AP2402 BCDSEMI | Alldatasheet

Document overview

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Technical content

Features

  • Minimum Output Current Capability per Channel: 300mA
  • High Output V oltage Accuracy: ±2%
  • Low Quiescent Current per Channel: 50 µA Typi- cal
  • Low Standby Current: 0.1µA Typical
  • High PSRR: 70dB Typical （f=1kHz)
  • Extremely Low Noise: 30 µVrms (10Hz to 100kHz)
  • Operating Temperature: -40 to 85oC
  • Compatible with Low ESR Ceramic Capacitor

Applications

  • Mobile Phones, Cordless Phones
  • Wireless Communication Equipment
  • Portable Games
  • Cameras, Video Recorders
  • Sub-board Power Supplies for Telecom Equip- ment
  • Battery Powered Equipment

Figure 1. Package Types of AP2402

Figure 2. Pin Configuration of AP2402 (Top View)

17 V OUT2 Output voltage 2

51 V IN Input voltage

68 V OUT1 Output voltage 1

8 VIN

Figure 3. Functional Block Diagram of AP2402

Jul. 2008 Rev. 1. 1 BCD Semiconductor Manufacturing Limited DUAL 300mA LDO REGULATORS AP2402

Ordering Information

Lead-Free Green Lead-Free Green SOT-23-6 -40 to 85oC 2.5V/1.8V AP2402A21KTR-E1 AP2402A21KTR-G1 EAA GAA Tape & Reel 2.8V/1.8V AP2402A31KTR-E1 AP2402A31KTR-G1 EAB GAB Tape & Reel 2.8V/2.8V AP2402A33KTR-E1 AP2402A33KTR-G1 EAC GAC Tape & Reel TSOT-23-6 -40 to 85 oC 2.5V/1.8V AP2402A21KTTR-E1 AP2402A21KTTR-G1 S8A L8A Tape & Reel 2.8V/1.8V AP2402A31KTTR-E1 AP2402A31KTTR-G1 S8B L8B Tape & Reel 2.8V/2.8V AP2402A33KTTR-E1 AP2402A33KTTR-G1 S8C L8C Tape & Reel DFN-2×2-8 -40 to 85 oC 2.5V/1.8V AP2402A21DNTR-E1 AP2402A21DNTR-G1 6A DA Tape & Reel 2.8V/1.8V AP2402A31DNTR-E1 AP2402A31DNTR-G1 6B DB Tape & Reel 2.8V/2.8V AP2402A33DNTR-E1 AP2402A33DNTR-G1 6C DC Tape & Reel Circuit Type Package E1: Lead Free AP2402 - TR: Tape and Reel K: SOT-23-6 A: Active High (With Built-in Pull-down Resistor) 3: Fixed Output 2.8V (Channel 2) 2: Fixed Output 2.5V (Channel 1) 3: Fixed Output 2.8V (Channel 1) 1: Fixed Output 1.8V (Channel 2) KT: TSOT-23-6 DN: DFN-2×2-8 G1: Green BCD Semiconductor's Pb-free products, as designated with "E1" suffix in the part number, are RoHS compliant. Products with "G1" suffix are available in green packages.

Jul. 2008 Rev. 1. 1 BCD Semiconductor Manufacturing Limited DUAL 300mA LDO REGULATORS AP2402 Parameter Symbol Value Unit Input V oltage V IN 6.5 V Enable Input V oltage V CE 6.5 V Output Current (TA=25oC) IOUT1+IOUT2 700 mA Power Dissipation (TA=25oC) PD SOT-23-6 250 mW Junction Temperature T J 150 oC Storage Temperature Range T STG -65 to 150 oC Lead Temperature (Soldering, 10sec) T LEAD 260 oC ESD (Human Body Model) ESD 6000 V ESD (Machine Model) ESD 200 V Absolute Maximum Ratings (Note 1) Parameter Symbol Min Max Unit Input V oltage V IN 6 V Operating Ambient Temperature Range T A -40 85 oC Recommended Operating Conditions Note 1: Stresses greater than those li sted under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functiona l operation of the device at these or any other conditions beyond those indicated under "Recommended Operating Conditions" is not implied. Exposure to "Absolute Maximum Ratings" for extended periods may affect device reliability.

Jul. 2008 Rev. 1. 1 BCD Semiconductor Manufacturing Limited DUAL 300mA LDO REGULATORS AP2402 Parameter Symbol Conditions Min Typ Max Unit Output V oltage Accuracy ∆VOUT/VOUT Variation from specified VOUT, IOUT=30mA -2 2 % Input V oltage V IN 6V Maximum Output Current I OUT(Max) 300 mA Load Regulation VRLOAD 1mA≤IOUT≤300mA 10 60 mV Line Regulation VRLINE VOUT+1V≤VIN≤6V IOUT=30mA, VCE=VIN 0.01 0.2 %/V Dropout V oltage VDROP IOUT=30mA VOUT=1.8V 30 36 mV VOUT=2.5V 20 24 VOUT=2.8V 20 24 IOUT=100mA VOUT=1.8V 100 120 VOUT=2.5V 65 80 VOUT=2.8V 65 80 Quiescent Current IQ IOUT=0mA 50 90 µA Standby Current ISTD VCE in OFF mode 0.1 1 µA Power Supply Rejection Ratio PSRR Ripple 0.5Vp-p, f=1kHz VIN=VOUT+1V , IOUT=30mA 70 dB Output V oltage Temperature Coefficient (∆VOUT/VOUT)/∆T IOUT=30mA, -40oC≤TA≤85oC ±100 ppm/oC Current Limit I LIMIT VCE=VIN 400 mA Short Circuit Current I SHORT VCE=VIN, VOUT short to GND 50 mA RMS Output Noise VNOISE 10Hz≤f≤100kHz 30 µVrms CE "High" V oltage CE i nput voltage "High" 1.3 6 V CE "Low" V oltage CE input voltage "Low" 0.4 V Thermal Shutdown 165 oC Thermal Shutdown Hys- teresis 30 oC (Channel 1/Channel 2: VIN=VOUT+1V , TA=25oC, CIN=1µF, COUT=1µF, unless otherwise specified.)

