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Specifications subject to change without notice - 1 - Single Phase Full-Wave Motor Driver for Fan Motor AM3929 The AM3929 is a single phase DC fan motor Co mbo driver IC. Rotation speed can be controlled by PWM input signal and voltage. The drivers incl ude Lock Detection, Thermal Shutdown, and Over-current Pr otection. Maximum output curr ent is 0.8A. Package is PB-free and Halogen-Free.  Applications Single Phase DC Fan Motor.  Features 1) Operation voltage 1.8 to 8.0V. 2) Lock detection/Automatic restart circuit. 3) Control output terminal. (FG) 4) Thermal shutdown circuit. 5) Over current protection. 6) Combo PWM and Voltage controllable 7) Low cross-over noise.  Absolute Maximum Ratings (Ta = 25℃) Parameter Symbol Limits Unit Supply voltage V CC 8 V Output current Iomax 800** mA FG single output current I FG(SINK) 10 mA FG single output voltage V FG 8 V HB output current I HB 10 mA Power dissipation (1Layer PCB) Pd 954* mW Power dissipation (2Layer PCB) Pd 2572* mW Operate temperature range T opr -40~+125 ℃ Storage temperature range T stg -40~+150 ℃ Junction temperature Tjmax 150 ℃ * Reducing by 7.63mW/℃ over 25℃ (On 114.3mm X 76.1mm X 1.6mm single layer board) ** This value is not to exceed Pd.  Recommended operating conditions (Set the power supply voltage taking allowable dissipation into considering) Parameter Symbol Min Typ Max Unit Operating supply voltage range Vcc 1.8~8.0 V Hall input voltage range V H 0.4~Vcc-1.1 V

Specifications subject to change without notice - 2 -  Electrical Characteristics (Unless otherwise specified, Ta = 25℃, VCC = 5V) Parameter Symbol Limit Unit Conditions Min Typ Max Supply current I CC - 3 6 mA Hall input Input offset voltage V HOFS - - ±6 mV PWM input Input H level V PWMH 2.5 - V CC V Input L level V PWML 0 - 0.7 V Input frequency F PWM 0.02 - 50 kHz Output Output voltage V 0 - 0.3 0.5 V I 0=250mA (Upper + Lower) Input-output Gain G IO 45 48 51 dB FG low voltage V FGL - 0.2 0.3 V I FG(sink) = 5mA FG leakage current I FGL - - 10.0 μA V FG = 5V Input hysteresis voltage V HYS ±7 ±12 ±17 mV Hall bias voltage V HB 0.8 1.0 1.2 V I HB=-5mA Lock protection Lock detection ON time T ON 0.35 0.50 0.65 sec Lock detection OFF time T OFF 3.5 5.0 6.5 sec

Specifications subject to change without notice - 3 -  Block Diagram Fig.1 Block diagram  Pin Description PIN No Pin Name Function

1 FG FG signal output terminal

2 PWM PWM signal input terminal

3 VCC Power supply terminal

4 OUT1 Motor output terminal

5 OUT2 Motor output terminal

6 H+ Hall input terminal

7 HB Hall Bias

8 H- Hall input terminal

 Truth Table H+ H- PWM OUT1 OUT2 FG Mode H L H H L L (Output Tr : ON) Operation mode L H L H Z (Output Tr : OFF) H L L L L L (Output Tr : ON) L H L L Z (Output Tr : OFF) H L - L L L (Output Tr : ON) Lock mode L H L L Z (Output Tr : OFF) Z:Open drain output (High impedance)

Specifications subject to change without notice - 4 -  Application circuit Fig.2 Application circuit Reverse connection of power supply may break t he device. A countermeasure is needed such as using reverse current protection diode (D1) between power supply and VCC terminal. The BEMF causes re-circulate current to power supply, when power-on or output changes. It may cause VCC terminal to raise voltage, especially using reverse current protection diode (D1) because there is no way to return current back to power supply. In such case, please take necessary measures like below. Connect a Zener diode (ZD1) between V CC and GND terminal not to exceed the absolute maximum rating voltage. Connect a capacitor (C1) between V CC and GND terminal to make a path of return current to power supply.

