AP2201 BCDSEMI | Alldatasheet

Document overview

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Technical content

Features

Up to 150mA Regulator Output Low Quiescent Current Low Dropout Voltage: VD=165mV at 150mA High Precision Output Voltage: ±1% Output Noise: 45µVrms at 80Hz-100KHz Good Ripple Rejection Ability: 75dB at 100Hz and IOUT=100µA Tight Load and Line Regulation Low Temperature Coefficient Over Current Protection Thermal Protection Reverse-battery Protection Zero Off-mode Current Logic-controlled Enable

Applications

AP2201-2.8 VIN=3.8V VOUT=2.8V VOUT VIN 2.2µF CIN 1.0µF tantalum

Figure 3. Pin Configuration of AP2201 (Top View) Bypass capacitor for low noise operation.

150mA RF ULDO REGULATOR AP2201 Preliminary Datasheet Jun. 2005 Rev. 1. 0 BCD Semiconductor Manufacturing Limited Bandgap Ref. Current Limit Thermal Shutdown VIN BYP EN GND VOUT Figure 4. Functional Block Diagram of AP2201

Ordering Information

K: SOT-23-5 2.6: Fixed Output 2.6V E1: Lead Free Blank: Tin Lead AP2201 - TR: Tape and Reel 2.8: Fixed Output 2.8V 3.0: Fixed Output 3.0V

150mA RF ULDO REGULATOR AP2201 Preliminary Datasheet Jun. 2005 Rev. 1. 0 BCD Semiconductor Manufacturing Limited Parameter Symbol Value Unit Supply Input Voltage VIN V Enable Input Voltage VEN V Power Dissipation PD Internally Limited W Lead Temperature (Soldering, 5sec) TLEAD 260 oC Storage Temperature TSTG -65 to 150 oC ESD (Machine Model) 200 V Thermal Resistance θJA (Note 2) Note 1: Stresses greater than those listed under "Absolute Maximum Ratings" may cause permanent damage to the device. These are stress ratings only, and functional operation of the device at these or any other conditions beyond those indicated under "Recommended Operating Conditions" is not implied. Exposure to "Absolute Maximum Ratings" for extended periods may affect device reliability. Absolute Maximum Ratings (Note 1) Parameter Symbol Min Max Unit Supply Input Voltage VIN 2.5 13.2 V Enable Input Voltage VEN 13.2 V Operating Junction Temperature TJ -40 125 oC Recommended Operating Conditions Note 2: Absolute maximum ratings indicate limits beyond which damage to the component may occur. Electrical specifica- tions do not apply when operating the device outside of its operating ratings. The maximum allowable power dissipation is a function of the maximum junction temperature, TJ(max), the junction-to-ambient thermal resistance, θJA, and the ambient tem- perature, TA. The maximum allowable power dissipation at any ambient temperature is calculated using: PD(max)=(TJ(max) - TA)/θJA. Exceeding the maximum allowable power dissipation will result in excessive die temperature, and the regulator will go into thermal shutdown. Package Temperature Range Part Number Marking ID Packing Type Tin Lead Lead Free Tin Lead Lead Free SOT-23-5 -40 to 125oC AP2201K-2.6TR AP2201K-2.6TRE1 K1E E1E Tape & Reel AP2201K-2.8TR AP2201K-2.8TRE1 K1G E1G Tape & Reel AP2201K-3.0TR AP2201K-3.0TRE1 K1I E1I Tape & Reel Ordering Information (Continued) BCD Semiconductor's Pb-free products, as designated with "E1" suffix in the part number, are RoHS compliant.

150mA RF ULDO REGULATOR AP2201 Preliminary Datasheet Jun. 2005 Rev. 1. 0 BCD Semiconductor Manufacturing Limited Parameter Symbol Conditions Min Typ Max Unit Output Voltage Accuracy ∆VO/VO Variation from specified VOUT Output Voltage Temperature Coefficient ∆VO /∆T (Note 3) 120 µV/oC Line Regulation VRLINE AP2201-2.6V VIN= VOUT +1V to 13.2V mV AP2201-2.8V VIN= VOUT +1V to 13.2V AP2201-3.0V VIN= VOUT +1V to 13.2V Load Regulation (Note 4) VRLOAD AP2201-2.6V IOUT= 0.1mA to 150mA mV AP2201-2.8V IOUT= 0.1mA to 150mA AP2201-3.0V IOUT= 0.1mA to 150mA Dropout Voltage (Note 5) VIN-VO IOUT=100µA mV IOUT=50mA 110 150 230 IOUT=100mA 140 250 300 IOUT=150mA 165 275 350 Quiescent Current IQ VEN ≤ 0.4V (shutdown) 0.01 µA VEN ≤ 0.18V (shutdown) Ground Pin Current (Note 6) IGND VEN ≥ 2.0V, IOUT=0µA 180 245 µA 265 VEN ≥ 2.0V, IOUT=100µA 182 250 270 VEN ≥ 2.0V, IOUT=50mA 350 600 800 VEN ≥ 2.0V, IOUT=100mA 600 1000 1500

Electrical Characteristics

VIN=VOUT +1V, IOUT = 100µA, CL = 2.2µF, VEN≥ 2.0V, TJ = 25oC, Bold typeface applies over -40oC<TJ<125oC, unless other- wise specified.

