AP2602 BCDSEMI | Alldatasheet

Document overview

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Technical content

Features

  • 8 Remote Temperature Switches Set by Thermistor and External Resistors
  • 4 Open-drain Active Low Output Stages for Each 2 Temperature Switches
  • Selectable External/Internal Trigger V oltages Setting
  • Built-in Hysteresis Temperature when Using Internal Setting Trigger V oltage
  • Guaranteed Output Signal Valid to V CC=0.8V
  • QFN-3X3-16 Package

Applications

  • µP Temperature Monitoring High-speed Computers
  • Temperature Control
  • Temperature Alarms
  • Fan Control
  • Automotives

Figure 1. Package Type of AP2602

Note 1: Recommend connecting the thermal pad to GND for excellent power dissipation. Figure 2. Pin Configuration of AP2602 (Top View)

1 VTRIG Input of external setting trigger voltage

2 VCC Power-supply input

3 GND Ground

4 SEL Connect SEL to GND to select external trigger voltage, while connecting

Figure 3. Functional Block Diagram of AP2602

P r e l i m i n a r y D a t a s h e e t Octave Remote Resistor-programmable Temperature Switches AP2602 Feb. 2012 Rev. 1. 0 BCD Semiconductor Manufacturing Limited

Ordering Information

C i r c u i t T y p e G 1 : G r e e n P a c k a g e TR: Tape & Reel F N : Q F N - 3 X 3 - 1 6 Package Temperature Range Part Number Marking ID Packing Type QFN-3X3-16 -40 to 125°C AP2602FNTR-G1 B2E Tape & Reel BCD Semiconductor's Pb-free products, as designated with "G1" suffix in the part number, are RoHS compliant and green. Absolute Maximum Ratings (Note 2) Parameter Symbol Value Unit Supply V oltage V CC -0.3 to 6 V OTXY Voltage VOT -0.3 to 6 V TMSNSX, VTRIG V oltage VTMSNSX, VTRIG -0.3 to VCC+0.3 V SEL V oltage V SEL -0.3 to 6 V Output Current (All Pins) 20 mA Input Current (All Pins) 20 mA Operating Junction Temperature T J 150 °C Storage Temperature Range T STG -65 to 150 °C Lead Temperature (Soldering, 10 seconds) TLEAD 260 °C Thermal Resistance θJA QFN-3X3-16 68 °C/W ESD (Machine Model) 200 V ESD (Human Body Model) 2000 V Note 2: Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “Recommended Operating Co nditions” is not implied. Exposure to “Absolute Maximum Ratings” for extended periods may affect device reliability.

P r e l i m i n a r y D a t a s h e e t Octave Remote Resistor-programmable Temperature Switches AP2602 Feb. 2012 Rev. 1. 0 BCD Semiconductor Manufacturing Limited Recommended Operating Conditions Parameter Symbol Min Max Unit Supply V oltage V CC 2.7 5.5 V Operating Ambient Temperature Range TA -40 125 °C

Electrical Characteristics

VCC=2.7V to 5.5V , TA =-40°C to 125°C, unless otherwise specified. Typical values are at TA=25°C. Parameter Symbol Conditions Min Typ Max Units Supply V oltage V CC 2.7 5.5 V VTMSNSX=VCC 40 100 Supply Current I CC VCC=3.3V OTXY float VTMSNSX=GND 55 110 µA VCC=5V , VSEL=VCC, VTH/VCC 0.244 0.25 0.256 TMSNSX Input Threshold VTH/VCC VCC=3.3V , VSEL=VCC, VTH/VCC 0.24 0.25 0.26 V/V VTRIG Input Range V TRIG 0<V TRIG<0.4×VCC 0.5 0.4× VCC V Offset Voltage between VTRIG and TMSNSX VOS V CC=5V , VSEL=GND -15 15 mV VIH V CC=5V 2 V SEL Input Voltage VIL V CC=5V 1 V Open-drain OTXY Output Sink Current ISINK V OT=0.3V , VTMSNSX=0V 3 4.5 mA Open-drain OTXY Output Leakage Current I LEAK-OT V OT=VCC, VTMSNSX=5V 1 µA Thermal Resistance θJC QFN-3X3-16 4.2 °C/W

2 V / d i v 2 V / d i v

Figure 12. Deglitch time to OT Low (VSEL=VCC) F i g u r e 1 3 . Deglitch time to OT High (VSEL=GND) Figure 14. Deglitch Time to OT Low (VSEL= G N D )

Figure 15. Typical Application of AP2602 (Mode A)

Figure 16. Typical Application of AP2602 (Mode B)

P r e l i m i n a r y D a t a s h e e t Octave Remote Resistor-programmable Temperature Switches AP2602 Feb. 2012 Rev. 1. 0 BCD Semiconductor Manufacturing Limited Mechanical Dimensions QFN-3×3-16 Unit: mm(inch) 3.100(0.122) 2.900(0.114)

BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi- cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or other rights nor the rights of others. - Wafer Fab Shanghai SIM-BCD Semiconductor Manufacturing Limited 800, Yi Shan Road, Shanghai 200233, China Tel: +86-21-6485 1491, Fax: +86-21-5450 0008 BCD Semiconductor Manufacturing Limited MAIN SITE REGIONAL SALES OFFICE Shenzhen Office Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd. Shenzhen Office Advanced Analog Circuits (Shanghai) Corporation Shenzhen Office Room E, 5F, Noble Center, No.1006, 3rd Fuzhong Road, Futian District, Shenzhen 518026, China Tel: +86-755-8826 7951 Fax: +86-755-8826 7865 Taiwan Office BCD Semiconductor (Taiwan) Company Limited 4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei, Taiwan Tel: +886-2-2656 2808 Fax: +886-2-2656 2806 USA Office BCD Semiconductor Corporation 30920 Huntwood Ave. Hayward, CA 94544, U.S.A Tel : +1-510-324-2988 Fax: +1-510-324-2788 - IC Design Group Advanced Analog Circuits (Shanghai) Corporation 8F, Zone B, 900, Yi Shan Road, Shanghai 200233, China Tel: +86-21-6495 9539, Fax: +86-21-6485 9673 BCD Semiconductor Manufacturing Limited http://www.bcdsemi.com BCD Semiconductor Manufacturing Limited IMPORTANT NOTICE BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi- cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or other rights nor the rights of others. - Wafer Fab Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd.

800 Yi Shan Road, Shanghai 200233, China

Tel: +86-21-6485 1491, Fax: +86-21-5450 0008 MAIN SITE REGIONAL SALES OFFICE Shenzhen Office Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd., Shenzhen Office Unit A Room 1203, Skyworth Bldg., Gaoxin Ave.1.S., Nanshan District, Shenzhen, China Tel: +86-755-8826 7951 Fax: +86-755-8826 7865 Taiwan Office BCD Semiconductor (Taiwan) Company Limited 4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei, Taiwan Tel: +886-2-2656 2808 Fax: +886-2-2656 2806 USA Office BCD Semiconductor Corp. 30920 Huntwood Ave. Hayward, CA 94544, USA Tel : +1-510-324-2988 Fax: +1-510-324-2788 - Headquarters BCD Semiconductor Manufacturing Limited No. 1600, Zi Xing Road, Shanghai ZiZhu Science-based Industrial Park, 200241, China Tel: +86-21-24162266, Fax: +86-21-24162277