AP2822 BCDSEMI | Alldatasheet

Document overview

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Technical content

Features

  • Low MOSFET On Resistance: 85mΩ
  • Compliant to USB Specifications
  • Available 4 Versions of Continuous Load:
  • Logic Level Enable Pin: Available with Active-high or Active-low Version
  • Operating Voltage Range: 2.7V to 5.5V
  • Low Supply Current: 68µA (Typ.)
  • Low Shutdown Current: 1.0µA (Max)
  • Under-voltage Lockout
  • Soft Start-up
  • Over-current Protection
  • Over Temperature Protection
  • Load Short Protection with Fold-back
  • No Reverse Current When Power Off
  • Deglitched FLAG Output with Open Drain
  • With Output Shutdown Pull-low Resistor

Figure 1. Package Type of AP2822

Figure 2. Pin Configuration of AP2822 (Top View)

P r e l i m i n a r y D a t a s h e e t 0.5A to 2.0A High-side Power Distribution Switches AP2822 Dec. 2012 Rev 1. 1 BCD Semiconductor Manufacturing Limited Pin Descriptions Pin Number Pin Name Function 1(K) FLAG Fault flag pin, output with open drain, need a pull-up resistor in application, active low to indicate OCP or OTP 3(KA/KE)

2 GND Ground

3(K) EN Chip enable control input, active low or high 1(KA) 4(KB/KE) 4(K/KA) VIN Supply input pin 3(KB) 5(KE) 5(K/KA) VOUT Switch output voltage 1,5(KB) 1(KE)

Figure 3. Functional Block Diagram of AP2822

P r e l i m i n a r y D a t a s h e e t 0.5A to 2.0A High-side Power Distribution Switches AP2822 Dec. 2012 Rev 1. 1 BCD Semiconductor Manufacturing Limited

Ordering Information

Range Condition Part Number Marking ID Packing Type SOT-23-5 -40 to 85°C Active High (Continuous 0.5A) AP2822AKTR-G1 GCQ Tape & Reel Active Low (Continuous 0.5A) AP2822BKTR-G1 GCR Tape & Reel Active High (Continuous 1.0A) AP2822CKTR-G1 GCS Tape & Reel Active Low (Continuous 1.0A) AP2822DKTR-G1 GCT Tape & Reel Active High (Continuous 1.5A) AP2822EKTR-G1 GCU Tape & Reel Active Low (Continuous 1.5A) AP2822FKTR-G1 GCV Tape & Reel Active High (Continuous 2.0A) AP2822GKTR-G1 GCW Tape & Reel Active Low (Continuous 2.0A) AP2822HKTR-G1 GCZ Tape & Reel Package K/KA/KB/KE: SOT-23-5 Condition A: Active High (Continuous 0.5A) B: Active Low (Continuous 0.5A) C: Active High (Continuous 1.0A) D: Active Low (Continuous 1.0A) E: Active High (Continuous 1.5A) F: Active Low (Continuous 1.5A) G: Active High (Continuous 2.0A) H: Active Low (Continuous 2.0A) G1: Green TR: Tape & Reel

P r e l i m i n a r y D a t a s h e e t 0.5A to 2.0A High-side Power Distribution Switches AP2822 Dec. 2012 Rev 1. 1 BCD Semiconductor Manufacturing Limited Ordering Information (Continued) Package Temperature Range Condition Part Number Marking ID Packing Type SOT-23-5 -40 to 85°C Active High (Continuous 0.5A) AP2822AKATR-G1 GDQ Tape & Reel Active Low (Continuous 0.5A) AP2822BKATR-G1 GDR Tape & Reel Active High (Continuous 1.0A) AP2822CKATR-G1 GDS Tape & Reel Active Low (Continuous 1.0A) AP2822DKATR-G1 GDT Tape & Reel Active High (Continuous 1.5A) AP2822EKATR-G1 GDU Tape & Reel Active Low (Continuous 1.5A) AP2822FKATR-G1 GDV Tape & Reel Active High (Continuous 2.0A) AP2822GKATR-G1 GDW Tape & Reel Active Low (Continuous 2.0A) AP2822HKATR-G1 GDZ Tape & Reel SOT-23-5 -40 to 85°C Active High (Continuous 0.5A) AP2822AKBTR-G1 GLA Tape & Reel Active Low (Continuous 0.5A) AP2822BKBTR-G1 GLB Tape & Reel Active High (Continuous 1.0A) AP2822CKBTR-G1 GLC Tape & Reel Active Low (Continuous 1.0A) AP2822DKBTR-G1 GLD Tape & Reel Active High (Continuous 1.5A) AP2822EKBTR-G1 GLE Tape & Reel Active Low (Continuous 1.5A) AP2822FKBTR-G1 GLF Tape & Reel Active High (Continuous 2.0A) AP2822GKBTR-G1 GLG Tape & Reel Active Low (Continuous 2.0A) AP2822HKBTR-G1 GLH Tape & Reel

