AMIS-42673

AMIS-42673 AMI | Alldatasheet

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Technical content

AMIS-42673 High Speed CAN Transceiver Data Sheet For Long Networks

1.0 Introduction

The AMIS-42673 CAN transceiver is the interface between a controller area network (CAN) protocol controller and the physical bus. It may be used in both 12V and 24V s ystems. The digital interface level is powered from a 3.3V supply providing true I/O voltage l evels for 3.3V CAN controllers. The transceiver provides differential transmit capability to the bus and differential receive capability to the CAN c ontroller. Due to t he wide c ommon-mode vo ltage rang e of the receiv er inp uts, the AMIS-426 73 is a ble to reach o utstanding l evels of electroma gnetic susceptibility ( EMS). Similarl y, e xtremely low electromagnetic emissio n (EME) is achi eved b y th e e xcellent matchi ng of the outp ut signals. The AMIS-42673 is prim arily intended for applications where long network lengths are mandatory. Examples are elevators, in-building networks, process control and trains. To cope with the long bus delay the communication speed needs to be l ow. AMIS-42673 allows low transmit data rates down to 10 kbit/s or lower.

2.0 Key Features

• True 3,3V or 5,0V logic level interface
• Fully compatible with the “ISO 11898-2” standard
• Wide range of bus communication speed (0 up to 1Mbit/s)
• Allows low transmit data rate in networks exceeding 1 km
• Ideally suited for 12V and 24V applications
• Low electromagnetic emission (EME). Common-mode-choke is no longer required
• Differential receiver with wide common-mode range (+/- 35V) for high electromagnetic susceptibility (EMS)
• No disturbance of the bus lines with an un-powered node
• T hermal protection
• Bus pins protected against transients
• Short circuit proof to supply voltage and ground
• ESD protection for CAN bus at ± 8 kV

3.0 Technical Characteristics

Table 1: Technical Characteristics Symbol Parameter Conditions Min Max Unit VCANH DC voltage at pin CANH 0 < VCC < 5.25V; no time limit -45 +45 V VCANL DC voltage at pin CANL 0 < VCC < 5.25V; no time limit -45 +45 V Vi(dif)(bus_dom) Differential bus output voltage in dominant state 42.5Ω < RLT < 60Ω 1.5 3 V tpd(rec-dom) Propagation delay TxD to RxD Figure 7 100 230 ns tpd(dom-rec) Propagation delay TxD to RxD Figure 7 100 245 ns CM-range Input common-mode range for comparator Guaranteed differential receiver threshold and leakage current -35 +35 V VCM-peak Common-mode peak Figure 8 and Figure 9 (Note 1) -500 500 mV VCM-step Common-mode step Figure 8 and Figure 9 (Note 1) -150 150 mV Note 1: The parameters VCM-peak and VCM-step guarantee low EME.

4.0 Ordering Information

Ordering Code (Tubes) Ordering Code (Tape) Marketing Name Package Temp. Range 0ICAG-001-XTD 0ICAG-001-XTP AMIS 42673AGA SOIC-8 GREEN -40°C… 125°C 1 AMI Semiconductor – October 07, Rev. 1.0 www.amis.com Specifications subject to change without notice

AMIS-42673 High Speed CAN Transceiver Data Sheet For Long Networks

5.0 Block Diagram

Figure 1: Block Diagram

6.0 Typical Application

6.1 Application Schematic

Figure 2: Application Diagram AMIS- 42673 CANH CANL GND RxD TxD VREF PC20071003.3 VCC CAN controller VBAT 5V-reg IN OUT 47 nF 60 Ω 60 Ω CAN BUS 47 nF 60 Ω 60 Ω 3.3V- regIN OUT V33VCC GND V33 CANH CANL AMIS-42673 GND RxD VCC Driver control Thermal shutdownVCC PC20071003.2 TxD VREF COMP Vcc/2 Ri(cm) Ri(cm) 'S' 2 AMI Semiconductor – October 07, Rev. 1.0 www.amis.com Specifications subject to change without notice

AMIS-42673 High Speed CAN Transceiver Data Sheet For Long Networks

6.2 Pin Description

6.2.1. Pin Out (top view) Figure 3: Pin Configuration TxD RxD VREF GND CANL CANH VCC AMIS- 42673 PC20071003.1 V33 6.2.2. Pin Description Table 2: Pin Out Pin Name Description

