AMIS-30663

AMIS-30663 AMI | Alldatasheet

Document overview

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• PDF pages: 12

Technical content

www.amis.com AAMMIISS--3300666633 High Speed CAN Transceiver Data Sheet

1.0 General Description

The AMIS-30663 CAN transceiver is the interface between a controller area network (CAN) protocol controller and the physical bus and may be used in both 12V and 24V systems. The digital interface level is powered from a 3.3V supply providing true I/O voltage levels for 3.3V CAN controllers. The transceiver provides differential transmit capability to the bus and differential receive capability to the CAN controller. Due to the wide common-mode voltage range of the receiver inputs, the AMIS-30663 is able to reach outstanding levels of electromagnetic susceptibility. Similarly, extremely low electromagnetic emission is achieved by the excellent matching of the output signals.

2.0 Key Features

• Fully compatible with the "ISO 11898-2" standard
• Certified "Authentication on CAN Transceiver Conformance (d1.1)"
• High speed (up to 1Mbit/s)
• Ideally suited for 12V and 24V industrial and automotive applications
• Low electromagnetic mission (EME) common-mode-choke is no longer required
• Differential receiver with wide common-mode range (+/- 35V) for high electro magnetic susceptibility (EMS)
• No disturbance of the bus lines with an un-powered node
• Transmit data (TxD) dominant time-out function
• Thermal protection
• Bus pins protected against transients in an automotive environment
• Short circuit proof to supply voltage and ground
• Logic level inputs compatible with 3.3V devices
• ESD protection level for CAN bus up to ±8kV

3.0 Technical Characteristics

Table 1: Technical Characteristics SSyymmbbooll PPaarraammeetteerr CCoonnddiittiioonnss MMiinn.. MMaaxx.. UUnniitt VCANH DC voltage at pin CANH 0 < VCC < 5.25V; no time limit -45 +45 V VCANL DC voltage at pin CANL 0 < VCC < 5.25V; no time limit -45 +45 V Vi(dif)(bus_dom) Differential bus output voltage in dominant state 42.5W < RLT < 60W 1.5 3 V tpd(rec-dom) Propagation delay TxD to RxD See Figure 7 100 230 ns tpd(dom-rec) Propagation delay TxD to RxD See Figure 7 100 245 ns CM-range Input common-mode range for comparator Guaranteed differential receiver threshold and leakage current -35 +35 V VCM-peak Common-mode peak See Figure 8 and 9 (Note) -500 500 mV VCM-step Common-mode step See Figure 8 and 9 (Note) -150 150 mV Note: The parameters VCM-peak and VCM-step guarantee low EME.

4.0 Ordering Information

MMaarrkkeettiinngg NNaammee PPaacckkaaggee TTeemmpp.. RRaannggee AMIS 30663NGA SOIC-8 GREEN -40°C...125°C

www.amis.com AAMMIISS--3300666633 High Speed CAN Transceiver Data Sheet

5.0 Block Diagram

1 Driver

PC20041012.1 TxD VREF COMP Vcc/2 Ri(cm) Ri(cm) V33 VCC V33 'S' Figure 1: Block Diagram

6.0 Typical Application

66..11 AApppplliiccaattiioonn SScchheemmaattiicc AMIS- 30663 CANH CANL GND RxD TxD VREF PC20040919.1 VCC CAN controller VBAT 5V-reg IN OUT 47 nF

60 W 60 W

3.3V- regIN OUT V33VCC GND Figure 2: Application Diagram

www.amis.com AAMMIISS--3300666633 High Speed CAN Transceiver Data Sheet 66..22 PPiinn DDeessccrriippttiioonn