P r e l i m i n a r y D a t a s h e e t 0.5A to 2.0A High-side Power Distribution Switches AP2822 Dec. 2012 Rev 1. 1 BCD Semiconductor Manufacturing Limited Ordering Information (Continued) Package Temperature Range Condition Part Number Marking ID Packing Type SOT-23-5 -40 to 85°C Active High (Continuous 0.5A) AP2822AKETR-G1 GLI Tape & Reel Active Low (Continuous 0.5A) AP2822BKETR-G1 GLJ Tape & Reel Active High (Continuous 1.0A) AP2822CKETR-G1 GLK Tape & Reel Active Low (Continuous 1.0A) AP2822DKETR-G1 GLL Tape & Reel Active High (Continuous 1.5A) AP2822EKETR-G1 GLM Tape & Reel Active Low (Continuous 1.5A) AP2822FKETR-G1 GLN Tape & Reel Active High (Continuous 2.0A) AP2822GKETR-G1 GLO Tape & Reel Active Low (Continuous 2.0A) AP2822HKETR-G1 GLP Tape & Reel BCD Semiconductor's Pb-free products, as designated with "G1" suffix in the part number, are RoHS compliant and green.

P r e l i m i n a r y D a t a s h e e t 0.5A to 2.0A High-side Power Distribution Switches AP2822 Dec. 2012 Rev 1. 1 BCD Semiconductor Manufacturing Limited Absolute Maximum Ratings (Note 1) Parameter Symbol Value Unit Power Supply Voltage V IN 6.0 V Operating Junction Temperature Range TJ 150 ºC Storage Temperature Range T STG -65 to 150 ºC Lead Temperature (Soldering, 10sec) T LEAD 260 ºC Thermal Resistance (Junction to Ambient) θJA TBD oC/W ESD (Machine Model) 200 V ESD (Human Body Model) 2000 V Note 1: Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional op eration of the device at these or any other conditions beyond those indicated under “Recommended Operating Co nditions” is not implied. Exposure to “Absolute Maximum Ratings” for extended periods may affect device reliability. Recommended Operating Conditions Parameter Symbol Min Max Unit Supply Voltage V IN 2.7 5.5 V Operating Ambient Temperature Range TA -40 85 °C

P r e l i m i n a r y D a t a s h e e t 0.5A to 2.0A High-side Power Distribution Switches AP2822 Dec. 2012 Rev 1. 1 BCD Semiconductor Manufacturing Limited

Electrical Characteristics

(VIN=5.0V , CIN=2.2µF, COUT=1.0µF, Typical TA=25°C, unless otherwise specified) Parameter Symbol Condition Min Typ Max Unit Supply V oltage V IN 2.7 5.5 V Switch On Resistance R DS(ON) V IN=5.0V , IOUT=2.0A 85 110 m Ω Current Limit I LIMIT A Supply Current I SUPPL Y V IN=5.0V , No Load 68 95 µA Fold-back Short Current I SHORT AP2822 A/B/C/D, VOUT=0V 0.7 A AP2822 E/F/G/H, VOUT=0V 1.1 Shutdown Supply Current I SHUTDOWN Chip Disable, Shutdown Mode 0.1 1.0 µA Enable High Input Threshold V ENH 1.6 5.5 V Enable Low Input Threshold V ENL 0 1.0 V Enable Pin Input Current I EN Force 0V to 5.0V at EN Pin -1.0 1.0 µA Under V oltage Lockou t Threshold V oltage VUVLO V IN Increasing from 0V 2.2 2.5 3.0 V Under V oltage Hysteresis V UVLOHY 0.2 V Reverse Current I REVERSE Chip Disable, V OUT>VIN 0.1 1.0 µA Output Pull Low Resistance after Shutdown RDISCHARGE 100 200 Ω Output Turn-on Time t ON From Enable Active to 90% o f Output 500 µs FLAG Pin Delay Time t DFLG From Over Current Fault Condition to Flag Active 5 10 15 ms FLAG Pin Low V oltage V FLG I SINK=5.0mA 35 70 mV FLAG Pin Leakage Current I LEAKAGE FLAG Disable, Force 5.0V 1.0 µA Thermal Shutdown Temperature TOTSD 150 oC Thermal Shutdown Hysteresis T HYOTSD 30

