AP2821 BCDSEMI | Alldatasheet

Document overview

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Technical content

Features

  • Low MOSFET on Resistance: 120mΩ @VIN=5.0V
  • Compliant to USB Specifications
  • Operating Voltage Range: 2.7V to 5.5V
  • Low Supply Current: 35μA (Typ.)
  • Low Shutdown Current: <1μA
  • Current Limit with Fold-back: 2A
  • Under-voltage Lockout
  • Soft Start-up
  • Over-current Protection
  • Over Temperature Protection
  • Load Short Protection with Fold-back
  • No Reverse Current when Power off
  • Pass System ESD: IEC61000-4-2 ± 16KV (Air Discharge) and ± 8KV (Contact Discharge) on USB Connector

Applications

  • USB Power Management
  • USB Bus/Self Powered Hubs
  • Hot-plug Power Supplies
  • Battery-charger Circuits
  • Notebooks, Motherboard PCs

Figure 1. Package Type of AP2821

Figure 2. Pin Configuration of AP2821 (Top View)

1 VOUT Switch Output V oltage

2 GND Ground

3 EN Chip Enable Control Input, Active High

Figure 3. Functional Block Diagram of AP2821

High-side Power Distribution Switch with Enable AP2821 Mar. 2013 Rev 2. 0 BCD Semiconductor Manufacturing Limited

Ordering Information

Range Part Number Marking ID Packing Type SOT-23-5 -40 to 85°C AP2821KTR-G1 G4E Tape & Reel BCD Semiconductor's Pb-free products, as designated with "G1" suffix in the part number, are RoHS compliant and Green. TR: Tape & Reel Package K: SOT-23-5 G1: Green

High-side Power Distribution Switch with Enable AP2821 Mar. 2013 Rev 2. 0 BCD Semiconductor Manufacturing Limited Absolute Maximum Ratings (Note 1) Parameter Symbol Value Unit Power Supply Voltage V IN 6.0 V Operating Junction Temperature Range TJ 150 ºC Storage Temperature Range T STG -65 to 150 ºC Lead Temperature (Soldering,10 Seconds) TLEAD 260 ºC Thermal Resistance (Junction to Ambient) θJA 235 ºC/W ESD (Machine Model) 200 V ESD (Human Body Model) 2000 V Note 1: Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional op eration of the device at these or any other conditions beyond those indicated under “Recommended Operating Co nditions” is not implied. Exposure to “Absolute Maximum Ratings” for extended periods may affect device reliability. Recommended Operating Conditions Parameter Symbol Min Max Unit Supply Voltage V IN 2.7 5.5 V Ambient Operation Temperature Range TA -40 85 °C

High-side Power Distribution Switch with Enable AP2821 Mar. 2013 Rev 2. 0 BCD Semiconductor Manufacturing Limited

Electrical Characteristics

(VIN=5.0V , CIN=4.7μF, COUT=4.7μF, Typical TA=25°C, unless otherwise specified) Parameter Symbol Test Conditions Min Typ Max Unit Input V oltage Range V IN 2.7 5.5 V Switch On Resistance R DS(ON) V IN=5V , IOUT=0.5A 120 140 m Ω Current Limit I LIMIT V OUT=4.0V 1.5 2.0 2.8 A Supply Current I SUPPL Y V IN=5V , RLOAD Open 35 65 μA Fold-back Short Current I SHORT V OUT=0V 1.5 A Shutdown Supply Current I SHUTDOWN V EN=0V , Shutdown Mode 0.1 1 μA Output Leakage Current I LEAKAGE V EN=0V , VOUT=0V 0.1 1 μA Enable High V oltage V ENH Enable Logic High 2.0 6.0 V Enable Low V oltage V ENL Enable Logic Low 0 1.2 V Enable Pin Input Current I EN Force 0V to 5.0V at EN Pin 0 1.0 μA Under V oltage Lockou t Threshold V oltage VUVLO V IN Increasing from 0V 2.2 2.5 2.7 V Under V oltage Hysteresis V UVLOHY 0.2 V Reverse Current I REVERSE V EN=0V , VOUT>VIN 0.1 1.0 μA Shutdown Pull Low Resistance R DISCHARGE V EN is disable 100 250 Ω Output Turn-on Time t ON From Enable Active to 90% o f Output, RL=10Ω 1.9 ms Thermal Shutdown Temperature TOTSD 145 oC Thermal Shutdown Hysteresis T HYOTSD 20 Thermal Resistance (Junction to Case) θJC 70 ºC/W

Figure 28. Short-circuit Current, Figure 29. Thermal Shutdown Response

Note 2: 4.7μF input capacitor is enough in most application cases. If the PCB trace of power rail to VIN is long, larger input capacitor is necessary. Figure 30. AP2821 Typical Application

