AP2815 BCDSEMI | Alldatasheet

Document overview

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Technical content

Features

  • Low MOSFET on Resistance: 60mΩ @ VIN=5.0V
  • Compliant to USB Specifications
  • Operating Voltage Range: 2.7V to 5.5V
  • Low Supply Current: 65µA (Typ.)
  • Low Shutdown Current: 1.0µA (Max)
  • Guarantee 1.5A Continuous Load
  • Current Limit: 1.65A (Min), 2.8A (Max)
  • Under-voltage Lockout
  • Logic Level Enable Pin: eAvailable in Active-high or Active-low Version
  • Soft Start-up
  • Over-current Protection
  • Over Temperature Protection
  • Load Short Protection with Fold-back
  • No Reverse Current when Power Off
  • Deglitched FLAG Output with Open Drain
  • eWith Output Shutdown Pull-low Resistor for eA/C Versions
  • UL Approved (File No. E339337)
  • Nemko CB Scheme IEC60950-1, Ref. Certif No. NO64001

Applications

  • USB Power Management
  • USB Bus/Self Powered Hubs
  • Hot-plug Power Supplies
  • Battery-Charger circuits
  • Notebook, Motherboard PCs

Figure 1. Package Types of AP2815

Figure 2. Pin Configuration of AP2815 (Top View)

1 GND Ground

application, active low to indicate OCP or OTP.

Figure 3. Functional Block Diagram of AP2815

1.5A High-side Power Distribution Switch with Enable and Flag AP2815 Apr. 2012 Rev 1. 7 BCD Semiconductor Manufacturing Limited

Ordering Information

Product Package Temperature Range Condition Part Number Marking ID Packing Type AP2815AM-G1 2815AM-G1 Tube SOIC-8 AP2815AMTR-G1 2815AM-G1 Tape & Reel AP2815AMM-G1 2815AMM-G1 Tube AP2815A MSOP-8 -40 to 85°C Active High with Auto Discharge AP2815AMMTR-G1 2815AMM-G1 Tape & Reel AP2815BM-G1 2815BM-G1 Tube SOIC-8 AP2815BMTR-G1 2815BM-G1 Tape & Reel AP2815BMM-G1 2815BMM-G1 Tube AP2815B MSOP-8 -40 to 85°C Active High without Auto Discharge AP2815BMMTR-G1 2815BMM-G1 Tape & Reel AP2815CM-G1 2815CM-G1 Tube SOIC-8 AP2815CMTR-G1 2815CM-G1 Tape & Reel AP2815CMM-G1 2815CMM-G1 Tube AP2815C MSOP-8 -40 to 85°C Active Low with Auto Discharge AP2815CMMTR-G1 2815CMM-G1 Tape & Reel AP2815DM-G1 2815DM-G1 Tube SOIC-8 AP2815DMTR-G1 2815DM-G1 Tape & Reel AP2815DMM-G1 2815DMM-G1 Tube AP2815D MSOP-8 -40 to 85°C Active Low without Auto Discharge AP2815DMMTR-G1 2815DMM-G1 Tape & Reel BCD Semiconductor's Pb-free products, as designated with "G1" suffix in the part number, are RoHS compliant and Green. G1: Green TR: Tape & Reel Blank: Tube Package M: SOIC-8 MM: MSOP-8 Condition A: Active High with Auto Discharge B: Active High without Auto Discharge C: Active Low with Auto Discharge D: Active Low without Auto Discharge

1.5A High-side Power Distribution Switch with Enable and Flag AP2815 Apr. 2012 Rev 1. 7 BCD Semiconductor Manufacturing Limited Absolute Maximum Ratings (Note 1) Parameter Symbol Value Unit Power Supply Voltage V IN 6.0 V Operating Junction Temperature Range TJ 150 ºC Storage Temperature Range T STG -65 to 150 ºC Lead Temperature (Soldering, 10sec) T LEAD 260 ºC SOIC-8 135 Thermal Resistance (Junction to Ambient) θJA MSOP-8 150 ºC/W ESD (Machine Model) 200 V ESD (Human Body Model) 2000 V Note 1: Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “Recommended Operating Co nditions” is not implied. Exposure to “Absolute Maximum Ratings” for extended periods may affect device reliability. Recommended Operating Conditions Parameter Symbol Min Max Unit Supply Voltage V IN 2.7 5.5 V Operating Ambient Temperature Range TA -40 85 °C

1.5A High-side Power Distribution Switch with Enable and Flag AP2815 Apr. 2012 Rev 1. 7 BCD Semiconductor Manufacturing Limited

