AMIS-42670

AMIS-42670 AMI | Alldatasheet

Document overview

• Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
• PDF pages: 12

Technical content

AMIS-42670 High-Speed CAN Transceiver Data Sheet For Long Networks

1.0 General Description

The AMIS-42670 CAN transceiver is the interface between a controller area network (CAN) protocol controller and the physical bus and may be used in both 12V a nd 24V s ystems. The transceiver provides differential transmit capability to t he bus and differential receive capability to the CAN controller. Due to the wide common-mode voltage range of the receiver inputs, the AMIS-42670 is able to reach outstanding levels of electromagnetic susceptibility (EMS). Similarly, extremely low electromagnetic emission (EME) is achieved by the excellent matching of the output signals. The AMIS-42670 is th e industrial version of the AMIS-30 660 and primarily intended for applications where long network lengths are mandatory. E xamples are elevators, in-b uilding net works, process c ontrol a nd tra ins. T o cope with the l ong bus d elay the communication speed needs to be low. AMIS-42670 allows low transmit data rates down 10 Kbit/s or lower.

2.0 Key Features

• Fully compatible with the ISO 11898-2 standard
• Certified “Authentication on CAN Transceiver Conformance (d1.1)”
• Wide range of bus communication speed (0 up to 1 Mbit/s)
• Allows low transmit data rate in networks exceeding 1 km
• Ideally suited for 12V and 24V industrial and automotive applications
• Low electromagnetic emission (EME) common-mode choke is no longer required
• Differential receiver with wide common-mode range (+/- 35V) for high EMS
• No disturbance of the bus lines with an un-powered node
• T hermal protection
• Bus pins protected against transients
• Silent mode in which the transmitter is disabled
• Short circuit proof to supply voltage and ground
• Logic level inputs compatible with 3.3V devices

3.0 Technical Characteristics

Table 1: Technical Characteristics Symbol Parameter Conditions Min. Max. Unit VCANH DC voltage at pin CANH 0 < VCC < 5.25V; no time limit -45 +45 V VCANL DC voltage at pin CANL 0 < VCC < 5.25V; no time limit -45 +45 V Vi(dif)(bus_dom) Differential bus output voltage in dominant state 42.5Ω < RLT < 60Ω 1.5 3 V tpd(rec-dom) Propagation delay TxD to RxD See Figure 7 70 245 ns tpd(dom-rec) Propagation delay TxD to RxD See Figure 7 100 245 ns CM-range Input common-mode range for comparator Guaranteed diff erential receiver threshold and leakage current -35 +35 V VCM-peak Common-mode peak See Figures 8 and 9 (Notes) -500 500 mV VCM-step Common-mode step See Figures 8 and 9 (Notes) -150 150 mV Note: The parameters VCM-peak and VCM-step guarantee low electromagnetic emission.

4.0 Ordering Information

Ordering Code (Tubes) Ordering Code (Tape) Marketing Name Package Temp. Range 0ICAH-002-XTD 0ICAH-002-XTP AMIS 42670NGA SOIC-8 GREEN -40°C… 125°C 1 AMI Semiconductor – October 07, Rev. 1.0 www.amis.com Specifications subject to change without notice

AMIS-42670 High-Speed CAN Transceiver Data Sheet For Long Networks

5.0 Block Diagram

Figure 1: Block Diagram

6.0 Typical Application

6.1 Application Schematic

Figure 2: Application Diagram 2 AMI Semiconductor – October 07, Rev. 1.0 www.amis.com Specifications subject to change without notice CANH CANL AMIS-42670 GND RxD VCC S Driver control Thermal shutdownVCC PD20070831.4 TxD VREF COMP Vcc/2 Ri(cm) Ri(cm) AMIS- 42670 CANH CANL GND RxD TxD VREF PC20070831.3 VCC S CAN controller VBAT 5V-reg IN OUT 47 nF 60 Ω 60 Ω CAN BUS 47 nF 60 Ω 60 Ω VCC GND