1 TxD Transmit data input; low input → dominant driver; internal pull-up current

2 GND Ground

3 VCC Supply voltage

4 RxD Receive data output; dominant transmitter→ low output

5 VREF Reference voltage output

6 CANL LOW-level CAN bus line (low in dominant mode)

7 CANH HIGH-level CAN bus line (high in dominant mode)

8 V33 3.3V supply for digital I/O 3 AMI Semiconductor – October 07, Rev. 1.0 www.amis.com Specifications subject to change without notice

AMIS-42673 High Speed CAN Transceiver Data Sheet For Long Networks

7.0 Functional Description

7.1 General

The AMIS-42673 is the int erface bet ween the CAN pr otocol contro ller a nd the p hysical bus . It is intende d for use i n ind ustrial and automotive applications requiring baud rates up to 1Mbit/s. It provides differential transmit capability to the bus and differential receiver capability to the CAN protocol controller. It is fully compatible to the “ISO 11898-2” standard.

7.2 Operating Modes

AMIS-42673 only operates in high-speed mode as illustrated in Table 3. The transceiver is abl e to co mmunicate via the bus l ines. The signals are transmitted a nd received to the CAN co ntroller via the pins TxD and RxD. The slopes on the bus lines outputs are optimised to give extremely low EME. Table 3: Functional table of AMIS-42673; X = don’t care VCC pin TxD pin CANH pin CANL Bus state pin RxD 4.75 to 5.25.V 0 High Low Dominant 0 4.75 to 5.25.V 1 (or floating) VCC/2 VCC/2 Recessive 1 VCC<PORL (unpowered) X 0V<CANH<VCC 0V<CANL<VCC Recessive 1 PORL<VCC<4.75V >2V 0V<CANH<VCC 0V<CANL<VCC Recessive 1

7.3 Over-temperature Detection

A thermal protection circuit protects the IC from dama ge by switching off the transmitter i f the junction t emperature exceeds a value of approximately 160°C. Beca use the tra nsmitter di ssipates most of the power, the p ower d issipation an d temp erature of th e I C is reduced. All other IC functio ns continue to o perate. The transmitter off-state re sets when pin T xD goes HIGH. The thermal protection circuit is particularly needed when a bus line short circuits.

7.4 High Communication Speed Range

The transceiver is prim arily intended for i ndustrial applications. It all ows very low baud rates needed for long bus length applications. But also high speed communication is possible up to 1Mbit/s.

7.5 Fail-safe Features

A curre nt-limiting c ircuit protects the tra nsmitter outp ut s tage from da mage caus ed by acc idental short-circuit t o eith er p ositive or negative supply voltage - although power dissipation increases during this fault condition. The pins CANH and CANL are protected from automotive electrical transients (according to “ISO 7637”; see Figure 4). Should TxD become disconnected, this pin is pulled high internally. When the Vcc supp ly is removed, pins T xD and R xD will be floating. This prevents the AMIS-42673 from being supplied by the CAN controller through the I/O pins. 7.6 3.3V Interface AMIS-42673 may be used to i nterface with 3.3V or 5V c ontrollers by use of the V33 pin. This pin may be supplied with 3.3V or 5V to have the corresponding digital interface voltage levels. When the V33 pin is supplied at 2.5V, even interfacing with 2.5V CAN controllers is possible. See also Digital Output Characteristics @ V33 = 2.5V, Table 7. In this case a pull-up resistor from TxD to V33 is necessary. 4 AMI Semiconductor – October 07, Rev. 1.0 www.amis.com Specifications subject to change without notice

AMIS-42673 High Speed CAN Transceiver Data Sheet For Long Networks

8.0 Electrical Characteristics

8.1 Definitions

All voltages are referenced to GND (pin 2). Positive curr ents flow into the IC. Sinking cu rrent means that the current i s flowing into the pin. Sourcing current means that the current is flowing out of the pin.

