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Specifications subject to change without notice - 1 - Signal Phase Full-Wave Motor Driver for Fan Motor AM6216H High efficiency, Rotation speed adjustable application for AM6216H optimum for driving 12V fan for general consumer equipment. This IC employs soft switching drive, turbo start, Bi-CMOS process and realizes s ilent drive, low ON resistor, and low power consumption. This also incorporate lock protection and auto restart circuit  Applications 12V Fan optimum solution for variable rotation speed setting by external resistor. Such as LED, general consumer equipment…etc.  Features 1) High efficiency, Rotation speed adjustable by external resistor. 2) Power Tr incorporated. 3) Soft switched drive. 4) Lock detection signal (RD) output. 5) Rotating speed pulse signal (FG) output 6) Incorporating lock protection and automatic restart circuit 7) Hall Bias built  Absolute Maximum Ratings (Ta = 25℃) Parameter Symbol Limits Unit Supply voltage VCC 18 V Output current Iomax 1500** mA FG signal output current IFG(SINK) 10 mA FG signal output voltage VFG 18 V HB output current IHB(SINK) 10 mA Power dissipation (1Layer PCB) Pd *2.04 W Power dissipation (2Layer PCB) Pd *3.86 W Operate temperature range Topr -25～+105 ℃ Storage temperature range Tstg -55～+150 ℃ Junction temperature Tj 170 ℃ *When mounted on a 114.3mm×76.1mm×1.6mm JEDEC standard test board. **Should not exceed Pd or ASO and T j values  Recommended operating conditions (Set the power supply voltage taking allowable dissipation into considering) Parameter Symbol Min Typ Max Unit Operating supply voltage range Vcc 2.8～15 V Hall input voltage range VH 0.2～2.1 V

Specifications subject to change without notice - 2 -  Electrical Characteristics (Unless otherwise specified, Ta = 25℃, VCC = 12V) Parameter Symbol Limit Unit Conditions Min Typ Max Supply current 1 ICC1 3 5 7 mA PWM=GND Supply current 2 ICC2 3 6 9 mA PWM=OPEN Hall input Input offset voltage VHOFS － － ±6 mV CPWM input CPWM PIN H level VCPH 1.45 1.65 1.85 V CPWM PIN L level VCPL 0.15 0.3 0.45 V CPWM PIN frequency F PWM 18 22.5 27 kHz C=100p Output Output voltage V0 － 0.4 0.6 V I 0=300mA (Upper + Lower) Input-output Gain GIO 45 48 51 dB FG low voltage VFGL － 0.2 0.4 V I FG = 3mA FG leakage current IFGL － － 20.0 μA V FG = 15V RD low voltage VRDL － － 0.4 V I RD = 3mA RD leakage current IRDL － － 20.0 μA V RD = 15V Input hysteresis voltage V HYS ±10 ±17 ±25 mV Hall bias voltage VHB 1.5 1.8 2.1 V I HB=-5mA Lock protection Lock detection ON time T ON 0.35 0.50 0.65 Sec Lock detection OFF time T OFF 3.5 5.0 6.5 Sec

Specifications subject to change without notice - 3 -  Block Diagram Fig.1 Block diagram  Pin Description PIN No Pin Name Function PIN No Pin Name Function 1 NC No connection. 9 FG FG signal output terminal 2 NC No connection. 10 RD RD signal output terminal

3 GND Ground terminal 11 CPWM Oscillation pin with external capacitor

4 OUT2 Motor output terminal 12 VCC Power supply terminal

5 VRS Rotation Speed Setting terminal. 13 VM Output supply terminal

6 H+ Hall input terminal 14 OUT1 Motor output terminal

7 HB Hall Bias 15 NC No connection. 8 H- Hall input terminal 16 NC No connection.  Truth Table H+ H- PWM OUT1 OUT2 FG RD Mode H L H HL L (Output Tr : ON) L (Output Tr : ON) Operation mode L H L H Z (Output Tr : OFF) H L L LL L (Output Tr : ON) L H L L Z (Output Tr : OFF) H L - LL L (Output Tr : ON) Z (Output Tr : OFF) Lock mode L H L L Z (Output Tr : OFF) Z：Open drain output (High impedance)