6.2.1 Pin Out (top view)

PC20040918.8 Figure 3: Pin Configuration

6.2.2 Pin Description

Table 2: Pin Out PPiinn NNaammee DDeessccrriippttiioonn

1 TxD Transmit data input; low input ® dominant driver; internal pull-up current

2 GND Ground

3 VCC Sypply voltage

4 RxD Receive data output; dominant transmitter ® low output

5 VREF Reference voltage output

6 CANL LOW-level CAN bus line (low in dominant mode)

7 CANH HIGH-level CAN bus line (high in dominant mode)

8 V33 3.3V supply for digital I/O

7.0 Functional Description

The AMIS-30663 is the interface between the CAN protocol controller and the physical bus. It is intended for use in automotive and industrial applications requiring baud rates up to 1Mbaud. It provides differential transmit capability to the bus and differential receiver capability to the CAN protocol controller. It is fully compatible to the "ISO 11898-2" standard. 77..11 GGeenneerraall AMIS-30663 only operates in high-speed mode as illustrated in Table 3. The transceiver is able to communicate via the bus lines. The signals are transmitted and received to the CAN controller via the pins TxD and RxD. The slopes on the bus lines outputs are optimised to give extremely low EME. 77..22 OOppeerraattiinngg MMooddeess

www.amis.com AAMMIISS--3300666633 High Speed CAN Transceiver Data Sheet Table 3: Function Table (X = don’t care) 4.75 < VCC < 5.25V MMooddee PPiinn BBuuss TTxxDD RRxxDD SSTTAATTEE CCAANNHH CCAANNLL High Speed 0 0 Dominant High Low 1 1 Recessive 0.5 VCC 0.5 VCC VCC < PORL MMooddee PPiinn BBuuss TTxxDD RRxxDD SSTTAATTEE CCAANNHH CCAANNLL - X 1 Recessive 0 < VCANH < VCC 0 < VCANL < VCC PORL < VCC < 4.75V MMooddee PPiinn BBuuss TTxxDD RRxxDD SSTTAATTEE CCAANNHH CCAANNLL - > VIH 1 Recessive 0 < VCANH < VCC 0 < VCANL < VCC AMIS-30663 may be used to interface with 3.3V or 5V controllers by use of the V33 pin. This pin may be supplied with 3.3V or 5V to have the corresponding digital interface voltage levels. In this case a pull resistor from TxD to V 33 is necessary. 77..33 OOvveerr--tteemmppeerraattuurree DDeetteeccttiioonn A thermal protection circuit protects the IC from damage by switching off the transmitter if the junction temperature exceeds a value of approximately 160°C. Because the transmitter dissipates most of the power, the power dissipation and temperature of the IC is reduced. All other IC functions continue to operate. The transmitter off-state resets when pin TxD goes HIGH. The thermal protection circuit is particularly needed when a bus line short circuits. 77..44 TTxxDD DDoommiinnaanntt TTiimmee--oouutt FFuunnccttiioonn A TxD dominant time-out timer circuit prevents the bus lines from being driven to a permanent dominant state (blocking all network communication) if pin TxD is forced permanently LOW by a hardware and/or software application failure. The timer is triggered by a negative edge on pin TxD. If the duration of the LOW-level on pin TxD exceeds the internal timer value t dom, the transmitter is disabled, driving the bus into a recessive state. The timer is reset by a positive edge on pin TxD. 77..55 FFaaiill--ssaaffee FFeeaattuurreess A current-limiting circuit protects the transmitter output stage from damage caused by accidental short circuit to either positive or negative supply voltage - although power dissipation increases during this fault condition. The pins CANH and CANL are protected from automotive electrical transients (according to "ISO 7637"; see Figure 4). Should TxD become disconnected, this pin is pulled high internally. When the V CC supply is removed, pins TxD and RxD will be floating. This prevents the AMIS-30663 from being supplied by the CAN controller through the I/O pins. 77..66 33..33VV IInntteerrffaaccee