8.2 Absolute Maximum Ratings

Stresses a bove thos e l isted in T able 4 m ay c ause p ermanent d evice failure. Ex posure to absolute ma ximum rati ngs for e xtended periods may effect device reliability. Table 4: Absolute Maximum Ratings Symbol Parameter Conditions Min. Max. Unit VCC Supply voltage -0.3 +7 V V33 I/O interface voltage -0.3 +7 V VCANH DC voltage at pin CANH 0 < VCC < 5.25V; no time limit -45 +45 V VCANL DC voltage at pin CANL 0 < VCC < 5.25V; no time limit -45 +45 V VTxD DC voltage at pin TxD -0.3 VCC + 0.3 V VRxD DC voltage at pin RxD -0.3 VCC + 0.3 V VREF DC voltage at pin VREF -0.3 VCC + 0.3 V Vtran(CANH) Transient voltage at pin CANH Note 1 -150 +150 V Vtran(CANL) Transient voltage at pin CANL Note 1 -150 +150 V Vtran(VREF) Transient voltage at pin VREF Note 1 -150 +150 V Vesd(CANL/CANH) Electrostatic discharge voltage at CANH and CANL pin Note 2 Note 5 -500 +500 kV V Vesd Electrostatic discharge voltage at all other pins Note 3 Note 5 -250 + 4 +250 kV V Latch-up Static latch-up at all pins Note 4 100 mA Tstg Storage temperature -55 +155 °C Tamb Ambient temperature -40 +125 °C Tjunc Maximum junction temperature -40 +150 °C Notes: 1) Applied transient waveforms in accordance with “ISO 7637 part 3”, test pulses 1, 2, 3a, and 3b (see Figure 4). 2) Standardized human body model system ESD pulses in accordance to IEC 1000.4.2. 3) Standardized human body model ESD pulses in accordance to MIL883 method 3015. Supply pin 8 is ±4kV. 4) Static latch-up immunity: static latch-up protection level when tested according to EIA/JESD78. 5) Standardized charged device model ESD pulses when tested according to EOS/ESD DS5.3-1993.

8.3 Thermal Characteristics

Table 5: Thermal Characteristics Symbol Parameter Conditions Value Unit Rth(vj-a) Thermal resistance from junction to ambient in SO8 package In free air 145 K/W Rth(vj-s) Thermal resistance from junction to substrate of bare die In free air 45 K/W 5 AMI Semiconductor – October 07, Rev. 1.0 www.amis.com Specifications subject to change without notice