Figure 4. Supply Current vs. Ambient Temperature Figure 5. Supply Current vs. Supply Voltage Figure 6. RDS(ON) vs. Ambient Temperature Figure 7. R DS(ON) vs. Supply Voltage

100 Supply Current (μA)

Note 2: 2.2µF input capacitor is enough in most application cases. Figure 31. Typical Application of AP2822

P r e l i m i n a r y D a t a s h e e t 0.5A to 2.0A High-side Power Distribution Switches AP2822 Dec. 2012 Rev 1. 1 BCD Semiconductor Manufacturing Limited Mechanical Dimensions SOT-23-5 Unit: mm(inch) 2.820(0.111) 0.000(0.000) 0.300(0.012) 0.950(0.037) 0.900(0.035) 0.100(0.004) 0.200(0.008) 3.020(0.119) 0.400(0.016) 0.150(0.006) 1.300(0.051) 0.200(0.008) 1.800(0.071) 2.000(0.079) 0.700(0.028) REF TYP

BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi- cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or other rights nor the rights of others. - Wafer Fab Shanghai SIM-BCD Semiconductor Manufacturing Limited 800, Yi Shan Road, Shanghai 200233, China Tel: +86-21-6485 1491, Fax: +86-21-5450 0008 BCD Semiconductor Manufacturing Limited MAIN SITE REGIONAL SALES OFFICE Shenzhen Office Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd. Shenzhen Office Advanced Analog Circuits (Shanghai) Corporation Shenzhen Office Room E, 5F, Noble Center, No.1006, 3rd Fuzhong Road, Futian District, Shenzhen 518026, China Tel: +86-755-8826 7951 Fax: +86-755-8826 7865 Taiwan Office BCD Semiconductor (Taiwan) Company Limited 4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei, Taiwan Tel: +886-2-2656 2808 Fax: +886-2-2656 2806 USA Office BCD Semiconductor Corporation 30920 Huntwood Ave. Hayward, CA 94544, U.S.A Tel : +1-510-324-2988 Fax: +1-510-324-2788 - IC Design Group Advanced Analog Circuits (Shanghai) Corporation 8F, Zone B, 900, Yi Shan Road, Shanghai 200233, China Tel: +86-21-6495 9539, Fax: +86-21-6485 9673 BCD Semiconductor Manufacturing Limited http://www.bcdsemi.com BCD Semiconductor Manufacturing Limited IMPORTANT NOTICE BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi- cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or other rights nor the rights of others. - Wafer Fab Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd.

800 Yi Shan Road, Shanghai 200233, China

Tel: +86-21-6485 1491, Fax: +86-21-5450 0008 MAIN SITE REGIONAL SALES OFFICE Shenzhen Office Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd., Shenzhen Office Unit A Room 1203, Skyworth Bldg., Gaoxin Ave.1.S., Nanshan District, Shenzhen, China Tel: +86-755-8826 7951 Fax: +86-755-8826 7865 Taiwan Office BCD Semiconductor (Taiwan) Company Limited 4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei, Taiwan Tel: +886-2-2656 2808 Fax: +886-2-2656 2806 USA Office BCD Semiconductor Corp. 30920 Huntwood Ave. Hayward, CA 94544, USA Tel : +1-510-324-2988 Fax: +1-510-324-2788 - Headquarters BCD Semiconductor Manufacturing Limited No. 1600, Zi Xing Road, Shanghai ZiZhu Science-based Industrial Park, 200241, China Tel: +86-21-24162266, Fax: +86-21-24162277