Electrical Characteristics

(VIN=5.0V , CIN=2.2µF, COUT=1.0µF, Typical TA = 25°C, Bold typeface applies over -40°C≤TA≤85°C ranges, unless otherwise specified) Parameter Symbol Test Conditions Min Typ Max Unit Input V oltage Range V IN 2.7 5.5 V Switch On Resistance R DS(ON) V IN=5V , IOUT=1.5A 60 80 mΩ Current Limit I LIMIT V OUT=4.0V 1.65 2.2 2.8 A Supply Current I SUPPL Y V IN=5V , RLOAD Open 65 85 µA Fold-back Short Current I SHORT V OUT=0 1.12 A Shutdown Supply Current I SHUTDOWN Chip Disable, Shutdown Mode 0.1 1 µA Enable High Input Threshold V ENH 1.6 5.5 V Enable Low Input Threshold V ENL 0 1.0 V Enable pin Input Current I EN Force 0 to 5.0V at EN Pin -1.0 1.0 µA Under V oltage Lockout threshold voltage VUVLO V IN Increasing from 0V 2.2 2.5 2.7 V Under V oltage Hysteresis V UVLOHY 0.2 V Reverse Current I REVERSE Chip Disable, V OUT->VIN 0.1 1.0 µA Output Pull Low Resistance after Shutdown RDISCHARGE AP2815A, AP2815C only 13 50 Ω Output Turn-on Time t ON From Enable Active to 90% o f output 500 µs FLAG PinDelay Time t DFLG From Over Current Fault Condition to FLAG Active 5 10 15 ms FLAG Pin Low V oltage V FLG I SINK=5mA 35 70 mV FLAG Pin Leakage I LEAKAGE FLAG Disable, Force 5.0V 1.0 µA Thermal Shutdown Temperature TOTSD 150 Thermal Shutdown Hysteresis T HYOTSD 30 oC

Figure 24. Output Turn Off and Fall Time

Note 2：2.2µF input capacitor is enough in most application cases. If the VOUT is short to ground frequently during usage, large size input capacitor is necessary, recommend 22µF. Figure 25. Typical Application of AP2815

1.5A High-side Power Distribution Switch with Enable and Flag AP2815 Apr. 2012 Rev 1. 7 BCD Semiconductor Manufacturing Limited Mechanical Dimensions S O I C - 8 U n i t : m m ( i n c h ) R0.150(0.006)

1.5A High-side Power Distribution Switch with Enable and Flag AP2815 Apr. 2012 Rev 1. 7 BCD Semiconductor Manufacturing Limited Mechanical Dimensions (Continued) M S O P - 8 U n i t : m m ( i n c h ) 4.700(0.185) 5.100(0.201) 0.410(0.016) 0.650(0.026) 0.000(0.000) 0.200(0.008) 3.100(0.122) 2.900(0.114)

BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi- cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or other rights nor the rights of others. - Wafer Fab Shanghai SIM-BCD Semiconductor Manufacturing Limited 800, Yi Shan Road, Shanghai 200233, China Tel: +86-21-6485 1491, Fax: +86-21-5450 0008 BCD Semiconductor Manufacturing Limited MAIN SITE REGIONAL SALES OFFICE Shenzhen Office Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd. Shenzhen Office Advanced Analog Circuits (Shanghai) Corporation Shenzhen Office Room E, 5F, Noble Center, No.1006, 3rd Fuzhong Road, Futian District, Shenzhen 518026, China Tel: +86-755-8826 7951 Fax: +86-755-8826 7865 Taiwan Office BCD Semiconductor (Taiwan) Company Limited 4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei, Taiwan Tel: +886-2-2656 2808 Fax: +886-2-2656 2806 USA Office BCD Semiconductor Corporation 30920 Huntwood Ave. Hayward, CA 94544, U.S.A Tel : +1-510-324-2988 Fax: +1-510-324-2788 - IC Design Group Advanced Analog Circuits (Shanghai) Corporation 8F, Zone B, 900, Yi Shan Road, Shanghai 200233, China Tel: +86-21-6495 9539, Fax: +86-21-6485 9673 BCD Semiconductor Manufacturing Limited http://www.bcdsemi.com BCD Semiconductor Manufacturing Limited IMPORTANT NOTICE BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi- cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or other rights nor the rights of others. - Wafer Fab Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd.

800 Yi Shan Road, Shanghai 200233, China

Tel: +86-21-6485 1491, Fax: +86-21-5450 0008 MAIN SITE REGIONAL SALES OFFICE Shenzhen Office Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd., Shenzhen Office Unit A Room 1203, Skyworth Bldg., Gaoxin Ave.1.S., Nanshan District, Shenzhen, China Tel: +86-755-8826 7951 Fax: +86-755-8826 7865 Taiwan Office BCD Semiconductor (Taiwan) Company Limited 4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei, Taiwan Tel: +886-2-2656 2808 Fax: +886-2-2656 2806 USA Office BCD Semiconductor Corp. 30920 Huntwood Ave. Hayward, CA 94544, USA Tel : +1-510-324-2988 Fax: +1-510-324-2788 - Headquarters BCD Semiconductor Manufacturing Limited No. 1600, Zi Xing Road, Shanghai ZiZhu Science-based Industrial Park, 200241, China Tel: +86-21-24162266, Fax: +86-21-24162277