150mA RF ULDO REGULATOR AP2201 Preliminary Datasheet Jun. 2005 Rev. 1. 0 BCD Semiconductor Manufacturing Limited VIN=VOUT +1V, IOUT = 100µA, CL = 2.2µF, VEN≥ 2.0V, TJ = 25oC, Bold typeface applies over -40oC<TJ<125oC, unless other- wise specified. Electrical Characteristics (Continued) Parameter Symbol Conditions Min Typ Max Unit Ground Pin Current (Note 6) IGND VEN ≥ 2.0V, IOUT=150mA 1300 1900 2500 Ripple Rejection PSRR frequency=100Hz, IOUT=100µA dB Current Limit ILIMIT VOUT = 0V 320 550 mA Output Noise (Regulator B only) eno IOUT=50mA, CL=2.2µF, 470 pF from BYP to GND 260 Enable Input Logic-Low Voltage VIL Regulator shutdown 0.4 V 0.18 Enable Input Logic-High Voltage VIH Regulator enabled 2.0 V Enable Input Logic-Low Current IIL VIL≤ 0.4V 0.01 µA VIL≤ 0.18V Enable Input Logic-High Current IIH VIL≥ 2.0V µA VIL≥ 2.0V Hz nV / Note 3: Output voltage temperature coefficient is defined as the worst case voltage change divided by the total temperature range. Note 4: Regulation is measured at constant junction temperature using low duty cycle pulse testing. Parts are tested for load regulation in the load range from 0.1mA to 150mA. Changes in output voltage due to heating effects are covered by the thermal regulation specification. Note 5: Dropout voltage is defined as the input to output differential at which the output voltage drops 2% below its nominal value measured at 1V differential. Note 6: Ground pin current is the regulator quiescent current plus pass transistor base current. The total current drawn from the supply is the sum of the load current plus the ground pin current. µA

150mA RF ULDO REGULATOR AP2201 Preliminary Datasheet Jun. 2005 Rev. 1. 0 BCD Semiconductor Manufacturing Limited

Application Information

The AP2201 requires external capacitors for regula- tor stability. These capacitors must be correctly selected for good performance. Input Capacitor If there is more than 10 inches of wire between the input and the AC filter or if a battery is used as the input, at least a 1µF capacitor should be placed from IN to GND. Output Capacitor It is required to prevent oscillation. 1.0µF minimum is recommended when CBYP is not used. 2.2µF mini- mum is recommended when CBYP is 470pF. The out- put capacitor may be increased without limit for large values to improve transient response. The output capacitor should have an ESR of about 5Ω or less. In most cases, tantalum or aluminium electrolytic capacitors are adequate. Noise Bypass Capacitor Bypass capacitor is connected to the internal voltage reference. A 680pF capacitor connected from BYP to GND make this reference quiet, resulting in a significant reduction in output noise. When using CBYP, output capacitors of 2.2µF or greater are required for better stability. The start-up speed of the AP2201 is inversely proportional to the value of reference bypass capacitor. In some cases if output noise is not a major concern and rapid turn-on is necessary, omit CBYP and leave BYP open.

150mA RF ULDO REGULATOR AP2201 Preliminary Datasheet Jun. 2005 Rev. 1. 0 BCD Semiconductor Manufacturing Limited Mechanical Dimensions SOT-23-5 Unit: mm(inch) 2.820(0.111) 2.650(0.104) 1.500(0.059) 0.000(0.000) 1.050(0.041) 0.300(0.012) 0.950(0.037) 1.050(0.041) 0.100(0.004) 0.200(0.008) 0.300(0.012) 3.020(0.119) 1.700(0.067) 2.950(0.116) 0.400(0.016) 1.250(0.049) 0.100(0.004) 1.150(0.045) 0.200(0.008) 0.600(0.024) 1.800(0.071) 2.000(0.079) 0.700(0.028) REF TYP

8F, B Zone, 900 Yi Shan Road, Shanghai 200233, PRC Tel: +86-21-6495 9539, Fax: +86-21-6485 9673 BCD Semiconductor (Taiwan) Company Limited 4F, 298-1 Rui Guang Road, Nei-Hu District, Taipei, Taiwan Tel: +886-2-2656-2808, Fax: +886-2-2656-2806 IMPORTANT NOTICE BCD Semiconductor Manufacturing Limited reserves the right to make changes without further notice to any pro- ducts or specifications herein. BCD Semiconductor Manufacturing Limited does not assume any responsibility for use of any its products for any particular purpose, nor does BCD Semiconductor Manufacturing Limited assume any liability arising out of the application or use of any its products or circuits. BCD Semiconductor Manufacturing Limi- ted does not convey any license under its patent rights or other rights nor the rights of others. http://www.bcdsemi.com BCD Semiconductor Corporation 3170 De La Cruz Blvd, Suite # 105 Santa Clara, CA 95054-2411, U.S.A Tel: +1-408-988 6388, Fax: +1-408-988 6386 Shanghai SIM-BCD Semiconductor Manufacturing Co., Ltd.

800 Yi Shan Road, Shanghai 200233, PRC Tel: +86-21-6485 1491, Fax: +86-21-5450 0008

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