www.amis.com AAMMIISS--3300666633 High Speed CAN Transceiver Data Sheet

8.0 Electrical Characteristics

88..11 DDeeffiinniittiioonnss All voltages are referenced to GND (pin 2). Positive currents flow into the IC. Sinking current means that the current is flowing into the pin. Sourcing current means that the current is flowing out of the pin. 88..22 AAbbssoolluuttee MMaaxxiimmuumm RRaattiinnggss Stresses above those listed in Table 4 may cause permanent device failure. Exposure to absolute maximum ratings for extended periods may effect device reliability. Table 4: Absolute Maximum Ratings SSyymmbbooll PPaarraammeetteerr CCoonnddiittiioonnss MMiinn.. MMaaxx.. UUnniitt VCC Supply voltage -0.3 +7 V V33 I/O interface voltage -0.3 +7 V VCANH DC voltage at pin CANH 0 < VCC < 5.25V; no time limit -45 +45 V VCANL DC voltage at pin CANL 0 < VCC < 5.25V; no time limit -45 +45 V VTxD DC voltage at pin TxD -0.3 VCC + 0.3 V VRxD DC voltage at pin RxD -0.3 VCC + 0.3 V VREF DC voltage at pin VREF -0.3 VCC + 0.3 V Vtran(CANH) Transient voltage at pin CANH Note 1 -150 +150 V Vtran(CANL) Transient voltage at pin CANL Note 1 -150 +150 V Vtran(VREF) Transient voltage at pin VREF Note 1 -150 +150 V Vesd(CANL/CANH) Electrostatic discharge voltage at CANH and CANL pin Note 2 Note 5 -500 +500 kV V Vesd Electrostatic discharge voltage at all other pins Note 3 Note 5 -250 +250 kV V Latch-up Static latch-up at all pins Note 4 100 mA Tstg Storage temperature -55 +155 °C Tamb Ambient temperature -40 +125 °C Tjunc Maximum junction temperature -40 +150 °C Notes 1) Applied transient waveforms in accordance with "ISO 7637 part 3", test pulses 1, 2, 3a, and 3b (see Figure 4). 2) Standardized human body model system ESD pulses in accordance to IEC 1000.4.2 3) Standardized human body model ESD pulses in accordance to MIL883 method 3015. Supply pin 8 is ±4kV 4) Static latch-up immunity: static latch-up protection level when tested according to EIA/JESD78. 5) Standardized charged device model ESD pulses when tested according to EOS/ESD DS5.3-1993. 88..33 TThheerrmmaall CChhaarraacctteerriissttiiccss Table 5: Thermal Characteristics SSyymmbbooll PPaarraammeetteerr CCoonnddiittiioonnss VVaalluuee UUnniitt Rth(vj-a) Thermal resistance from junction to ambient in SO8 package In free air 145 K/W Rth(vj-s) Thermal resistance from junction to substrate of bare die In free air 45 K/W

