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semiconductors Mar. 2021 V1.3 - 1 - One Channel H-Bridge Motor Driver AM1016A
- Features and Benefits Wide Supply Voltage Range (2.0V~6.8V) 0.9A Continuous Current, 2A Peak Current Low Standby Mode Current (Typ=0.01μA) Low Quiescent Operation Current Low MOSFETs On-resistance 0.6Ω@Io=0.2A; 0.65Ω@Io=0.6A Provide Four Operation Modes: Forward/Reverse/Stop/Brake Thermal Shutdown Protection SOT23-6 Package for Small Size PCB Layout Pb-Free and Halogen-Free Green Product
- Applications Toys Small Appliances Robotics Consumer Products
- Description The AM1016A is one channel H -Bridge driver . It provides integrated motor driver solution for t oys, robotics, consumer products and other low voltage or battery-powered motion control applications. The AM1016A can supply up to 0. 9 A continuous current and 2.0 A peak current. There is internal shutdown function for over-temperature protection. The small package, reducing 20% package size compared with SOP8 size, have a miniaturizing advantage even more. Package material is Pb -Free and Halogen -Free (Green) for the purpose of environmental protection and for sustainable development of the Earth. Ordering Information Orderable Part Number Package AM1016A SOT23-6
semiconductors Mar. 2021 V1.3 - 2 - Absolute Maximum Ratings (TA =25℃) *Based on 20x20 mm2 FR4 PCB (1 oz.) at single side PCB Recommended operating conditions (TA =25℃) (Set the power supply voltage taking allowable dissipation into considering) Parameter Symbol Min Typ Max Unit Power Supply Voltage VCC 2.0 6.8 V IN_A and IN_B VIN_X - 0.3 Vcc+0.3 V Output Continuous Current Io 0 0. 9 * A Externally Applied PWM Frequency FIN_X 0.02 65 KHZ *Based on 20x20 mm2 FR4 PCB (1 oz.) at single side PCB Parameter Symbol Limits Unit Power Supply voltage VCC 7.0 V Output Continuous Current Io CONT 0.9 * A Output Peak Current Io Peak 2.0 A Operate Temperature Range Topr -40～+85 ℃ Storage Temperature Range Tstg -40～+150 ℃
semiconductors Mar. 2021 V1.3 - 3 - Electrical Characteristics ( Unless otherwise specified, TA = 25℃,VCC=5V) Parameter Symbol Limit Unit Conditions Min Typ Max Power Supplies Quiescent Operation Current ICC 65 μA Input signal IN_A/B= L/H or H/L or H/H, No load on OUT_A/B Standby Current ISTB 0.01 1 μA Input signal IN_A/B= L/L, No load on OUT_A/B PWM Inputs Input H Level Voltage VIN_XH 2.0 VCC V Input L Level Voltage VIN_XL -0.3 0.7 V Input H Level Current IIN_X 30 μA VCC = 5 V , VIN_X = 3 V Input Frequency FIN_X 0.02 65 kHz Input Pull-Down Resistance RIN_X 100 KΩ H-Bridge FETs On-Resistance Rds(on) 0.6 Ω IO = 200mA Upper and Lower total On-Resistance Rds(on) 0.65 Ω IO = 600mA Upper and Lower total TSD Protections Thermal Shutdown Protection TSDp 150 ℃ Thermal Shutdown Release TSDr 125 ℃
semiconductors Mar. 2021 V1.3 - 4 - Block Diagram VCC GND OUT_A OUT_B Level Shifter Level Shifter High-side / Low-side Driver MG1 MG2 MG4 MG3 IN_A IN_B TSD MG3MG1 MG4MG2 Input Logic Descriptions Function truth table IN_A IN_B OUT_A OUT_B Mode L L Hi-Z Hi-Z Stop L H L H Reverse H L H L Forward H H L L Brake ※Low standby mode current function when IN_A = IN_B = Low level
semiconductors Mar. 2021 V1.3 - 5 - Pin configuration SOT23-6 TOP VIEW IN_B VCC OUT_B IN_A GND OUT_A Pin Descriptions PIN Number Pin Name I/O Description
1 IN_B I Input Half Bridge B
2 GND - Ground Pin
3 IN_A I Input Half Bridge A
4 OUT_A O Output Half Bridge A
5 VCC - Power Supply
6 OUT_B O Output Half Bridge B
semiconductors Mar. 2021 V1.3 - 6 - Application IN_A GND IN_B OUT_A VCC OUT_B IN_A IN_B C410μF~220μF 0.1μF 0.1μFM0.1μF Circuit Descriptions The function descriptions of capacitors on the application circuit: C1、C2: Power supply VCC pin capacitor: 1) The capacitor can reduce the power spike when the motor is in motion. To avoid the IC directly damaged by the VCC peak voltage. It also can stabilize the power supply voltage and reduce its ripples. 2) The C1 capacitor can compensate power when motor starts running. 3) T h e c a p a c i t or v a l u e ( μ F) d e t e r mi n e s t h e s t ab il i t y o f t h e V CC d u ri n g m o t or in m o ti o n . If t h e l ar ge vo l t a ge power or a heavy loading motor is used, then a larger capacitor would be needed. 4) On the PCB configuration, the C1、C2 must be mounted as close as possible to VCC pin (PIN5). C3: The across-output capacitor ; C4: The across -motor capacitor 1) The capacitors can reduce the power spike of motor when operating. Therefore, a 0.1μF capacitor is recommended. 2) On the PCB configuration, the C3 must be mounted as close as possible to OUT_A&B (PIN 4&PIN 6). 3) The C4 capacitor single-ended can be welded on the motor shell. 4) The C3、C4 capacitor must be added to the general application.