Specifications subject to change without notice - 5 -  Lock detection, automatic restart circuit This IC detect the rotation of the motor by hall signal, and adjust lock detection ON time (Ton) and lock detection OFF time (Toff) by the internal counter. These time (Ton, Toff) are showed below. Fig.3 Lock detect and auto restart motion Only in Lock detection ON Time (Ton), motor will be rest ordinary motion by switching over of hall signal. This IC make the lock protection function off, when the PWM input keeps low level for more than 70ms (typ.) Fig.4 PWM input signal and lock protect function Lock protect function does not work if PWM input frequency is slower than 15Hz (typ.) So, please input faster frequency more than 20Hz OUT1 OUT2 FG TONTOFF Motor lock Detect lock Reset ordinary motion 70ms(typ) PWM Lock protect enable (internal) enable disable enable

Specifications subject to change without notice - 6 -  Application Note 1) Absolute maximum ratings This product is produced with strict quality c ontrol, but destroyed in using beyond absolute maximum ratings. Once IC destroyed, a failure mode cannot be defined (like short-mode or open-mode).Therefore, physical security counter measure, like fuse, is to be given when a specific mode to be beyond absolute maximum rating is considered. 2) Reverse connection of power supply Reverse connection of the power supply may break the device. A countermeasure is needed such as using reverse current protection diodes between the power supply and the V CC terminal. 3) Power supply line The BEMF causes re-circulate current to power supply, Please connect a capacitor between power supply and GND as a route of re-circulate current. And please determine the capacitance after confirmation that the capacitance does not causes any problems. 4) GND potential The GND terminal should be the location of the lowest voltage on the chip. 5) Thermal design The thermal design should allow enough margin for actual power dissipation. 6) Mounting failures Mounting failures, such as misdirection or miss-mounts, may destroy the device. The electrical short caused by falling particle, between outputs; power supply and output; or output and ground, may damage the device. 7) Layout guide <a> There are a Bars on AM3929 exposed pad, the advantage of these a bars is to detect if exposed pad is well mounted on PCB ground. <b> The PCB ground layout should be larger enough to cover exposed pad bar in order to detect exposed pad is well mounted on PCB. PLS refer to following drawing PCB ground layout should be larger to cover exposed pad bar

Specifications subject to change without notice - 7 -  Power dissipation curve: Power dissipation by ambient temperature de-rating curve Notes: *114.3mm X 76.1mm X 1.6mm single layer board(JEDEC 51-3). De-rating is done at 7.63mW/℃ for operating above Ta=25℃ ΘJa=130.94 ℃/W, ΘJc= 39.18 ℃/W, Tj max= 150℃, Pd max 954mW **114.3mm X 76.1mm X 1.6mm dual layer board(JEDEC 51-7). De-rating is done at 20.57mW/℃ for operating above Ta=25℃ ΘJa=48.60℃/W, ΘJc= 29.88 ℃/W, Tj max= 150℃, Pd max 2572mW Calculated formulation Pd = (Tj-Ta) /θJa Symbol θJa is called thermal resistance Thermal resistance: θJa depends on the power consumption, package ambient temperature, packaging condition, wind velocity, chip size etc. The curve of thermal de-rating can determine the reference value at the ambient temperature base on the specified condition. Condition: Mounted on FR4 glass epoxy board, dimension is 114.3mm x 76.1 mm x 1.6 mm, copper foil area : < 3%, the core thickness: 1.0 mm, trace thickness: 0.07 mm (2 oz),plane thickness: 0.035 mm (1 oz)

Specifications subject to change without notice - 8 -  Packaging outline --- DFN 2.5X2.5L Unit : mm SYMBOL MILLIMETERS INCHES Min. Max. Min. Max. A - 0.50 - 0.020 A1 - 0.05 - 0.002 A2 - 0.35 - 0.014 A3 0.15 REF 0.006 REF b 0.25 0.35 0.010 0.014 D/E 2.50 BSC 0.098 BSC D1 1.34 1.54 0.053 0.061 E1 1.95 2.15 0.077 0.085 L 0.25 0.35 0.010 0.014 e 0.65 BSC 0.026 BSC

Specifications subject to change without notice - 9 -  Condition of Soldering 1). Manual Soldering Time / Temperature < 3 sec / 400 + 10 oC (2 Times) Test Results:0 fail/ 22 tested Manual Soldering count:2 Times 2). Re-flow Soldering (follow IPC/JEDEC J-STD-020D) Classification Reflow Profile Profile Feature Pb-Free Assembly Average ramp-up rate (TL to TP) 3 oC/second max. Preheat - Temperature Min (Ts min) - Temperature Max (Ts max) - Time (ts) from (Tsmin to Tsmax) 150 oC 200oC 60-120 seconds Ts max to TL - Temperature Min (Ts min) 3oC/second max. Time maintained above: - Liquid us temperature (TL) - Time (tL) maintained above TL 217oC 60-150 seconds Peak package body temperature (Tp) 260 +0/-5 oC Time with 5oC of actual Peak - Temperature (tp) 30 seconds Ramp-down Rate 6 oC/second max. Time 25oC to Peak Temperature 8 minutes max. Test Results:0 fail/ 32 tested Reflow count :3 cycles

Specifications subject to change without notice - 10 - Week Year - A:0, B:1 … J:9 Lot No  Marking Identification Row 1 A3929 Row 2 Date & Lot number Row1 Row2