AMIS-42670 High-Speed CAN Transceiver Data Sheet For Long Networks

6.2 Pin Description

6.2.1. Pin Out (Top View) Figure 3: Pin Configuration TxD RxD S VREF GND CANL CANH VCC AMIS- 42670 PC20070831.2

6.3 Pin Description

Table 2: Pin Out Pin Name Description

1 TxD Transmit data input; low input → dominant driver; internal pull-up current

2 GND Ground

3 VCC Supply voltage

4 RxD Receive data output; dominant transmitter → low output

5 VREF Reference voltage output

6 CANL Low-level CAN bus line (low in dominant mode)

7 CANH High-level CAN bus line (high in dominant mode)

8 S Silent mode control input; internal pull-down current

3 AMI Semiconductor – October 07, Rev. 1.0 www.amis.com Specifications subject to change without notice

AMIS-42670 High-Speed CAN Transceiver Data Sheet For Long Networks

7.0 Functional Description

7.1 Operating Modes

The behavi or of AMIS-4267 0 und er vario us conditi ons is illustrate d in Table 3 bel ow. In case the device is p owered, on e of two operating modes can be selected through pin S. Table 3: Functional table of AMIS-42670; X = don’t care VCC pin TxD pin S pin CANH pin CANL Bus state pin RxD 4.75 to 5.25.V 0 0 (or floating) High Low Dominant 0 4.75 to 5.25.V X 1 VCC/2 VCC/2 Recessive 1 4.75 to 5.25.V 1 (or floating) X VCC/2 VCC/2 Recessive 1 VCC<PORL (unpowered) X X 0V<CANH<VCC 0V<CANL<VCC Recessive 1 PORL<VCC<4.75V >2V X 0V<CANH<VCC 0V<CANL<VCC Recessive 1 7.1.1. High-Speed Mode If pin S is pulled low (or left floating), the transceiver is in its high-speed mode and is able to communicate via the bus lines. The signals are transmitted and received to the CAN controller via the pins TxD and RxD. The slopes on the bus line outputs are optimized to give extremely low electromagnetic emissions. 7.1.2. Silent Mode In silent mode, the transmitter is disabled. All other IC functions continue to operate. The silent mode is selected by connecting pin S to VCC and can be used to prevent network communication from being blocked, due to a CAN controller which is out of control.

7.2 Over-temperature Detection

A thermal protection circuit protects the IC from dama ge by switching off the transmitter i f the junction temperature exceeds a value of approximately 160°C. Beca use the tra nsmitter di ssipates most of the power, the power d issipation an d tem perature of the I C is reduced. All ot her IC functio ns continue to operate. The transmitter off-state resets when pin T xD goes high. T he thermal pr otection circuit is particularly necessary when a bus line short-circuits.

7.3 High Communication Speed Range

The transceiver is prim arily intended for industrial applications. It all ows very low baud rates needed for long bus length applications. But also high speed communication is possible up to 1Mbit/s.

7.4 Fail-safe Features

A current-limiting circuit protects the trans mitter output sta ge from damage caused by an accidental short-circuit to either po sitive or negative supply voltage, although power dissipation increases during this fault condition. The pins CAN H and CA NL are protected from automotive electric al tra nsients (accor ding to “ISO 7637”; see Figure 4). Pin T xD is pulled high internally should the input become disconnected. 4 AMI Semiconductor – October 07, Rev. 1.0 www.amis.com Specifications subject to change without notice

AMIS-42670 High-Speed CAN Transceiver Data Sheet For Long Networks

8.0 Electrical Characteristics

8.1 Definitions

All voltages are referenced to GND (pin 2). Positive currents flow into the IC. Sinking current means the current is flowing into the pin; sourcing current means the current is flowing out of the pin.