www.amis.com AAMMIISS--3300666633 High Speed CAN Transceiver Data Sheet 88..44 DDCC CChhaarraacctteerriissttiiccss Table 6: Characteristics Supply (pin V CC and pin V 33) ICC Supply current Dominant; VTXD = 0V 45 65 mA Recessive; VTXD = VCC 4 8 mA I33 I/O interface current V33 = 3.3V; CL = 20pF; recessive 1 mA I33 I/O interface current (1) V33 = 3.3V; CL = 20pF; 1Mbps 170 mA Transmitter Data Input (pin TxD) VIH HIGH-level input voltage Output recessive 2.0 - VCC V VIL LOW-level input voltage Output dominant -1.3 - +0.8 V IIH HIGH-level input current VTxD = V33 -1 0 +1 mA IIL LOW-level input current VTxD = 0V -50 -200 -300 mA Ci Input capacitance (1) - 5 10 pF Receiver Data Output (pin RxD) VOH HIGH-level input voltage IRxD = -10mA 0.7 x V33 0.75 x V33 V VOL LOW-level input voltage IRxD = 5mA 0.18 0.35 V Ioh HIGH-level input voltage (1) VRxD = 0.7 x V33 -10 -15 -20 mA Iol LOW-level input voltage (1) VRxD = 0.45V 5 10 15 mA Reference Voltage Output (V REF ) VREF Reference output voltage -50mA < IVREF < +50mA 0.45 X VCC 0.50 X VCC 0.55 X VCC V VREF_CM Reference output voltage for full common-mode range -35V < VCANH < +35V 0.40 X VCC 0.50 X VCC 0.60 X VCC V-35V < VCANL < +35V Bus Lines (pins CANH and CANL) Vo(reces)(CANH) Recessive bus voltage at pin CANH VTxD = VCC; no load 2.0 2.5 3.0 V Vo(reces)(CANL) Recessive bus voltage at pin CANL VTxD = VCC; no load 2.0 2.5 3.0 V Io(reces)(CANH) Recessive output current at pin CANH -35V < VCANH < +35V Io(reces)(CANL) Recessive output current at pin CANL -35V < VCANL < +35V Vo(dom)(CANH) Dominant output voltage at pin CANH VTxD = 0V 3.0 3.6 4.25 V Vo(dom)(CANL) Dominant output voltage at pin CANL VTxD = 0V 0.5 1.4 1.75 V Vi(dif)(bus) Differential bus input voltage (VCANH - VCANL) VTxD = 0V; dominant; 1.5 2.25 3.0 V42.5W < RLT < 60W Io(sc)(CANH) Short circuit output current at pin CANH VTxD = VCC; recessive; no load -120 0 +50 mV VCANH = 0V; VTxD = 0V -45 -70 -95 mA Io(sc)(CANL) Short circuit output current at pin CANL VCANL = 36V; VTxD = 0V 45 70 120 mA Vi(dif)(th) Differential receiver threshold voltage -5V < VCANL < +12V; -5V < VCANH < +12V; see Figure 5 0.5 0.7 0.9 V Vihcm(dif)(th) Differential receiver threshold voltage for high common-mode -35V < VCANL < +35V; -35V < VCANH < +35V; see Figure 5 0.25 0.7 1.05 V Vi(dif)(hys) Differential receiver input voltage hysteresis -35V < VCANL < +35V; -35V < VCANH < +35V; see Figure 5 50 70 100 mV Ri(cm)(CANH) Common-mode input resistance at pin CANH 15 25 37 kW Ri(cm)(CANL) Common-mode input resistance at pin CANL 15 25 37 kW Ri(cm)(m) Matching between pin CANH and pin CANL common-mode input resistance VCANH = VCANL -3 0 +3 % Ri(dif) Differential input resistance 25 50 75 kW Ci(CANH) Input capacitance at pin CANH VTxD = VCC; not tested 7.5 20 pF Ci(CANL) Input capacitance at pin CANL VTxD = VCC; not tested 7.5 20 pF Ci(dif) Differential input capacitance VTxD = VCC; not tested 3.75 10 pF ILI(CANH) Input leakage current at pin CANH VCC = 0V; VCANH = 5V 10 170 250 mA

