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AMtek semiconductors Jan. 2021 V1.8 - 1 - One Channel H-Bridge Motor Driver AM4959 Features and Benefits 1) Lowest RDS (ON) 170mΩ for high efficient H-Bridge output 2) SOP-8 package for small size PCB layout 3) Maximum continuous current output 2.2A 4) Operation voltage range 4.5V to 33V 5) Absolute maximum voltage 42V 6) Over temperature protection 7) Over current protection 8) Low standby current 9) Low quiescent current Application Robotic AI Home Appliances DC Brushed Motor Drive Industrial Equipment Other Mechatronic Applications Servo Motor Description The AM4959 output driver block consists of N-channel and P-channel power MOSFETs configured as an H-Bridge to drive DC motor . AM4959 maximum operational voltage is 33V. It can supply up to 2.2A of continuous current and 4A of peak current. There are internal shutdown functions, thermal shutdown protection and overcurrent protection (IOCP = 4 A). Package material is Pb-Free Product & RoHS compliant for the purpose of environmental protection and for sustainable development of the Earth. Ordering Information Orderable Part Number Package Marking AM4959 SOP-8 AM4959
AMtek semiconductors Jan. 2021 V1.8 - 2 - Absolute Maximum Ratings (TA=25℃) Parameter Symbol Limits Unit Power Supply Voltage VCC 42 V Output Continuous Current Io CONT 2.2 (NOTE*) A Output Peak Current Io peak 4 A Operate Temperature Range Topr -40～+85 ℃ Storage Temperature Range Tstg -40～+150 ℃ Note *: Based on 25x25 mm2 FR4 PCB (1 oz.) at single side PCB Recommended Operating Conditions (TA =25℃) (Set the power supply voltage taking allowable dissipation into considering) Parameter Symbol Min. Typ. Max. Unit Power Supply Voltage VCC 4.5 33 V Signal Input IN_A and IN_B Voltage VIN_X -0.3 6* V H-Bridge Output Continuous Current IOUT 0 2.2(Note**) A Externally Applied PWM Frequency FIN_X 30 KHz Note*: Input signal voltage is not higher VCC voltage. Note**: Based on 25x25mm2 FR4 PCB (1 oz.) at single side PCB
AMtek semiconductors Jan. 2021 V1.8 - 3 - Electrical Characteristics ( Unless otherwise specified, TA = 25℃, VCC=6V) Parameter Symbol Limit Unit Conditions Min. Typ. Max. Power Supplies Supply Current ICC 4 mA Input signal IN_A/B= L/H or H/L or H/H No load on OUT_A/B, Standby Current ISTB 2 uA Input signal IN_A/B= L/L IN_X Inputs Input H level Voltage VIN_XH 2.0 6 V Input L level Voltage VIN_XL -0.3 0.7 V Input H level Current IIN_X 100 μA VCC = 6V, VIN = 3V Input Frequency FIN_X 30 KHz Input Pull Down Resistance RIN_X 30 KΩ H-bridge FETs On-Resistance Rds(on) 170 mΩ IO = 1A Upper and Lower total On-Resistance Rds(on) 225 mΩ IO = 2A Upper and Lower total TSD Protections Thermal Shutdown Protection TSDP 160 ℃ Thermal Shutdown Release TSDR 105 ℃
AMtek semiconductors Jan. 2021 V1.8 - 4 - Block Diagram VCC LSS OUT_A OUT_B Level Shifter Level Shifter High-side / Low-side Driver MG1 MG2 MG4 MG3 IN_A IN_B TSD MG3MG1 MG4MG2 GND OCP Input Logic Descriptions Function Truth Table IN_A IN_B OUT_A OUT_B Mode L L Hi-Z Hi-Z Stop L H L H Reverse H L H L Forward H H L L Brake
AMtek semiconductors Jan. 2021 V1.8 - 5 - Pin configuration SOP-8 GND IN_B IN_A NC OUT_B LSS OUT_A VCC Top View Pin Descriptions PIN No. Pin Name I/O Description
1 GND I Ground Pin
2 IN_B I Input Half Bridge B
3 IN_A I Input Half Bridge A
4 NC - NC
5 VCC I Power Supply
6 OUT_A O Output Half Bridge A
7 LSS - Power Return – Sense Resistor Connection
8 OUT_B O Output Half Bridge B
AMtek semiconductors Jan. 2021 V1.8 - 6 - Application: IN_A IN_B M 220μF220μF0.1uF OUT_B 0.1μF0.1μF C4LSS OUT_A VCC GND INB INA NC 4 C1 VCC 0.1 ohm 1nF1nF Circuit Descriptions 1. C1、C2: Power supply VCC pin capacitor: a. The capacitor can reduce the power spike when the motor is in motion. To avoid the IC directly damaged by the VCC peak voltage. It also can stabilize the power supply voltage and reduce its ripples. b. The C1 capacitor can compensate power when motor starts running. c. The capacitor value (uF) determines the stability of the VCC during motor in motion. If the large voltage power or a heavy loading motor is used, then a larger capacitor would be needed. d. On the PCB configuration, the C1、C2 must be mounted as close as possible to VCC pin . 2. C4: The across-motor capacitor a. The C4 capacitors can reduce the power spike when motor is running. 0.1μF capacitor is recommended. b. The C4 capacitor must be added to the general application. 3. If C1 layout location is away from V CC power line or R1 resistor value is larger than 100mΩ, the C3 capacitors 1nF or is highly recommended to be placed in parallel with AM4959 VCC to LSS; the capacitor layout location should be placed as close as practicable to AM4959. Please refer to above application circuit diagram, it is to suppress sampling resistor R1 ground noise to ensure MCU ADC detect sampling voltage precisely. 4. It’s not allowed INA, INB input remain floating status, because there is a minor leakage current between P-N junction when temperature rising, the leakage current will go through internal pull- low resistor which causes INA or INB floating level abnormal pull high and output abnormal working.