8.2 Absolute Maximum Ratings

Stresses ab ove those liste d in the foll owing tabl e ma y c ause permanent devic e fai lure. Expos ure to abso lute m aximum ratin gs fo r extended periods may affect device reliability. Table 4: Absolute Maximum Ratings Symbol Parameter Conditions Min. Max. Unit VCC Supply voltage -0.3 +7 V VCANH DC voltage at pin CANH 0 < VCC < 5.25V; no time limit -45 +45 V VCANL DC voltage at pin CANL 0 < VCC < 5.25V; no time limit -45 +45 V VTxD DC voltage at pin TxD -0.3 VCC + 0.3 V VRxD DC voltage at pin RxD -0.3 VCC + 0.3 V VS DC voltage at pin S -0.3 VCC + 0.3 V VREF DC voltage at pin VREF -0.3 VCC + 0.3 V Vtran(CANH) Transient voltage at pin CANH Note 1 -150 +150 V Vtran(CANL) Transient voltage at pin CANL Note 1 -150 +150 V Vesd Electrostatic discharge voltage at all pins Note 2 Note 4 -750 +750 kV V Latch-up Static latch-up at all pins Note 3 100 mA Tstg Storage temperature -55 +155 °C Tamb Ambient temperature -40 +125 °C Tjunc Maximum junction temperature -40 +150 °C Notes: 1. Applied transient waveforms in accordance with ISO 7637 part 3, test pulses 1, 2, 3a, and 3b (see Figure 4). 2. Standardized human body model ESD pulses in accordance to MIL883 method 3015.7. 3. Static latch-up immunity: static latch-up protection level when tested according to EIA/JESD78. 4. Standardized charged device model ESD pulses when tested according to EOS/ESD DS5.3-1993.

8.3 Thermal Characteristics

Table 5: Thermal Characteristics Symbol Parameter Conditions Value Unit Rth(vj-a) Thermal resistance from junction to ambient in SO8 package In free air 150 K/W Rth(vj-s) Thermal resistance from junction to substrate of bare die In free air 45 K/W 5 AMI Semiconductor – October 07, Rev. 1.0 www.amis.com Specifications subject to change without notice

AMIS-42670 High-Speed CAN Transceiver Data Sheet For Long Networks

8.4 DC and Timing Characteristics

VCC = 4.75 to 5.25V; Tjunc = -40 to +150°C; RLT =60Ω unless specified otherwise. Table 6: DC and Timing Characteristics Symbol Parameter Conditions Min. Typ. Max. Unit Supply (Pin VCC) ICC Supply current Dominant; VTXD = 0V Recessive; VTXD = VCC mA mA Transmitter Data Input (Pin TxD) VIH High-level input voltage Output recessive 2.0 - VCC+0.3 V VIL Low-level input voltage Output dominant -0.3 - +0.8 V IIH High-level input current VTxD = VCC -1 0 +1 µA IIL Low-level input current VTxD = 0V -75 -200 -350 µA Ci Input capacitance Not tested - 5 10 pF Mode Select (Pin S) VIH High-level input voltage Silent mode 2.0 - VCC+0.3 V VIL Low-level input voltage High-speed mode -0.3 - +0.8 V IIH High-level input current VS =2V 20 30 50 µA IIL Low-level input current VS =0.8V 15 30 45 µA Receiver Data Output (Pin RxD) VOH High-level output voltage IRXD = - 10mA 0.6 x VCC 0.75 x VCC V VOL Low-level output voltage IRXD = 6mA 0.25 0.45 V Reference Voltage Output (Pin VREF) VREF Reference output voltage -50µA < IVREF < +50µA 0.45 x VCC 0.50 x VCC 0.55 x VCC V VREF_CM Reference ou tput voltage for f ull common mode range -35V <VCANH< +35V; -35V <VCANL< +35V 0.40 x VCC 0.50 x VCC 0.60 x VCC V Bus Lines (Pins CANH and CANL) Vo(reces)(CANH) Recessive bus voltage at pin CANH VTxD = VCC; no load 2.0 2.5 3.0 V Vo(reces)(CANL) Recessive bus voltage at pin CANL VTxD = VCC; no load 2.0 2.5 3.0 V Io(reces) (CANH) Recessive output current at pin CANH -35V <VCANH< +35V; 0V <VCC < 5.25V -2.5 - +2.5 mA Io(reces) (CANL) Recessive output current at pin CANL -35V <VCANL < +35V; 0V <VCC < 5.25V -2.5 - +2.5 mA Vo(dom) (CANH) Dominant output voltage at pin CANH VTxD = 0V 3.0 3.6 4.25 V Vo(dom) (CANL) Dominant output voltage at pin CANL VTxD = 0V 0. 5 1.4 1.75 V VTxD = 0V; dominant; 42.5 Ω < RLT < 60 Ω 1.5 2.25 3.0 V Vi(dif) (bus) Differential bus input voltage (VCANH - VCANL) VTxD =VCC; recessive; No load -120 0 +50 mV Io(sc) (CANH) Short circuit output current at pin CANH VCANH = 0V; VTxD = 0V -45 -70 -95 mA Io(sc) (CANL) Short circuit output current at pin CANL VCANL = 36V; VTxD = 0V 45 70 120 mA Vi(dif)(th) Differential receiver threshold voltage -5V <VCANL < +10V; -5V <VCANH < +10V; See Figure 5 0.5 0.7 0.9 V Vihcm(dif) (th) Differential rece iver threshold voltage for high common-mode -35V <VCANL < +35V; -35V <VCANH < +35V; See Figure 5 0.25 0.7 1.05 V Vi(dif) (hys) Differential receiver input voltage hysteresis -5V <VCANL < +10V; -5V <VCANH < +10V; See Figure 5 50 70 100 mV Ri(cm)(CANH) Common-mode input resistan ce at pin CANH 15 25 37 KΩ Ri(cm) (CANL) Common-mode input resistan ce at pin CANL 15 25 37 KΩ Ri(cm)(m) Matching between pin CANH and pin CANL common-mode input resistance VCANH =VCANL -3 0 +3 % Ri(dif) Differential input resistance 25 50 75 KΩ Ri(cm)(m) Matching between pin CANH and pin CANL common-mode input resistance VCANH =VCANL -3 0 +3 % Ri(dif) Differential input resistance 25 50 75 KΩ 6 AMI Semiconductor – October 07, Rev. 1.0 www.amis.com Specifications subject to change without notice