Specifications subject to change without notice - 4 -  Application circuit Fig.2 Application circuit *1. Reverse connection of power supply may break the device. A countermeasure is needed such as using reverse current protection diode (D1) between power supply and VCC terminal. The BEMF causes re-circulate current to power supply, when power-on or output changes. It may cause VCC terminal to raise voltage, especially using reverse current protection diode (D1) because there is no way to return current back to power supply. In such case, please take necessary measures like below. Connect a Zener diode (ZD1) between V CC and GND terminal not to exceed the absolute maximum rating voltage. Connect a capacitor (C1) between V CC and GND terminal to make a path of return current to power supply. *2. Cs1 is for turbo-start function. When power on, the VRS voltage will be arise from 0V, and will be charged by HB, Rs1 and Rs2 resistor. The time constant is defined by Rs1, Rs2 and Cs1. *3. Both of Rs1 and Rs2 are for Rotation Speed setting. Floating of VRS pin is unacceptable. When adds Rs1 connect to HB pin, that will reduce turn-on duty on output transistor; reducing rotation speed. When adds Rs2 connect to GND, that will increase turn-on duty on output transistor; increasing rotation speed. *4. Hall element may be affected by Vcc noise or depending on the wiring pattern of PCB board. In this case, adds C3 can be reducing the noise of hall signal.

Specifications subject to change without notice - 5 -  CPWM Control Fig.3 CPWM control principle Assume Rs1 and Rs2 ratio equal to 0.37Vref. 1. Turbo start mode: Turbo start function can be apply, when adds Cs1 capacitor on VRS PIN. The time constant is defined by Cs1, Rs1 and Rs2. When power on, The VRS voltage will be rising from 0V to setting voltage by dividing Rs1 and Rs2 ratio. In Turbo start area, the motor will full speed rotation at the beginning. After VRS voltage arising to 0.1Vref, the motor will reduce the rotation speed. That is due to chopping CPWM by VRS voltage. Finally the motor will into normal operation area. 2. Normal operation mode: The VRS voltage will be setting by Rs1 and Rs2. Adjust the Rs1 and Rs2 ratio that can control the rotation speed of Fan module by chopping the CPWM signal. When VRS voltage rising to 0.37Vref (our assumption). The Motor will be fixed rotation speed in normal operation mode. 3. LOCK operation mode: When motor into lock mode operation, the VRS voltage will be reset to 0V by internal circuit. And the VRS voltage will be recharged by Rs1, Rs2 and Cs1, when lock function is released.

Specifications subject to change without notice - 6 -  Lock detection, automatic restart circuit This IC detect the rotation of the motor by hall signal, and adjust lock detection ON time (Ton) and lock detection OFF time (Toff) by the internal counter. These time (Ton, Toff) are showed below. Fig.4 Lock detect and auto restart motion Only in Lock detection ON Time (Ton), motor will be rest ordinary motion by switching over of hall signal.  Soft switching function (silent drive setting) Input signal to hall amplifier is amplified to produce an output signal. When the hall element output signal is small, the gradient of switching of output waveform is gentle; when it is large on the contrary, the gradient of switching of output waveform is steep. Gain of 300 times (Typ.) is provided between input and output, therefore enter an appropriate hall element output to IC where output waveform swings sufficiently. Fig.5 Relation between hall element output amplitude and output waveform

Specifications subject to change without notice - 7 -  Hall input setting Hall input voltage range is shown in operating conditions. Fig.6 Hall input voltage range Adjust the value of hall element bias resistor R1 in Fig.7 so that the input voltage of a hall amplifier is input in "hall input voltage range" including signal amplitude. Input out of the hall input voltage range may cause unexpected operation of output. Reducing the noise of hall signal Hall element may be affected by the depending on the wiring pattern of board. In this case, place a capacitor like C1 in Fig.7. In addition, when wiring from the hall element output to IC hall input is long, noise may be loaded on wiring. In this case, place a capacitor like C2 in Fig.7. Fig.7 Application in the vicinity of hall signal