AMtek semiconductors Jan. 2021 V1.8 - 7 - 5. Sense Pin (LSS): When current sense (sampling resistor) is used , to feedback sampling voltage to MCU precisely, please refer to following suggestion to get optimal performance: In order to use PWM current control, a low-value resistor (R1) less than 100mΩ is placed between the LSS pin and ground for current sensing purposes. The ground- trace should be as short as possible. For low-value sense resistors, the ground- trace voltage d rops in the PCB can be significant, and should be taken into account. When selecting a value for the sense resistor be sure not to exceed the maximum voltage on the LSS pin of ±250 mV at maximum load. During over -current events, this rating may be exceeded for short durations. 6. There are many type of motors which cause different level of power spike and ground switching noise, please follow above application recommendation, if there is any questions, please feel free to contact us. Layout Guidelines 1. Layout Example PCB Size 25x25 mm2、single side Top Layer 2. Layout Consideration The layout is very important when designing high current and high frequency switching converters. Layout will affect noise pickup. Correctly layout can realize a good design with less background noise. Make all the connections for the power components in the top layer with wide, copper filled areas or polygons. In general, it is desirable to make proper use of GND planes and polygons for power distribution and heat dissipation. 3. Power trace 3.1 Power trace (VCC) should be as short as possible.
3.2 On the PCB configuration, the C1 and C2 must be mounted as close as possible to VCC pin, in order
to reduce EMI noise. 3.3 To ensure that power trace can conduct 2.2 A current, the width of power trace should be wider than 2 mm.
AMtek semiconductors Jan. 2021 V1.8 - 8 - 4. OUTPUT 4.1 OUT_A and OUT_B trace width need at least 2mm for 2.2A current going through.
4.2 For OUT_A & OUT_B thermal design consideration, i t should be big one piece of copper (for
example: 10.8mm x 5.1mm) without any gaps. TOP layer 5. LSS 5.1 LSS is high-current path through the motor driver . The width of connecting metal trace should be as wide as possible. TOP layer 2mm LSS GND
AMtek semiconductors Jan. 2021 V1.8 - 9 - Operating Mode Descriptions H-Bridge basic operating mode： a) Forward mode Definition：When IN_A=H ，IN_B=L，then OUT_A=H ，OUT_B=L b) Reverse mode Definition：When IN_A=L ，IN_B=H，then OUT_ A=L，OUT_B=H c) Brake mode Definition：When IN_A=IN_B= H ，then OUT_A=OUT_B=L d) Stop mode Definition：When IN_A=IN_B= L ，then OUT_A=OUT_B=Hi -Z M ON OFF OFF ON M OFF ON ON OFF M OFF OFF ON ON M OFF OFF OFF OFF a) Forward mode b) Reverse mode c) Brake mode d) Stop mode Protection Mechanisms Descriptions 1) Over-current protection (OCP) When the IC conducts a large current, 4 A (Typ), the internal over -current protection function will be triggered. The device enter protection mode of auto-recover to avoid damaging IC and system. 2) Over-temperature protection If the IC junction temperature exceeds 1 60 ﾟ C (Typ.), the internal over- temperature protection function will be triggered, partial FETs in the H -bridge are disabled , that will ensure the safety of customers' products. If the IC junction temperature falls to 105 ﾟ C(Typ.), the IC resumes automatically.