AMIS-42670 High-Speed CAN Transceiver Data Sheet For Long Networks Table 7: DC and Timing Characteristics (continued) Symbol Parameter Conditions Min. Typ. Max. Unit Ci(CANH) Input capacitance at pin CANH VTxD = VCC; not tested 7.5 20 pF Ci(CANL) Input capacitance at pin CANL VTxD = VCC; not tested 7.5 20 pF Ci(dif) Differential input capacitance VTxD = VCC; not tested 3.75 10 pF ILI(CANH) Input leakage current at pin CANH VCC = 0V; VCANH = 5V 10 170 250 µA ILI(CANL) Input leakage current at pin CANL VCC = 0V; VCANL = 5V 10 170 250 µA VCM-peak Common-mode peak during tra nsition from dom → rec or rec → dom See Figure 8 and Figure 9 -500 500 mV VCM-step Difference in common-mod e bet ween dominant and recessive state See Figure 8 and Figure 9 -150 150 mV Power-on-Reset (POR) PORL POR level CANH, CANL, Vref in tr i- state below POR level 2.2 3.5 4.7 V Thermal Shutdown Tj(sd) Shutdown junction temperature 150 160 180 °C Timing Characteristics (see Figure 6 and Figure 7) td(TxD-BUSon) Delay TxD to bus active Vs = 0V 40 85 130 ns td(TxD-BUSoff) Delay TxD to bus inactive Vs = 0V 30 60 105 ns td(BUSon-RxD) Delay bus active to RxD Vs = 0V 25 55 105 ns td(BUSoff-RxD) Delay bus inactive to RxD Vs = 0V 65 100 135 ns tpd(rec-dom) Propagation delay TxD to RxD from recessive to dominant Vs = 0V 70 245 ns td(dom-rec) Propagation delay TxD to RxD from dominant to recessive Vs = 0V 100 245 ns

8.5 Measurement Set-ups and Definitions

Figure 4: Test Circuit for Transients AMIS- 42670 VCC GND CANH CANL VREF PC20070831.1 S RxD TxD 1 nF 100 nF +5 V 20 pF 1 nF Transient Generator Figure 5: Hysteresis of the Receiver VRxD Vi(dif)(hys) High Low 0,5 0,9PC20040829.7 Hysteresis 7 AMI Semiconductor – October 07, Rev. 1.0 www.amis.com Specifications subject to change without notice