AMIS-42673 High Speed CAN Transceiver Data Sheet For Long Networks

8.4 DC Characteristics

VCC = 4.75 to 5.25V; V33 = 2.9V to 3.6V; Tjunc = -40 to +150 °C; RLT = 60Ω unless specified otherwise Table 6: Characteristics Symbol Parameter Conditions Min. Typ. Max. Unit Supply (pin VCC and pin V33) ICC Supply current Dominant; VTXD = 0V Recessive; VTXD = VCC mA mA I33 I/O interface current V33 = 3.3V; CL = 20pF; recessive 1 µA I33 I/O interface current (1) V33 = 3.3V; CL = 20pF; 1Mbps 170 µA Transmitter Data Input (pin TxD) VIH HIGH-level input voltage Output recessive 2.0 - VCC V VIL LOW-level input voltage Output dominant -0.3 - +0.8 V IIH HIGH-level input current VTxD = V33 -1 0 +1 µA IIL LOW-level input current VTxD = 0V -50 -200 -300 µA Ci Input capacitance (1) - 5 10 pF Receiver Data Output (pin RxD) VOH HIGH-level output voltage IRXD = - 10mA 0.7 x V33 0.75 x V33 V VOL LOW-level output voltage IRXD = 5mA 0.18 0.35 V Ioh HIGH-level output current (1) VRxD = 0.7 x V33 -10 -15 -20 mA Iol LOW-level output current (1) VRxD = 0.45V 5 10 15 mA Reference Voltage Output (pin VREF) VREF Reference output voltage -50µA < IVREF < +50µA 0.45 x VCC 0.50 x VCC 0.55 x VCC V VREF_CM Reference output voltage for full common- mode range -35V < VCANH < +35V; -35V < VCANL < +35V 0.40 x VCC 0.50 x VCC 0.60 x VCC V Bus Lines (pins CANH and CANL) Vo(reces)(CANH) Recessive bus voltage at pin CANH VTxD = VCC; no load 2.0 2.5 3.0 V Vo(reces)(CANL) Recessive bus voltage at pin CANL VTxD = VCC; no load 2.0 2.5 3.0 V Io(reces) (CANH) Recessive output current at pin CANH -35V < VCANH < +35V; Io(reces) (CANL) Recessive output current at pin CANL -35V < VCANL < +35V; Vo(dom) (CANH) Dominant output voltage at pin CANH VTxD = 0V 3.0 3.6 4.25 V Vo(dom) (CANL) Dominant output voltage at pin CANL VTxD = 0V 0. 5 1.4 1.75 V VTxD = 0V; dominant; 42.5Ω < RLT < 60Ω 1.5 2.25 3.0 V Vi(dif) (bus) Differential bus input voltage (VCANH - VCANL) VTxD = VCC; recessive; no load -120 0 +50 mV Io(sc) (CANH) Short circuit output current at pin CANH VCANH = 0V;VTxD = 0V -45 -70 -95 mA Io(sc) (CANL) Short circuit output current at pin CANL VCANL = 36V; VTxD = 0V 45 70 120 mA Vi(dif)(th) Differential receiver threshold voltage -5V < VCANL < +12V; -5V < VCANH < +12V; see Figure 5 0.5 0.7 0.9 V Vihcm(dif) (th) Differential receiver threshold voltage for high common-mode -35V < VCANL < +35V; -35V < VCANH < +35V; see Figure 5 0.25 0.7 1.05 V Vi(dif) (hys) Differential receiver input voltage hysteresis -35V < VCANL < +35V; -35V < VCANH < +35V; see Figure 5 50 70 100 mV Ri(cm)(CANH) Common-mode input resistance at pin CANH 15 25 37 KΩ Ri(cm) (CANL) Common-mode input resistance at pin CANL 15 25 37 KΩ Ri(cm)(m) Matching between pin CANH and pin CANL common-mode input resistance VCANH = VCANL -3 0 +3 % Ri(dif) Differential input resistance 25 50 75 KΩ 6 AMI Semiconductor – October 07, Rev. 1.0 www.amis.com Specifications subject to change without notice

AMIS-42673 High Speed CAN Transceiver Data Sheet For Long Networks Table 7: Characteristics (Continued) Symbol Parameter Conditions Min. Typ. Max. Unit Bus Lines (pins CANH and CANL) Ci(CANH) Input capacitance at pin CANH VTxD = VCC; not tested 7.5 20 pF Ci(CANL) Input capacitance at pin CANL VTxD = VCC; not tested 7.5 20 pF Ci(dif) Differential input capacitance VTxD = VCC; not tested 3.75 10 pF ILI(CANH) Input leakage current at pin CANH VCC = 0V; VCANH = 5V 10 170 250 µA ILI(CANL) Input leakage current at pin CANL VCC = 0V; VCANL = 5V 10 170 250 µA VCM-peak Common-mode peak during transition from dom → rec or rec → dom Figure 8 and Figure 9 -500 500 mV VCM-step Difference in common-mode between dominant and recessive state Figure 8 and Figure 9 -150 150 mV Power on Reset PORL POR level CANH, CANL, Vref in tri- state below POR level 2.2 3.5 4.7 V Thermal Shutdown Tj(sd) shutdown junction temperature 150 160 180 °C Timing Characteristics (see Figures 6 and 7) td(TxD-BUSon) Delay TxD to bus active 40 85 110 ns td(TxD-BUSoff) Delay TxD to bus inactive 30 60 110 ns td(BUSon-RxD) Delay bus active to RxD 25 55 110 ns td(BUSoff-RxD) Delay bus inactive to RxD 65 100 135 ns tpd(rec-dom) Propagation delay TxD to RxD from recessive to dominant 100 230 ns td(dom-rec) Propagation delay TxD to RxD from dominant to recessive 100 245 ns Note: 1) Not tested at ATE VCC = 4.75 to 5.25V; V33 = 2.5V ± 5%; Tjunc = -40 to +150 °C; RLT = 60Ω unless specified otherwise. Table 8: Digital Output Characteristics @ V33 = 2.5V Symbol Parameter Conditions Min. Typ. Max. Unit Receiver Data Output (pin RxD) Ioh HIGH-level output current VOH > 0.9 x V33 -2.6 mA Iol LOW-level output current VOL < 0.1 x V33 4 mA

