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AMtek semiconductors July. 2020 V0.2 - 1 - One Channel H - Bridge D r MOS AM2 908 Features and Benefits Lowest RDS(ON) =45mΩ 60V Absolute Maximum Voltage 4.5A Maximum Continuous Current. Lowest RDS(ON) and Small Package 10~50V Operating Voltage Range Overcurrent Protection Thermal Shutdown Protection Undervoltage Lockout Fault Indicator Pin Low Standby Current Charge Pump Circuit Application Massage Chair Robotic Vacuum Window Cleaning Robot Electric Curtain Electric Linear Actuator Cobot Pump(Water / Air) Power Tool Description The AM2908 output driver block consists of N -channel power MOSFETs configured as H -Bridge to driver DC motor . The AM2908 maximum operating voltage is 50V. It can supply up to 4. 5A of continuous current and 8 .0A of peak current. There are internal shutdown function, UVLO, thermal shutdown protection and over current protection (IOCP = 8 A). Package material is Halogen -Free Green Product & RoHS compliant for the purpose of environmental protection and for sustainable development of the Earth. Ordering Information Orderable Part Number Package Marking AM2908 SOP16 AM2908
AMtek semiconductors July. 2020 V0.2 - 2 - Absolute Maximum Ratings (TA=25℃) Parameter Symbol Limits Unit Power Supply Voltage PVCC/VCC 60 V Output Continuous Current IO CONT 4.5 (NOTE*) A Output Peak Current IO peak 8.0 A Operate Temperature Range Topr -20～+85 ℃ Storage Temperature Range Tstg -40～+150 ℃ Note *: 1. Based on 30 x 30 mm2 FR4 PCB (1 oz.) at double side PCB Recommended Operating Conditions (TA =25℃) (Set the power supply voltage taking allowable dissipation into considering) Parameter Symbol Min Typ Max Unit Power Supply Voltage PVCC 10 5 0 V IC Operating Voltage VCC 10 5 0 V Signal Input IN_A and IN_B Voltage VIN_X -0.3 5.5 V H-Bridge Output Continuous Current IOUT 0 4. 5(Note*) A Externally Applied PWM Frequency FIN_X 0.02 100 KHz Note*: 1. Based on 30 x 30mm2 FR4 PCB (1 oz.) at double side PCB.
AMtek semiconductors July. 2020 V0.2 - 3 - Electrical Characteristics ( Unless otherwise specified, TA = 25℃,PVCC=VCC=24V) Parameter Symbol Limit Unit Conditions Min Typ Max Power Supplies Supply Current ICC 7 mA STBY=1, No load on OUT Standby Current ISTB 1 uA STBY=0, No Load on OUT Charge Pump Frequency FCP 200 KHz IN_X Inputs Input H level Voltage VIN_XH 2.0 5.5 V Input L level Voltage VIN_XL 0 0.7 V Input Pull Down Resistance RIN_X 100 KΩ Input Frequency FIN_X 0.02 100 KHz H-Bridge FETs On-resistance Rds(ON) 45 55 mΩ IO = 1.0A Upper and Lower total Protection Circuit Supply Undervoltage Lockout (UVLO) VUVLO
9.4 V VCC Rising
8.7 V VCC Falling
Supply UVLO Hysteresis VUVLO - HYS 700 mV Overcurrent Deglitch Time TDEG 2.0 us Overcurrent Retry Time TOCP 5.3 ms Thermal Shutdown Protection TSDP 175 ℃ Thermal Shutdown Release TSDR 120 ℃ nFAULT Open Drain Output Output Low Voltage VOL 0.5 V IO=5mA Output High Leakage Current IOH 1 uA VO=3.3V
AMtek semiconductors July. 2020 V0.2 - 4 - Block Diagram Input Logic Descriptions Function Truth Table: STBY=1 INA INB OUTA OUTB 模式 L L Hi-Z Hi-Z Stop L H L H Reverse H L H L Forward H H L L Brake Note: 1. When STBY =0, IC is standby mode. PVCC GND OUTA 9, 10 OUTB Level Shifter Level Shifter High-side / Low-side Driver MG1 MG2 MG411 MG3 INA INB TSD OCP MG1 MG2 VCC Level Shifter13STBY 15, 16 MG3 MG4 14nFAULT PGB PGA Charge Pump VCP CPA CPB
AMtek semiconductors July. 2020 V0.2 - 5 - Pin configuration Pin Descriptions Pin No Name I/O Description
1 PGB - Power Ground B
2 VCC - Power Supply
3 CPB Pump fly capacitor . Connect a 100nF ceramic capacitor between there pins 4 CPA - 5 VCP - Charge pump output. Connect a 100nF capacitor to GND
6 PVCC - Power Supply for H-Bridge
