AP2502 BCDSEMI | Alldatasheet

Document overview

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Technical content

Features

  • Current Matching Between Each Channel: ±1%
  • Low Dropout V oltage: 65mV (Typ.) @ I LED= 20mA
  • Maximum Output Current on Each Channel: 20mA
  • Ultra-low Quiescent Current: 125 µA (Typ.)
  • Ultra-low Shutdown Current: 1 µA (Max.)
  • None EMI and Switching Noise Issue
  • Permitted PWM Dimming Frequency up to
  • 150kHz
  • OTSD Protection

Applications

  • Mobile Phone, Smart Phone, PDA
  • MP3, MP4, PMP
  • Small Size Backlight Module

Figure 1. Package Types of AP2502

Figure 2. Pin Configuration of AP2502 (Top View)

1 EN Chip enable pin, active high to permit PW M signal input for brightness control by

2 GND GND

Figure 3. Functional Block Diagram of AP2502

4-CH Linear Constant Current Sink With Matching AP2502 Oct. 2010 Rev 1. 1 BCD Semiconductor Manufacturing Limited

Ordering Information

C i r c u i t T y p e G 1 : G r e e n P a c k a g e TR: Tape & Reel K: SOT-23-6 K T : T S O T - 2 3 - 6 Package Temperature Range Part Number Marking ID Packing Type SOT-23-6 -40 to 85°C AP2502KTR-G1 GEE Tape & Reel TSOT-23-6 -40 to 85°C AP2502KTTR-G1 L7E Tape & Reel BCD Semiconductor's Pb-free products, as designated with "G1" suffix in the part number, are RoHS compliant and Green. Absolute Maximum Ratings (Note 1) Note 1: Stresses greater than those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under “Recommended Operating Co nditions” is not implied. Exposure to “Absolute Maximum Ratings” for extended periods may affect device reliability. Parameter Symbol Value Unit Enable Input Voltage V EN -0.3 to 6.5 V Thermal Resistance (Junction to Ambient) θJA 250 ºC/W Operating Junction Temperature Range T J 150 ºC Storage Temperature Range T STG -65 to 150 ºC Lead Temperature (Soldering,10 seconds) T LEAD 260 ºC ESD (Machine Model) 600 V ESD (Human Body Model) 6000 V

4-CH Linear Constant Current Sink With Matching AP2502 Oct. 2010 Rev 1. 1 BCD Semiconductor Manufacturing Limited Recommended Operating Conditions

Electrical Characteristics

VIN=3.6V , VF_LED=3.2V , TA = 25°C, unless otherwise specified. Parameter Symbol Test Conditions Min Typ Max Unit LED Dropout V oltage V DROPOUT I SINK =20mA 65 120 mV Enable PIN High V oltage V IH 2 6 V Enable PIN Low V oltage V IL 0 0.5 V LED Maximum Sin k Current ILED(MAX) V CC=3.3 to 6.0V , Enable=VCC 18 20 22 mA Sink Current Matching Between each Channel ILED-MATCH V LED=0.4V 0.5 1 % Quiescent Current I Q I LED1=ILED2=ILED3=ILED4=20mA 125 180 µA Shutdown Current I SHUTDOWN Set EN Pin Low 0.1 1 µA Thermal Resistance (Junction to Case) θJC 80 °C/W PWM Frequency to Adjust Brightness fPWM 150 kHz EN Pin Pulse High Time T HIGH 1 µs EN Pin Pulse Low Time T LOW 100 ns Thermal Shutdown Temperature TOTSD 150 Thermal Shutdown Hysteresis THYOTSD 25 Value Parameter Symbol Min Max Unit Enable Input Voltage V EN 2.0 6.0 V Operating Temperature Range T A -40 85 °C Sink Current I LED 20 mA

Figure 12. LED Current (Note 2) Figure 13. Internal Oscillator Working at Low Frequency Note 2: Chopper offset-canceling technology is adopted to get good current matching, ILED=[(I1+I2)/2]*duty.