8.5 Measurement Set-ups and Definitions

Figure 4: Test Circuit for Automotive Transients AMIS- 42673 GND CANH CANL VREF PC20071003.4 RxD TxD 1 nF 20 pF 1 nF Transient Generator 100 nF VCC 100 nF +5 V +3.3 V V33 3 8 7 AMI Semiconductor – October 07, Rev. 1.0 www.amis.com Specifications subject to change without notice

AMIS-42673 High Speed CAN Transceiver Data Sheet For Long Networks

9.0 Package Outline

SOIC-8: Plastic small outline; 8 leads; body width 150 mil; JEDEC: MS-012 10 AMI Semiconductor – October 07, Rev. 1.0 www.amis.com Specifications subject to change without notice

AMIS-42673 High Speed CAN Transceiver Data Sheet For Long Networks

10.0 Soldering

10.1 Introduction to Soldering Surface Mount Packages

This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in the AMIS “Data Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surfac e mount ICs, or for printed-circuit boards (PCB) with high population densities. In these situations re-flow soldering is often used.

10.2 Re-flow Soldering

Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the PCB by screen printing, stencilling or pressu re-syringe disp ensing befor e packa ge pl acement. Sever al metho ds exist for re-flo wing; for e xample, infrared/convection heating in a conveyor type oven. Throughput times (pre heating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical re- flow peak temperatures range from 215 to 250°C. The top-surface temperature of the packages should preferably be kept below 230°C.

10.3 Wave Soldering

Conventional single wave soldering is not recommended for surface mount devices (SMDs) or PCBs with a high component density, as solder bridging and n on-wetting can present major prob lems. To ov ercome these pr oblems the d ouble-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results:

• Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave.
• For packages with leads on two sides and a pitch (e): o Larger than or equal to 1.27mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the PCB; o Smaller than 1.27mm, the footprint longitudinal axis must be parallel to the transport direction of the PCB. The footprint must incorporate solder thieves at the downstream end.
• For packages with leads on four sides, the footprint must be placed at a 45º angle to the transport direction of the PCB. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is four seconds at 250°C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications.

10.4 Manual Soldering

Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300°C. When using a dedicated tool, all other leads can be soldered in one operation within two to five seconds between 270 and 320°C. Table 9: Soldering Process Soldering Method Package Wave Re-flow (1) BGA, SQFP Not suitable Suitable HLQFP, HSQFP, HSOP, HTSSOP, SMS Not suitable (2) Suitable PLCC (3) , SO, SOJ Suitable Suitable LQFP, QFP, TQFP Not recommended (3)(4) Suitable SSOP, TSSOP, VSO Not recommended (5) Suitable Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods.” 2. These packages are not suitable for wave soldering as a solder joint between the PCB and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5mm. 11 AMI Semiconductor – October 07, Rev. 1.0 www.amis.com Specifications subject to change without notice

AMIS-42673 High Speed CAN Transceiver Data Sheet For Long Networks

11.0 Company or Product Inquiries

For more information about AMI Semiconductor’s Industrial CAN Transceivers, visit our Web site at http://www.amis.com.

12.0 Revision History

October 2007 1.0 Initial release Devices sold by AMIS are covered b y the w arranty and paten t ind emnification pr ovisions ap pearing in its Term s of S ale only . AM IS ma kes no w arranty, ex press, statutory, implied or by description, regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. AMIS makes no warranty of merchan tability or fitness for any purposes. AMIS re serves the ri ght to discon tinue production an d change sp ecifications and price s at any time and without no tice. A MI Semi conductor's pro ducts are intended for u se i n commercial appl ications. Appl ications re quiring ex tended tempe rature r ange, unusual environmental requirements, or high reliability applications, such as military, medical life-support or life-sustaining equipment, are specifically not recommended without additional processing by AMIS for such applications. Copyright ©2007 AMI Semiconductor, Inc. 12 AMI Semiconductor – October 07, Rev. 1.0 www.amis.com Specifications subject to change without notice