7 GND - Ground Pin
8 PGA - Power Ground A
9, 10 OUTA O Output A
11 INA I Input terminal A
12 INB I Input terminal B
13 STBY I Standby Mode setting input
14 nFAULT O Low-level indicates UVLO, TSD or OCP fault. Connect to a pull-up resistor. 15, 16 OUTB O Output B
12 INB
AMtek semiconductors July. 2020 V0.2 - 6 - Application circuit Circuit Descriptions 1. C1、C2: Power supply PVCC/VCC pin capacitor: a) The capacitor can reduce the power spike when the motor is in motion . To avoid the IC directly damaged by the PVCC/ VCC peak voltage. It also can stabilize th e power supply voltage and reduce its ripples. b) The C1 capacitor can compensate power when motor starts running. c) The capacitor value (μF) determines the stability of the PV CC/VCC during motor in motion. In general, 100μF capacitor is enough in low voltage power ( PVCC)；0.1μF capacitor is enough in low voltage power (VCC). If the large voltage power or a heavy loading motor is used, then a larger capacitor would be needed. d) On the PCB configuration, the C1、 C2 must be mounted as close as possible to V CC/PVCC pin (PIN2/PIN6). 2. In order to use PWM current control, a 100mΩ sense resistor is placed between the PGA/PGB pin and ground for current sensing purposes. The ground- trace should be as short as possible. For 100mΩ sense resistors, the ground-trace voltage drops in the PCB can be significant, and should be taken into account. The sense resistor setting 100mΩ at maximum load. During overcurrent events, this rating may be exceeded for short durations. MSTBY 0.1uF 100μF 100nF PVCC INB STBY nFAULT OUTB OUTBPGB VCC CPB CPA VCP PVCC GND PGA OUTA OUTA INA INB INA nFAULT AM2908 0.1Ω 100nF 10K R2 3.3V
AMtek semiconductors July. 2020 V0.2 - 7 - Operating Mode Descriptions 1) H-Bridge basic operating mode： a) Forward mode Definition：When INA=H ，INB=L，then OUTA=H ，OUTB=L b) Reverse mode Definition：When INA=L ，INB=H，then OUTA=L ，OUTB=H c) Brake mode Definition：When INA=INB= H ，then OUTA=OUTB=L d) Stop mode Definition：When INA=INB= L ，then OUTA=OUTB=Hi -Z M ON OFF OFF ON Q3Q1 M OFF ON ON OFF Q3Q1 M OFF OFF ON ON Q3Q1 M OFF OFF OFF OFF Q3Q1 a) Forward mode b) Reverse mode c) Brake mode d) Stop mode Protection Mechanisms Descriptions 1) Thermal shutdown protection (TSD) If the IC junction temperature exceeds 175℃ (Typ.), the internal overtemperature protection function will be triggered, all FETs in the H-bridge are disabled, that will ensure the safety of customers' products. If the IC junction temperature falls to 120℃(Typ.), the IC resumes automatically. 2) Overcurrent protection (OCP) When the IC conducts a large current, 8 .0A (Typ), the internal overcurrent protection function will be triggered, the H -bridge are disabled (Hiz state) . After approximately 5.3 ms, the bridge is re -enabled automatically. Overcurrent conditions on both high and low -side devices, that is, a short to ground, supply, or across the motor winding all result in an overcurrent shutdown. 3) nFAULT table Protection Functionality Condition H-Bridge Becomes nFAULT Becomes Recovery Overcurrent (OCP) IOUT > IOCP(8A) Disable Low TOCP (5.3ms) Thermal shutdown(TSD) TJ > 175℃ Disable Low Tj < 120℃ Undervoltage (UVLO) VCC < 8.7V Disable Low VCC > 9.4V
AMtek semiconductors July. 2020 V0.2 - 8 - Propagation Delay Time Time Parameter Symbol Typical Unit Conditions Output enable time T1 1300 ns TA = 25℃, VCC=PVCC=24 V , Rload=50 Ω Forward to Brake mode time T2 350 ns Brake to Reverse mode time T3 1300 ns Output disable time T4 300 ns Output rise time Tr 700 ns Output fall time Tf 100 ns Hi-ZHi-Z Hi-Z IN_A IN_B OUT_A OUT_B Hi-Z T Td4 Tr Tf OUT_X Tr : Output voltage rising from 10% to 90%. Tf : Output voltage falling from 90%to 10%.