AMtek semiconductors Jan. 2021 V1.8 - 10 - Thermal Information Θja junction-to-ambient thermal resistance 89.2℃/W Ψjt junction-to-top characterization parameter 10.6℃/W Θja is obtained in a simulation on a JEDEC-standard 2s2p board as specified in JESD-51. The Θja number listed above gives an estimate of how much temperature rise is expected if the device was mounted on a standard JEDEC board. When mounted on the actual PCB, the Θja value of JEDEC board is totally different than the Θja value of actual PCB. Ψjt is extracted from the simulation data to obtain Θja using a procedure described in JESD-51, which estimates the junction temperature of a device in an actual PCB. The thermal characterization parameter, Ψjt, is proportional to the temperature difference between the top of the package and the junction temperature. Hence, it is useful value for an engineer verifying device temperature in an actual PCB environment as described in JEDEC JESD-51-12. When Greek letters are not available, Ψjt is written Psi-jt. Definition: Tj Tt PTT dtjjt /)( −=ψ定義 : Where : Ψjt (Psi-jt) = Junction-to-Top(of the package) °C/W Tj = Die Junction Temp. °C Tt = Top of package Temp at center. °C Pd = Power dissipation. Watts Practically, most of the device heat goes into the PCB, there is a very low heat flow through top of the package, So the temperature difference between Tj and Tt shall be small, that is any error caused by PCB variation is small. This constant represents that Ψjt is completely PCB independent and could be used to predict the Tj in the environment of the actual PCB if Tt is measured properly.
AMtek semiconductors Jan. 2021 V1.8 - 11 - How to predict Tj in the environment of the actual PCB Step 1 : Used the simulated Ψjt value listed above. Step 2 : Measure Tt value by using Thermocouple Method We recommend use of a small ~40 gauge(3.15mil diameter) thermocouple. The bead and thermocouples wires should touch the top of the package and be covered with a minimal amount of thermally conductive epoxy. The wires should be heat-insulated to prevent cooling of the bead due to heat loss into wires. This is important towards preventing “too cool” Tt measurements, which would lead to the calculated Tj also being too cool. IR Spot Method An IR Spot method should be utilized only when using a tool with a small enough spot area to acquire the true top center “hot spot”. Many so-called “small spot size” tools still have a measurement area of 0~100+mils at “zero” distance of the tool from the surface. This spot area is too big for many smaller packages and likely would result in cooler readings than the small thermocouple method. Consequently, to match between spot area and package surface size is important while measuring Tt with IR sport method. Step 3 : calculating power dissipation by P ≅(VCC–|Vo_Hi – Vo_Lo|) x Iout + VCC x Icc Step 4 : Estimate Tj value by Tj = Ψjt x P+Tt Step 5: Calculated Θja value of actual PCB by the known Tj Θja(actual) = (Tj-Ta)/P
AMtek semiconductors Jan. 2021 V1.8 - 12 - Maximum Power Dissipation (de-rating curve) under JEDEC PCB & actual PCB
AMtek semiconductors Jan. 2021 V1.8 - 13 - Packaging outline --- SOP-8 Unit : mm SYMBOL MILLIMETERS INCHES Min. Max. Min. Max. A -- 1.75 -- 0.069 A1 0.10 0.225 0.004 0.009 A2 1.30 1.50 0.051 0.059 A3 0.60 0.70 0.024 0.028 b 0.39 0.48 0.015 0.019 c 0.21 0.26 0.008 0.010 D 4.70 5.10 0.185 0.201 E 5.80 6.20 0.228 0.244 E1 3.70 4.10 0.146 0.161 e 1.27 TYP . 0.05 TYP . h 0.25 0.50 0.010 0.020 L 0.50 0.80 0.020 0.031 L1 1.05 TYP 0.041 TYP .
AMtek semiconductors Jan. 2021 V1.8 - 14 - Marking Identification NOTE: Row1 ： Logo Row2 ： Device Name Row3 ： Wafer Lot No use five codes + Assembly Year use one code + Assembly Week use two codes Example: Wafer Lot No is EB168 + Year 2017 is H + Week 08 is 08，then mark〝EB168H08〞 The last code of assembly year, explanation as below: ： (Year ： A=0,B=1,C=2,D=3,E=4,F=5,G=6,H=7,I=8,J=9. For example: year 2017=H ) Notice : The information in this document is subject to change without notice. Please contact AMtek for current specifications. Users should warrant and guarantee that third party Intell ectual Property rights are not infringed upon when integrating AMtek products into any application. AMtek will not assume any legal responsibility for any said applications.