www.amis.com AAMMIISS--3300666633 High Speed CAN Transceiver Data Sheet Table 6: Characteristics, Cont. Bus Lines (pins CANH and CANL) ILI(CANL) Input leakage current at pin CANL VCC = 0V; VCANL = 5V 10 170 250 mA VCM-peak Common-mode peak during transition from dom ® rec or rec ® dom See Figure 8 and 9 -500 500 mV VCM-step Difference in common-mode between dominant and recessive state See Figure 8 and 9 -150 150 mV Power-on-Reset PORL POR level CANH, CANL, Vref in tri-state below POR level 2.2 3.5 4.7 V Thermal Shutdown Tj(sd) Shutdown junction temperature 150 160 180 °C Timing Characteristics (see Figure 6 and 7) td(TxD-BUSon) Delay TxD to bus active 40 85 110 ns td(TxD-BUSoff) Delay TxD to bus inactive 30 60 110 ns td(BUSon-RxD) Delay bus active to RxD 25 55 110 ns td(BUSoff-RxD) Delay bus inactive to RxD 65 100 135 ns tpd(rec-dom) Propagation delay TxD to RxD from recessive to dominant 100 230 ns td(dom-rec) Propagation delay TxD to RxD from dominant to recessive 100 245 ns tdom(TxD) TxD dominant time for time out VTxD = 0V 250 450 750 ms Notes 1) Not tested on ATE. Table 7: Digital Output Characteristics @ V 33 = 2.5V Receiver Data Output (pin RxD) Ioh HIGH-level output current VOH > 0.9 x V33 -2.6 mA Iol LOW-level output current VOL < 0.1 x V33 4 mA VCC = 4.75 to 5.25V; V 33 = 2.5V ± 5%; T junc = -40 to +150 °C; R LT =60W unless specified otherwise. 88..55 MMeeaassuurreemmeenntt SSeett--uuppss aanndd DDeeffiinniittiioonnss AMIS- 30663 GND CANH CANL VREF PC20040918.9 RxD TxD 1 nF 20 pF 1 nF Transient Generator 100 nF VCC 100 nF +5 V +3.3 V V33 3 8 Figure 4: Test Circuit for Automotive Transients

www.amis.com AAMMIISS--3300666633 High Speed CAN Transceiver Data Sheet VRxD Vi(dif)(hys) High Low 0,5 0,9PC20040829.7 Hysteresis Figure 5: Hysteresis of the Receiver AMIS- 30663 GND CANH CANL VREF5 RLT CLT PC20040918.10 RxD TxD

60 W 100 pF

+5 V +3.3 V V33 3 8 Figure 6: Test Circuit for Timing Characteristics CANH CANL TxD RxD dominant 0,9V 0,5V recessive 0,7 x V33 Vi(dif) = VCANH - VCANL td(TxD-BUSon) td(BUSon-RxD) tpd(rec-dom) td(TxD-BUSoff) td(BUSoff-RxD) tpd(dom-rec) PC20040829.6 0,3 x V33 HIGH LOW Figure 7: Timing Diagram for AC Characteristics

www.amis.com AAMMIISS--3300666633 High Speed CAN Transceiver Data Sheet

9.0 Package Outline

SOIC-8: Plastic small outline; 8 leads; body width 150 mil; JEDEC: MS-012 NOTES: 1. Maximum die thickness allowable is .015. 2. Dimensioning and tolerances per ANSI.Y14.5M - 1982. 3. “L” is the length of terminal for soldering to a substrate. 4. “N” is the number of terminal positions. 5. Formed leads shall be planar with respect to one another within .003 inches at seating plane. 6. Country of origin location and ejector pin on package bottom is optional and depend on assembly location. 7. Controlling dimension: inches. A .061 .064 .068 A1 .004 .006 0.010 A2 .055 .058 .061 B .0138 .061 .020 C .0075 .008 .0098 D See Variations 1 E .150 .155 .157 e .050 BSC H .230 .236 .244 h .010 .013 .016 L .016 .025 .035 N See Variations 2 a° 0° 5° 8° VVaarriiaattiioonnss 11 22 DD NN AA .189 .194 .196 8 AB .337 .342 .344 14 AC .386 .391 .393 16

