Taiwan) Company Limited 4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei, Taiwan Tel: +886-2-2656 2808, Fax: +886-2-2656 2806 USA Office BCD Semiconductor Corporation 3170 De La Cruz Blvd., Suite 105, Santa Clara, CA 95054-2411, U.S.A Tel: +1-408-988 6388, Fax: +1-408-988 6386 - IC Design Group Advanced Analog Circuits (Shanghai) Corporation 8F, Zone B, 900, Yi Shan Road, Shanghai 200233, China Tel: +86-21-6495 9539, Fax: +86-21-6485 9673 BCD Semiconductor Manufacturing Limited http://www.bcdsemi.com