Specifications subject to change without notice - 8 -  Power dissipation curve: Power dissipation by ambient temperature de-rating curve Notes: *114.3mm X 76.1mm X 1.6mm signal layer board(JEDEC 51-3). De-rating is done at 14.06mW/℃ for operating above Ta=25℃ ΘJa=71.1 ℃/W, ΘJc= 28.8 ℃/W, Tj = 170℃, Pd max 2039mW **114.3mm X 76.1mm X 1.6mm dual layer board(JEDEC 51-7). De-rating is done at 26.59mW/℃ for operating above Ta=25℃ ΘJa=37.6 ℃/W, ΘJc= 18.7 ℃/W, Tj = 170℃, Pd max 3856mW Calculated formulation Pd = (Tj-Ta) /θJa Symbol θJa is called thermal resistance Thermal resistance: θJa depends on the power consumption, package ambient temperature, packaging condition, wind velocity, chip size etc. The curve of thermal de-rating can determine the reference value at the ambient temperature base on the specified condition. Condition: Mounted on FR4 glass epoxy board, dimension is 114.3mm×76.1mm×1.6mm(JEDEC 51-3,7), copper foil area :< 3%, the core thickness: 1.0 mm, trace thickness: 0.07 mm (2 oz),plane thickness: 0.035 mm (1 oz)

Specifications subject to change without notice - 9 -  Note 1) Absolute maximum ratings This product is produced with strict quality control, but destroyed in using beyond absolute maximum ratings. Once IC destroyed, a failure mode cannot be defined (like short-mode or open-mode).Therefore, physical security counter measure, like fuse, is to be given when a specific mode to be beyond absolute maximum rating is considered. 2) Reverse connection of power supply Reverse connection of the power supply may break the device. A countermeasure is needed such as using reverse current protection diodes between the power supply and the VCC terminal. 3) Power supply line The BEMF causes re-circulate current to power supply, Please connect a capacitor between power supply and GND as a route of re-circulate current. And please determine the capacitance after confirmation that the capacitance does not causes any problems. 4) GND potential The GND terminal should be the location of the lowest voltage on the chip. 5) Thermal design The thermal design should allow enough margins for actual power dissipation. 6) Mounting failures Mounting failures, such as misdirection or miss-mounts, may destroy the device. The electrical short caused by falling particle, between outputs; power supply and output; or output and ground, may damage the device. 7) Layout guide <a> There are 2 Bars on AM6216H exposed pad, the advantage of these 2 bars is to detect if exposed pad is well mounted on PCB ground. <b> The PCB ground layout should be larger enough to cover exposed pad bar in order to detect exposed pad is well mounted on PCB. Please refer to following drawing PCB Ground Layout should be larger to cover exposed pad bar.

Specifications subject to change without notice - 10 -  Packaging outline --- DFN 4X5 16L Unit : mm SYMBOL MILLIMETERS INCHES Min. Max. Min. Max. A - 0.90 - 0.035 A1 - 0.05 - 0.002 A2 - 0.70 - 0.028 A3 0.20 REF 0.008 REF b 0.18 0.30 0.007 0.012 D 5.00 BSC 0.197 BSC E 4.00 BSC 0.157 BSC D1 4.10 4.30 0.161 0.169 E1 2.30 2.50 0.091 0.098 L 0.35 0.45 0.014 0.018 e 0.50 BSC 0.020 BSC

Specifications subject to change without notice - 11 -  Condition of Soldering 1). Manual Soldering Time / Temperature ＜ 3 sec / 400 + 10 oC （ 2 Times） Test Results：0 fail/ 22 tested Manual Soldering count：2 Times 2). Re-flow Soldering (follow IPC/JEDEC J-STD-020D) Classification Reflow Profile Profile Feature Pb-Free Assembly Average ramp-up rate (TL to TP) 3 oC/second max. Preheat - Temperature Min (Ts min) - Temperature Max (Ts max) - Time (ts) from (Tsmin to Tsmax) 150 oC 200oC 60-120 seconds Ts max to TL - Temperature Min (Ts min) oC/second max. Time maintained above: - Liquid us temperature (TL) - Time (tL) maintained above TL 217 oC 60-150 seconds Peak package body temperature (Tp) 260 +0/-5 oC Time with 5oC of actual Peak - Temperature (tp) 30 seconds Ramp-down Rate 6oC/second max. Time 25oC to Peak Temperature 8 minutes max. Test Results：0 fail/ 32 tested Reflow count：3 cycles

Specifications subject to change without notice - 12 -  Marking Identification Row 2 Row 3 Row 1AMtek Row I AMtek Row II AM6216H Row III Lot number & Date code