AMIS-42670 High-Speed CAN Transceiver Data Sheet For Long Networks

9.0 Package Outline

SOIC-8: Plastic small outline; eight leads; body width 150mil AMI Semiconductor – October 07, Rev. 1.0 www.amis.com Specifications subject to change without notice

AMIS-42670 High-Speed CAN Transceiver Data Sheet For Long Networks

10.0 Soldering

10.1 Introduction

This text gives a ver y brief insight to a comple x technology. A more in-depth account of soldering ICs can be foun d in the AMIS “Data Handbook IC26; Integrated Circuit Packages” (document order number 9398 652 90011). There is no sol dering method that is ideal for all surface mount IC packages. Wave sold ering is not al ways suitable for surface mount ICs, or for printed circuit boards with high population densities. In these situations reflow soldering is often used.

10.2 Re-flow Soldering

Re-flow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for re-flowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds, depending on heating method. Typical reflow peak temperatures range from 215 to 250°C. The top-surface temperature of the packages should preferably be kept below 230°C.

10.3 Wave Soldering

Conventional single wave s oldering is n ot recomm ended for s urface mount devices (SMDs) or pr inted circu it b oards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used, the following conditions must be observed for optimal results:

• Use a double-wave soldering method, comprising a turbulent wave with high upward pressure followed by a smooth laminar wave. For packages with leads on two sides and a pitch (e): o Larger than or equal to 1.27mm, the footpr int longitudinal axis is preferred to be parallel to the tra nsport direction of the printed-circuit board. o Smaller than 1.27mm, the footprint longitudinal axis must be parallel to t he transport direction of the printed-circuit board. The footprint must incorporate solder thieves at the downstream end.
• For packages with leads on four sides, the footprint must be plac ed at a 45 degree angle to th e transport direction of the printed- circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is fo ur seconds at 250°C. A mildl y-activated flux will eliminate the need for r emoval of corrosiv e residues in most applications.

10.4 Manual Soldering

Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to ten seconds at up to 300°C. When using a dedicated tool, all other leads can be soldered in one operation within two to five seconds, between 270 and 320°C. Table 8: Soldering Soldering Method Package Wave Reflow (1) BGA, SQFP Not suitable Suitable HLQFP, HSQFP, HSOP, HTSSOP, SMS Not suitable (2) Suitable PLCC (3) , SO, SOJ Suitable Suitable LQFP, QFP, TQFP Not recommended (3)(4) Suitable SSOP, TSSOP, VSO Not recommended (5) Suitable Notes: 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to v aporization of the moistur e in them (the so called popcor n effect). For details, refer to the Drypack information in the “Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods.” 2. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heat sink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45 degree angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8mm; it i s definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65mm. 5. Wave soldering i s only suitable fo r SSOP and TSSOP packages with a pitch (e) equ al to o r larger than 0.65mm; it i s definitely not suitable for pa ckages with a pitch (e) equal to or smaller than 0.5mm. 11 AMI Semiconductor – October 07, Rev. 1.0 www.amis.com Specifications subject to change without notice

AMIS-42670 High-Speed CAN Transceiver Data Sheet For Long Networks

11.0 Company or Product Inquiries

For more information about AMI Semiconductor’s high-speed Industrial CAN transceivers, visit our Web site at: http://www.amis.com

12.0 Document History

October 2007 1.0 Initial release Devices sold by AMIS are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only. AMIS makes no warranty, express, statutory, implied or b y description, regarding the in formation set forth herein or regarding the freedom of the described dev ices from patent infringement. AMIS makes no warranty of merchantability or fitness for any purposes. AMIS re serves the right to discontinue production and change specifications and prices at any time and w ithout n otice. AM I Semi conductor's products are in tended for use in commercial applica tions. App lications requiri ng extended tempera ture range , unusual e nvironmental requ irements, or high reliab ility applic ations, s uch as mili tary, medic al li fe-support or lif e-sustaining eq uipment, are specifically not recommended without additional processing by AMIS for such applications. Copyright ©2007 AMI Semiconductor, Inc. 12 AMI Semiconductor – October 07, Rev. 1.0 www.amis.com Specifications subject to change without notice