AP14SL50H-HF A-POWER | Alldatasheet

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Advanced Power N-CHANNEL ENHANCEMENT MODE Electronics Corp. POWER MOSFET ▼ 100% Rg & UIS Test VDS @ Tj,max. 550V ▼ Fast Switching Characteristic RDS(ON) 0.28Ω ▼ Simple Drive Requirement ID 13A ▼ RoHS Compliant & Halogen-Free

Description

Absolute Maximum Ratings@Tj=25oC(unless otherwise specified) Symbol Units VDS Drain-Source Voltage V VGS Gate-Source Voltage V ID@TC=25℃ Drain Current, VGS @ 10V3 A ID@TC=100℃ Drain Current, VGS @ 10V3 A IDM Pulsed Drain Current1 A dv/dt MOSFET dv/dt Ruggedness (V DS = 0 …400V ) V/ns PD@TC=25℃ Total Power Dissipation W PD@TA=25℃ Total Power Dissipation4 W EAS Single Pulse Avalanche Energy5 mJ dv/dt Peak Diode Recovery dv/dt 6 V/ns TSTG Storage Temperature Range ℃ TJ Operating Junction Temperature Range ℃ Thermal Data Symbol Parameter Value Units Rthj-c Maximum Thermal Resistance, Junction-case 1.4 ℃/W Rthj-a 62.5 ℃/W Data & specifications subject to change without notice AP14SL50H-HF 89.2 500 +20 8.2 Rating -55 to 150 -55 to 150 Maximum Thermal Resistance, Junction-ambient (PCB mount)4 108 Halogen-Free Product 201503164 Parameter G D S AP14SL50 series are from Advanced Power innovated design and silicon process technology to achieve the lowest possible on- resistance and fast switching performance. It provides the designe r with an extreme efficient device for use in a wide range of powe r applications. The TO-252 package is widely preferred for commercial-industrial surface mount applications and suited for low voltage applications such as DC/DC converters. G D S TO-252(H)

Electrical Characteristics@Tj=25oC(unless otherwise specified) Symbol Parameter Test Conditions Min. Typ. Max. Units BVDSS Drain-Source Breakdown Voltage V GS=0V, ID=250uA 500 - - V RDS(ON) Static Drain-Source On-Resistance2 VGS=10V, ID=4A - - 0.28 Ω VGS(th) Gate Threshold Voltage V DS=VGS, ID=250uA 2 - 5 V gfs Forward Transconductance V DS=10V, ID=5A - 10 - S IDSS Drain-Source Leakage Current VDS=400V, VGS=0V - - 100 uA IGSS Gate-Source Leakage V GS=+20V, VDS=0V - - + 100 nA Qg Total Gate Charge I D=5A - 25 40 nC Qgs Gate-Source Charge V DS=400V - 4 - nC Qgd Gate-Drain ("Miller") Charge V GS=10V - 10 - nC td(on) Turn-on Delay Time V DD=250V - 8 - ns tr Rise Time I D=5A - 20 - ns td(off) Turn-off Delay Time R G=3.3Ω -3 3- ns tf Fall Time V GS=10V - 33 - ns Ciss Input Capacitance V GS=0V - 910 1456 pF Coss Output Capacitance V DS=100V - 45 - pF Crss Reverse Transfer Capacitance f=1.0MHz - 1.5 - pF Rg Gate Resistance f=1.0MHz - 3.6 7.2 Ω Source-Drain Diode Symbol Parameter Test Conditions Min. Typ. Max. Units VSD Forward On Voltage2 IS=4A, VGS=0V - 0.8 - V trr Reverse Recovery Time I S=5A, VGS=0V - 210 - ns Qrr Reverse Recovery Charge dI/dt=50A/µs - 1.15 - µC Notes: 1.Pulse width limited by max. junction temperature. 2.Pulse test 3.Limited by max. junction temperature. Maximum duty cycle D=0.75 5.Starting T j=25oC , VDD=50V , L=150mH , RG=25Ω 6.ISD ≦ ID, VDD ≦ BVDSS, starting TJ = 25oC THIS PRODUCT IS SENSITIVE TO ELECTROSTATIC DISCHARGE, PLEASE HANDLE WITH CAUTION. USE OF THIS PRODUCT AS A CRITICAL COMPONENT IN LIFE SUPPORT OR OTHER SIMILAR SYSTEMS IS NOT AUTHORIZED. APEC DOES NOT ASSUME ANY LIABILITY ARISING OUT OF THE APPLICATION OR USE OF ANY PRODUCT OR CIRCUIT DESCRIBED HEREIN; NEITHER DOES IT CONVEY ANY LICENSE UNDER ITS PATENT RIGHTS, NOR THE RIGHTS OF OTHERS. APEC RESERVES THE RIGHT TO MAKE CHANGES WITHOUT FURTHER NOTICE TO ANY PRODUCTS HEREIN TO IMPROVE RELIABILITY, FUNCTION OR DESIGN. AP14SL50H-HF 4.Surface mounted on 1 in2 copper pad of FR4 board

0.37Ω Fig 1. Typical Output Characteristics Fig 2. Typical Output Characteristics Fig 3. On-Resistance v.s. Gate Voltage Fig 4. Normalized On-Resistance v.s. Junction Temperature Fig 5. Forward Characteristic of Fig 6. Gate Threshold Voltage v.s. Reverse Diode Junction Temperature -50 0 50 100 150 T j , Junction Temperature ( o C ) Normalized RDS(ON) I D =4A V G =10V 0 4 8 12 16 20 24 V DS , Drain-to-Source Voltage (V) ID , Drain Current (A) T C =25 o C 10V 9.0V 8.0V 7.0V V G =6.0V 0 8 16 24 32 V DS , Drain-to-Source Voltage (V) ID , Drain Current (A) T C =150 o C 10V 9.0V 8.0V 7.0V V G =6.0V V SD (V) IS (A) T j = 150 o CT j = 25 o C 0.5 1.5 -50 -25 0 25 50 75 100 125 150 T j , Junction Temperature ( o C ) Normalized VGS(th) I D =250uA 220 240 260 280 300 320 340 2468 1 0 V GS Gate-to-Source Voltage (V) RDS(ON) (m I D =4A T C =25 o C

0.37Ω Fig 7. Gate Charge Characteristics Fig 8. Typical Capacitance Characteristics Fig 9. Maximum Safe Operating Area Fig10. Effective Transient Thermal Impedance Fig 11. Drain Current v.s. Case Fig 12. Gate Charge Waveform Temperature 1000 2000 3000 4000 0 100 200 300 400 500 600 V DS , Drain-to-Source Voltage (V) C (pF) f=1.0MHz C iss C oss C rss0 0 8 16 24 32 Q G , Total Gate Charge (nC) VGS , Gate to Source Voltage (V) I D =5A V DS =400V 0.01 0.1 t , Pulse Width (s) Normalized Thermal Response (Rthjc) PDM Duty factor = t/T Peak Tj = PDM x Rthjc + TC t T 0.02 0.01 0.05 0.1 0.2 Duty factor=0.5 Single Pulse 0.1 100 1 10 100 1000 V DS , Drain-to-Source Voltage (V) ID (A) T C =25 o C Single Pulse 10us 100us 1ms 10ms 100ms DC 25 50 75 100 125 150 T C , Case Temperature ( o C ) ID , Drain Current (A) Q VG 10V QGS QGD QG Charge Operation in this area limited by RDS(ON)

Date Code (YWWSSS) Y：Last Digit Of The Year WW：Week SSS：Sequence 14SL50H YWWSSS