Electrical Characteristics

Figure 48. Power Dissipation vs. Case Temperature Figure 49. Power Dissipation vs. Case Temperature

Figure 50. Typical Application of AP2402

Jul. 2008 Rev. 1. 1 BCD Semiconductor Manufacturing Limited DUAL 300mA LDO REGULATORS AP2402 Mechanical Dimensions SOT-23-6 Unit: mm(inch) 2.820(0.111) 3.020(0.119) 2.650(0.104) 2.950(0.116) 1.500(0.059) 1.700(0.067) 0.950(0.037)TYP 1.800(0.071) 2.000(0.079) 0.300(0.012) 0.400(0.016) 0.700(0.028)REF 0.100(0.004) 0.200(0.008) 0.200(0.008) 0.300(0.012) 0.600(0.024) 0.000(0.000) 0.100(0.004) 1.050(0.041) 1.150(0.045) 1.050(0.041) 1.250(0.049) 123 456 Pin 1 Dot by Marking

Jul. 2008 Rev. 1. 1 BCD Semiconductor Manufacturing Limited Data Sheet DUAL 300mA LDO REGULATORS AP2402 Mechanical Dimensions (Continued) TSOT-23-6 Unit: mm(inch) 2.800(0.110) 3.000(0.118) 1.500(0.059) 1.700(0.067) 2.600(0.102) 3.000(0.118) 0.950(0.037) BSC 1.900(0.075) BSC 0.700(0.030) 0.900(0.035) 0.700(0.028) 0.800(0.031) 0.000(0.000) 0.510(0.020) 0.370(0.015) MIN 0.100(0.004) 0.250(0.010) 0.250(0.010) BSC GAUGE PLANE R0.100(0.004) MIN Pin 1 Dot by Marking

Jul. 2008 Rev. 1. 1 BCD Semiconductor Manufacturing Limited DUAL 300mA LDO REGULATORS AP2402 Mechanical Dimensions (Continued) Unit: mm(inch)DFN-2x2-8 Unit: mm(inch) 1.950(0.077) 2.050(0.081) 1.950(0.077) 2.050(0.081) N1N4 N5 N8 0.500(0.020) BSC PIN #1 IDENTIFICATION 1.150(0.045) 1.250(0.049) 0.550(0.022) 0.650(0.026) 0.178(0.007) 0.228(0.009) 0.000(0.000) 0.050(0.002) 0.700(0.028) 0.800(0.031) 0.200(0.008) 0.300(0.012) 0.300(0.012) 0.400(0.016) Pin 1 Dot by Marking

BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi- cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or other rights nor the rights of others. - Wafer Fab Shanghai SIM-BCD Semiconductor Manufacturing Limited 800, Yi Shan Road, Shanghai 200233, China Tel: +86-21-6485 1491, Fax: +86-21-5450 0008 BCD Semiconductor Manufacturing Limited MAIN SITE REGIONAL SALES OFFICE Shenzhen Office Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd. Shenzhen Office Advanced Analog Circuits (Shanghai) Corporation Shenzhen Office Room E, 5F, Noble Center, No.1006, 3rd Fuzhong Road, Futian District, Shenzhen 518026, China Tel: +86-755-8826 7951 Fax: +86-755-8826 7865 Taiwan Office BCD Semiconductor (Taiwan) Company Limited 4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei, Taiwan Tel: +886-2-2656 2808 Fax: +886-2-2656 2806 USA Office BCD Semiconductor Corporation 30920 Huntwood Ave. Hayward, CA 94544, U.S.A Tel : +1-510-324-2988 Fax: +1-510-324-2788 - IC Design Group Advanced Analog Circuits (Shanghai) Corporation 8F, Zone B, 900, Yi Shan Road, Shanghai 200233, China Tel: +86-21-6495 9539, Fax: +86-21-6485 9673 BCD Semiconductor Manufacturing Limited http://www.bcdsemi.com BCD Semiconductor Manufacturing Limited IMPORTANT NOTICE BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any products or specifi- cations herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use of any its products or circuits. BCD Semiconductor Manufacturing Limited does not convey any license under its patent rights or other rights nor the rights of others. - Wafer Fab Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd.

800 Yi Shan Road, Shanghai 200233, China

Tel: +86-21-6485 1491, Fax: +86-21-5450 0008 MAIN SITE REGIONAL SALES OFFICE Shenzhen Office Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd., Shenzhen Office Room E, 5F, Noble Center, No.1006, 3rd Fuzhong Road, Futian District, Shenzhen, 518026, China Tel: +86-755-8826 7951 Fax: +86-755-8826 7865 Taiwan Office BCD Semiconductor (Taiwan) Company Limited 4F, 298-1, Rui Guang Road, Nei-Hu District, Taipei, Taiwan Tel: +886-2-2656 2808 Fax: +886-2-2656 2806 USA Office BCD Semiconductor Corp. 30920 Huntwood Ave. Hayward, CA 94544, USA Tel : +1-510-324-2988 Fax: +1-510-324-2788 - Headquarters BCD Semiconductor Manufacturing Limited No. 1600, Zi Xing Road, Shanghai ZiZhu Science-based Industrial Park, 200241, China Tel: +86-21-24162266, Fax: +86-21-24162277