Figure 14. AP2502 Typical Application

4-CH Linear Constant Current Sink With Matching AP2502 Oct. 2010 Rev 1. 1 BCD Semiconductor Manufacturing Limited Mechanical Dimensions SO T-23-6 Unit: mm(inch) 2.820(0.111) 3.020(0.119) 0.950(0.037)TYP 1.800(0.071) 2.000(0.079) 0.300(0.012) 0.400(0.016) 0.700(0.028)REF 0.100(0.004) 0.200(0.008) 0.200(0.008) 0.300(0.012) 0.600(0.024) 0.000(0.000) 0.150(0.006) 0.900(0.035) 1.300(0.051) 1.450(0.057) MAX 123 456 Pin 1 Dot by Marking

4-CH Linear Constant Current Sink With Matching AP2502 Oct. 2010 Rev 1. 1 BCD Semiconductor Manufacturing Limited Mechanical Dimensions (Continued) TSOT-23-6 Unit: mm(inch) 2.800(0.110) 3.000(0.118) 1.500(0.059) 1.700(0.067) 2.600(0.102) 3.000(0.118) 0.950(0.037) BSC 1.900(0.075) BSC 0.700(0.028) 0.900(0.035) 0.000(0.000) 0.510(0.020) 0.370(0.015) MIN 0.100(0.004) 0.250(0.010) 0.250(0.010) BSC GAUGE PLANE R0.100(0.004) MIN Pin 1 Dot by Marking 1.000(0.039) MAX

BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi- cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or other rights nor the rights of others. - Wafer Fab Shanghai SIM-BCD Semiconductor Manufacturing Limited 800, Yi Shan Road, Shanghai 200233, China Tel: +86-21-6485 1491, Fax: +86-21-5450 0008 BCD Semiconductor Manufacturing Limited MAIN SITE REGIONAL SALES OFFICE Shenzhen Office Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd. Shenzhen Office Advanced Analog Circuits (Shanghai) Corporation Shenzhen Office Room E, 5F, Noble Center, No.1006, 3rd Fuzhong Road, Futian District, Shenzhen 518026, China Tel: +86-755-8826 7951 Fax: +86-755-8826 7865 Taiwan Office BCD Semiconductor (Taiwan) Company Limited 4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei, Taiwan Tel: +886-2-2656 2808 Fax: +886-2-2656 2806 USA Office BCD Semiconductor Corporation 30920 Huntwood Ave. Hayward, CA 94544, U.S.A Tel : +1-510-324-2988 Fax: +1-510-324-2788 - IC Design Group Advanced Analog Circuits (Shanghai) Corporation 8F, Zone B, 900, Yi Shan Road, Shanghai 200233, China Tel: +86-21-6495 9539, Fax: +86-21-6485 9673 BCD Semiconductor Manufacturing Limited http://www.bcdsemi.com BCD Semiconductor Manufacturing Limited IMPORTANT NOTICE BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi- cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or other rights nor the rights of others. - Wafer Fab Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd.

800 Yi Shan Road, Shanghai 200233, China

Tel: +86-21-6485 1491, Fax: +86-21-5450 0008 MAIN SITE REGIONAL SALES OFFICE Shenzhen Office Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd., Shenzhen Office Unit A Room 1203, Skyworth Bldg., Gaoxin Ave.1.S., Nanshan District, Shenzhen, China Tel: +86-755-8826 7951 Fax: +86-755-8826 7865 Taiwan Office BCD Semiconductor (Taiwan) Company Limited 4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei, Taiwan Tel: +886-2-2656 2808 Fax: +886-2-2656 2806 USA Office BCD Semiconductor Corp. 30920 Huntwood Ave. Hayward, CA 94544, USA Tel : +1-510-324-2988 Fax: +1-510-324-2788 - Headquarters BCD Semiconductor Manufacturing Limited No. 1600, Zi Xing Road, Shanghai ZiZhu Science-based Industrial Park, 200241, China Tel: +86-21-24162266, Fax: +86-21-24162277