High-side Power Distribution Switch with Enable AP2821 Mar. 2013 Rev 2. 0 BCD Semiconductor Manufacturing Limited Mechanical Dimensions SOT-23-5 Unit: mm(inch) 2.820(0.111) 2.650(0.104) 1.500(0.059) 0.000(0.000) 0.300(0.012) 0.950(0.037) 0.900(0.035) 0.100(0.004) 0.200(0.008) 0.300(0.012) 3.100(0.122) 1.700(0.067) 3.000(0.118) 0.500(0.020) 0.150(0.006) 1.300(0.051) 0.200(0.008) 0.600(0.024) 1.800(0.071) 2.000(0.079) 0.700(0.028) REF TYP 1.450(0.057) M AX

High-side Power Distribution Switch with Enable AP2821 Mar. 2013 Rev 2. 0 BCD Semiconductor Manufacturing Limited Mounting Pad Layout SOT-23-5 Y X G Z Dimensions Z (mm)/(inch) G (mm)/(inch) X (mm)/(inch) Y (mm)/(inch) (mm)/(inch) (mm)/(inch)

BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi- cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or other rights nor the rights of others. - Wafer Fab Shanghai SIM-BCD Semiconductor Manufacturing Limited 800, Yi Shan Road, Shanghai 200233, China Tel: +86-21-6485 1491, Fax: +86-21-5450 0008 BCD Semiconductor Manufacturing Limited MAIN SITE REGIONAL SALES OFFICE Shenzhen Office Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd. Shenzhen Office Advanced Analog Circuits (Shanghai) Corporation Shenzhen Office Room E, 5F, Noble Center, No.1006, 3rd Fuzhong Road, Futian District, Shenzhen 518026, China Tel: +86-755-8826 7951 Fax: +86-755-8826 7865 Taiwan Office BCD Semiconductor (Taiwan) Company Limited 4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei, Taiwan Tel: +886-2-2656 2808 Fax: +886-2-2656 2806 USA Office BCD Semiconductor Corporation 30920 Huntwood Ave. Hayward, CA 94544, U.S.A Tel : +1-510-324-2988 Fax: +1-510-324-2788 - IC Design Group Advanced Analog Circuits (Shanghai) Corporation 8F, Zone B, 900, Yi Shan Road, Shanghai 200233, China Tel: +86-21-6495 9539, Fax: +86-21-6485 9673 BCD Semiconductor Manufacturing Limited http://www.bcdsemi.com BCD Semiconductor Manufacturing Limited IMPORTANT NOTICE BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi- cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or other rights nor the rights of others. - Wafer Fab Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd.

800 Yi Shan Road, Shanghai 200233, China

Tel: +86-21-6485 1491, Fax: +86-21-5450 0008 MAIN SITE REGIONAL SALES OFFICE Shenzhen Office Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd., Shenzhen Office Unit A Room 1203, Skyworth Bldg., Gaoxin Ave.1.S., Nanshan District, Shenzhen, China Tel: +86-755-8826 7951 Fax: +86-755-8826 7865 Taiwan Office BCD Semiconductor (Taiwan) Company Limited 4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei, Taiwan Tel: +886-2-2656 2808 Fax: +886-2-2656 2806 USA Office BCD Semiconductor Corp. 30920 Huntwood Ave. Hayward, CA 94544, USA Tel : +1-510-324-2988 Fax: +1-510-324-2788 - Headquarters BCD Semiconductor Manufacturing Limited No. 1600, Zi Xing Road, Shanghai ZiZhu Science-based Industrial Park, 200241, China Tel: +86-21-24162266, Fax: +86-21-24162277 IMPORTANT NOTICE BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi- cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or other rights nor the rights of others. - Wafer Fab Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd.

800 Yishan Road, Shanghai 200233, China

Tel: +021-6485-1491, Fax: +86-021-5450-0008 MAIN SITE REGIONAL SALES OFFICE Shenzhen Office Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd., Shenzhen Office Unit A Room 1203,Skyworth Bldg., Gaoxin Ave.1.S., Nanshan District Shenzhen 518057, China Tel: +86-0755-8660-4900, Fax: +86-0755-8660-4958 Taiwan Office (Taipei) BCD Semiconductor (Taiwan) Company Limited Tel: +886-2-2656 2808 Fax: +886-2-2656-2806/26562950 Taiwan Office (Hsinchu) BCD Semiconductor (Taiwan) Company Limited 8F, No.176, Sec. 2, Gong-Dao 5th Road, East District HsinChu City 300, Taiwan, R.O.C Tel: +886-3-5160181, Fax: +886-3-5160181 - Headquarters BCD (Shanghai) Micro-electronics Limited No. 1600, Zi Xing Road, Shanghai ZiZhu Science-based Industrial Park, 200241, P. R.C. Tel: +86-021-2416-2266, Fax: +86-021-2416-2277 USA Office BCD Semiconductor Corp.

48460 Kato Road, Fremont, CA 94538, USA

Tel: +1-510-668-1950 Fax: +1-510-668-1990 Korea Office BCD Semiconductor Limited Korea office. Room 101-1112, Digital-Empire II, 486 Sin-dong, Yeongtong-Gu, Suwon-city, Gyeonggi-do, Korea Tel: +82-31-695-8430