AMtek semiconductors July. 2020 V0.2 - 9 - Thermal Information (T.B.F) Θja junction-to-ambient thermal resistance ??℃/W Ψjt junction-to-top characterization parameter ??℃/W Θja is obtained in a simulation on a JEDEC-standard 2s2p board as specified in JESD-51. The Θja number listed above gives an estimate of how much temperature rise is expected if the device was mounted on a standard JEDEC board. When mounted on the actual PCB, the Θja value of JEDEC board is totally different than the Θja value of actual PCB. Ψjt is extracted from the simulation data to obtain Θja using a procedure described in JESD-51, which estimates the junction temperature of a device in an actual PCB. The thermal characterization parameter, Ψjt, is proportional to the temperature difference between the top of the package and the junction temperature. Hence, it is useful value for an engineer verifying device temperature in an actual PCB environment as described in JEDEC JESD-51-12. When Greek letters are not available, Ψjt is written Psi-jt. Definition: Tj Tt PTT dtjjt /)( −=ψDEFINITION : Where : Ψjt (Psi-jt) = Junction-to-Top(of the package) °C/W Tj= Die Junction Temp. °C Tt = Top of package Temp at center . °C Pd= Power dissipation. Watts Practically, most of the device heat goes into the PCB, there is a very low heat flow through top of the package, So the temperature difference between Tj and Tt shall be small, that is any error caused by PCB variation is small. This constant represents that Ψjt is completely PCB independent and could be used to predict the Tj in the environment of the actual PCB if Tt is measured properly.
AMtek semiconductors July. 2020 V0.2 - 10 - How to predict Tj in the environment of the actual PCB Step 1 : Used the simulated Ψjt value listed above. Step 2 : Measure Tt value by using Thermocouple Method We recommend use of a small ~40 gauge(3.15mil diameter) thermocouple. The bead and thermocouples wires should touch the top of the package and be covered with a minimal amount of thermally conductive epoxy. The wires should be heat-insulated to prevent cooling of the bead due to heat loss into wires. This is important towards preventing “too cool” Tt measurements, which would lead to the calculated Tj also being too cool. IR Spot Method An IR Spot method should be utilized only when using a tool with a small enough spot area to acquire the true top center “hot spot”. Many so-called “small spot size” tools still have a measurement area of 0~100+mils at “zero” distance of the tool from the surface. This spot area is too big for many smaller packages and likely would result in cooler readings than the small thermocouple method. Consequently, to match between spot area and package surface size is important while measuring Tt with IR sport method. Step 3 : calculating power dissipation by P ≅(VCC–|Vo_Hi – Vo_Lo|) x Iout + VCC x Icc Step 4 : Estimate Tj value by Tj= Ψjt x P+Tt Step 5 : Calculated Θja value of actual PCB by the known Tj Θja(actual) = (Tj-Ta)/P
AMtek semiconductors July. 2020 V0.2 - 11 - Maximum Power Dissipation (de-rating curve) under JEDEC PCB & actual PCB (T.B.F)
AMtek semiconductors July. 2020 V0.2 - 12 - Packaging outline --- SOP16 Unit : mm SYMBOL MILLIMETERS INCHES Min. Max. Min. Max. A -- 1.75 -- 0.069 A1 0.05 0.225 0.002 0.009 A2 1.30 1.50 0.051 0.059 A3 0.60 0.70 0.024 0.028 b 0.39 0.48 0.015 0.019 c 0.21 0.26 0.008 0.010 D 9.70 10.10 0.382 0.398 E 5.80 6.20 0.228 0.244 E1 3.70 4.10 0.146 0.161 e 1.27 TYP . 0.05 TYP . h 0.25 0.50 0.010 0.020 L 0.50 0.80 0.020 0.031 L1 1.05 TYP 0.041 TYP .
AMtek semiconductors July. 2020 V0.2 - 13 - Marking Identification Device : AM2908 NOTE: Row1：Logo Row2 ：Device Name Row3 ：Wafer Lot No use six codes + Assembly Year use one code + Assembly Week use two codes Assembly Week Code Assembly Year Code Wafer Lot No Example：Wafer lot no is RH8NH0 + Year 2020 is A + Week12 is 12， we type〝RH8NH0A12〞 The last code of assembly year, explanation as below: (Year：A=0,B=1,C=2,D=3,E=4,F=5,G=6,H=7,I=8,J=9. Year 2020=A)