semiconductors Mar. 2021 V1.3 - 7 - Operating Mode Descriptions 1) H-Bridge basic operating mode： a) Forward mode Definition：When IN_A=H ，IN_B=L，then OUT_A=H ，OUT_B=L b) Reverse mode Definition：When IN_A=L ，IN_B=H，then OUT_ A=L，OUT_B=H c) Stop/Brake mode Definition：When IN_A=IN_B= H ，then OUT_A=OUT_B=L d) Stop mode Definition：When IN_A=IN_B= L ，then OUT_A=OUT_B=Hi -Z M ON OFF OFF ON M OFF ON ON OFF M OFF OFF ON ON M OFF OFF OFF OFF a) Forward mode b) Reverse mode c) Brake mode d) Stop mode Protection Mechanisms Descriptions 1) Over-temperature protection If the IC junction temperature exceeds 150 ﾟ C (Typ .), the internal over-temperature protection function will be triggered, and all FETs in the H -bridge are disabled, that will ensure the safety of customers' products. If the IC junction temperature falls to 125 ﾟ C(Typ.), the IC resumes automatically.
semiconductors Mar. 2021 V1.3 - 8 - Thermal Information θja junction-to-ambient thermal resistance 277.78℃/W Ψjt junction-to-top characterization parameter 20.6℃/W Θja is obtained in a simulation on a JEDEC-standard 1s0p board as specified inJESD-51. The Θja number listed above gives an estimate of how much temperature rise is expected if the device was mounted on a standard JEDEC board. When mounted on the actual PCB, the Θja value of JEDEC board is totally different than the Θja value of actual PCB. Ψjt is extracted from the simulation data to obtain Θja using a procedure described in JESD-51, which estimates the junction temperature of a device in an actual PCB. The thermal characterization parameter, Ψjt, is proportional to the temperature difference between the top of the package and the junction temperature. Hence, it is useful value for an engineer verifying device temperature in an actual PCB environment as described in JEDEC JESD-51-12. When Greek letters are not available, Ψjt is written Psi-jt. Definition: Where : Ψjt (Psi-jt) = Junction-to-Top(of the package) °C/W Tj= Die Junction Temp. °C Tt = Top of package Temp at center. °C Pd = Power dissipation. Watts Practically, most of the device heat goes into the PCB, there is a very low heat flow through top of the package, s o the temperature difference between Tj and Tt shall be small, that is any error caused by PCB variation is small. This constant represents that Ψjt is completely PCB independent and could be used to predict the Tj in the environment of the actual PCB if Tt is measured properly. Tt Tj PTT dtjjt /)( −=ψDFEINITION :
semiconductors Mar. 2021 V1.3 - 9 - How to predict Tj in the environment of the actual PCB Step 1 : Used the simulated Ψjt value listed above. Step 2 : Measure Tt value by using Thermocouple Method We recommend use of a small ~40 gauge(3.15mil diameter) thermocouple. The bead and thermocouples wires should touch the top of the package and be covered with a minimal amount of thermal ly conductive epoxy. The wires should be heat -insulated to prevent cooling of the bead due to heat loss into wires. This is important towards preventing “too cool” Tt measurements, which would lead to the calculated Tj also being too cool. IR Spot Method An IR Spot method should be utilized only when using a tool with a small enough spot area to acquire the true top center “hot spot”. Many so-called “small spot size” tools still have a measurement area of 0~100+mils at “zero” distance of the tool from the surface. This spot area is too big for many smaller packages and likely would result in cooler readings than the small thermocouple method. Consequently, to match between spot area and package surface size is important while measuring Tt with IR sport method. Step 3 : calculating power dissipation by P ≅(VCC–|Vo_Hi – Vo_Lo|) x Iout + VCC x Icc Step 4 : Estimate Tj value by Tj= Ψjt x P+Tt Step 5: Calculated Θja value of actual PCB by the known Tj Θja(actual) = (Tj-Ta)/P
semiconductors Mar. 2021 V1.3 - 10 - Maximum Power Dissipation (de-rating curve) under JEDEC PCB & actual PCB
semiconductors Mar. 2021 V1.3 - 11 - Packaging outline --- SOT23-6 Unit: mm c D Θ e 0.25 L A b E SYMBOL MILLIMETERS INCHES Min. Max. Min. Max. A -- 1.35 -- 0.053 A1 0.04 0.15 0.002 0.006 A2 1.00 1.20 0.039 0.047 A3 0.55 0.75 0.022 0.030 b 0.34 0.43 0.013 0.017 c 0.15 0.21 0.006 0.008 D 2.72 3.12 0.107 0.123 E 2.60 3.00 0.102 0.118 E1 1.40 1.80 0.055 0.071 L 0.3 0.6 0.012 0.024 Θ 0 8 0 0.315 e 0.95 BSC 0.037 BSC e1 1.90 BSC 0.075 BSC
semiconductors Mar. 2021 V1.3 - 12 - Marking Identification Row 1 Device Code, Lot number & Date Row 2 Customer specific difference code Notice : The information in this document is subject to change without notice. Please contact AMtek for current specifications. Users should warrant and guarantee that third party Intellectual Property rights are not infringed upon when integrating AMtek products into any application. AMtek will not assume any legal responsibility for any said applications. Row 1 Row 2