www.amis.com AAMMIISS--3300666633 High Speed CAN Transceiver Data Sheet

10.0 Soldering

1100..11 IInnttrroodduuccttiioonn ttoo SSoolleerriinngg SSuurrffaaccee MMoouunntt PPaacckkaaggee This text gives a very brief insight to a complex technology. A more in-depth account of soldering ICs can be found in the AMIS "Data Handbook IC26; Integrated Circuit Packages" (document order number 9398 652 90011). There is no soldering method that is ideal for all surface mount IC packages. Wave soldering is not always suitable for surface mount ICs, or for printed- circuit boards with high population densities. In these situations reflow soldering is often used. 1100..22 RReeffllooww SSoollddeerriinngg Reflow soldering requires solder paste (a suspension of fine solder particles, flux and binding agent) to be applied to the printed-circuit board by screen printing, stencilling or pressure-syringe dispensing before package placement. Several methods exist for reflowing; for example, infrared/convection heating in a conveyor type oven. Throughput times (preheating, soldering and cooling) vary between 100 and 200 seconds depending on heating method. Typical reflow peak temperatures range from 215 to 250°C. The top-surface temperature of the packages should preferably be kept below 230°C. 1100..33 WWaavvee SSoollddeerriinngg Conventional single wave soldering is not recommended for surface mount devices (SMDs) or printed-circuit boards with a high component density, as solder bridging and non-wetting can present major problems. To overcome these problems the double-wave soldering method was specifically developed. If wave soldering is used the following conditions must be observed for optimal results:

• Use a double-wave soldering method comprising a turbulent wave with high upward pressure followed by a smooth laminar wave.
• For packages with leads on two sides and a pitch (e): ° Larger than or equal to 1.27mm, the footprint longitudinal axis is preferred to be parallel to the transport direction of the printed circuit board; ° Smaller than 1.27mm, the footprint longitudinal axis must be parallel to the transport direction of the printedcircuit board. The footprint must incorporate solder thieves at the downstream end.
• For packages with leads on four sides, the footprint must be placed at a 45º angle to the transport direction of the printed circuit board. The footprint must incorporate solder thieves downstream and at the side corners. During placement and before soldering, the package must be fixed with a droplet of adhesive. The adhesive can be applied by screen printing, pin transfer or syringe dispensing. The package can be soldered after the adhesive is cured. Typical dwell time is four seconds at 250°C. A mildly-activated flux will eliminate the need for removal of corrosive residues in most applications. 1100..44 MMaannuuaall SSoollddeerriinngg Fix the component by first soldering two diagonally-opposite end leads. Use a low voltage (24V or less) soldering iron applied to the flat part of the lead. Contact time must be limited to 10 seconds at up to 300°C. When using a dedicated tool, all other leads can be soldered in one operation within two to five seconds between 270 and 320°C.

www.amis.com AAMMIISS--3300666633 High Speed CAN Transceiver Data Sheet Table 8: Soldering Process PPaacckkaaggee SSoollddeerriinngg MMeetthhoodd WWaavvee RReeffllooww ((11)) BGA, SQFP Not suitable Suitable HLQFP, HSQFP, HSOP, HTSSOP, SMS Not suitable (2) Suitable PLCC (3), SO, SOJ Suitable Suitable LQFP, QFP, TQFP Not recommended (3)(4) Suitable SSOP, TSSOP, VSO Not recommended (5) Suitable Notes 1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in them (the so called popcorn effect). For details, refer to the drypack information in the "Data Handbook IC26; Integrated Circuit Packages; Section: Packing Methods." 2. These packages are not suitable for wave soldering as a solder joint between the printed circuit board and heatsink (at bottom version) can not be achieved, and as solder may stick to the heatsink (on top version). 3. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must incorporate solder thieves downstream and at the side corners. 4. Wave soldering is only suitable for LQFP, TQFP and QFP packages with a pitch (e) equal to or larger than 0.8mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65mm. 5. Wave soldering is only suitable for SSOP and TSSOP packages with a pitch (e) equal to or larger than 0.65mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5mm. Devices sold by AMIS are covered by the warranty and patent indemnification provisions appearing in its Terms of Sale only. AMIS makes no warranty, express, statutory, implied or by description, regarding the information set forth herein or regarding the freedom of the described devices from patent infringement. AMIS makes no warranty of merchantability or fitness for any purposes. AMIS reserves the right to discontinue production and change specifications and prices at any time and without notice. AMI Semiconductor's products are intended for use in commercial applications. Applications requiring extended temperature range, unusual environmental requirements, or high reliability applications, such as milit ary, medical life-support or life-sustaining equipment, are specifically not recommended without additional processing by AMIS for such applications. Copyright ©2005 AMI Semiconductor, Inc.