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Description
The ACPM-7870 is a linear quad-band / multi-mode power amplifi er module for both GMSK and 8-PSK modulation schemes. There are two amplifi er chains, one is to support GSM850/900 bands, and the other is to support DCS1800/ PCS1900 bands. CoolPAM technology, which is Avago Technologies’ Power Amplifi er technology provides ex- tended talk time with extremely low quiescent current and enhanced effi ciency at low and medium power modes. Reliability Prediction Model Failure rate predictions are based on HTOL test results. The prediction uses an exponential cumulative failure function (constant failure rate) as the reliability predic- tion model to predict failure rate and mean time to failure (MTTF) at various temperatures as shown in Table 2. The wear out mechanisms is therefore not considered. The Arrhenius temperature de-rating equation is used. We as- sume no failure mechanism change between stresses and use conditions. Bias and temperature are alterable stress- es and must be considered with the thermal resistance of the devices when determining the stress condition. The failure rate will have a direct relationship to the life stress. The failure rate prediction was calculated using activation energy of 1.58eV as a conservative estimate. Confi dence intervals are based upon the chi-squared prediction method associated with exponential distribution. Table 1. Life prediction: Table 2. Estimated for Various Channel Temperatures are as follows: under the assumption that one unit failed. FIT rates shown are relatively high due to the limited device hours at product release.
Table 3. Environmental Test Results: Table 4. Operating Life Tests Results: Table 5. Mechanical Tests Information: Drop Test Peak acceleration: 1500Gs. Pulse duration: 0.5ms half-sine pulse. Cycle Bending Test Amplitude 1.0mm, total displacement 2.0mm. Bending Test Bending up to 5mm with 1mm increment. Table 6. Thermal Resistance Information: Table 7. ESD Ratings:
For product information and a complete list of distributors, please go to our web site: www.avagotech.com Avago, Avago Technologies, and the A logo are trademarks of Avago Technologies in the United States and other countries. Data subject to change. Copyright © 2005-2012 Avago Technologies. All rights reserved. AV02-3427EN - May 10, 2012 HBM Class 0 is ESD voltage level < 250V, Class 1A is voltage level between 250V and 500V, Class 1B is voltage level be- tween 500V and 1000V, Class 1C is voltage level between 1000V and 2000V, Class 2 is voltage level between 2000V and 4000V, Class 3A is voltage level between 4000V and 8000V, Class 3B is voltage level > 8000V. MM Class A is ESD voltage level <200V, Class B is voltage level between 200V and 400V, Class C is voltage level > 400V. CDM Class I <200 volts, Class II 200 to <500 volts, Class III 500 to 1000 volts, Class IV >1000 volts ESD Sensitivity Note: ESD Sensitivity Level for Human Body Model and Machine Model necessitate the following handling pre- cautions: 1. Ensure Faraday cage or conductive shield bag is used during transportation processes, 2. If the static charge at SMT assembly station is above device sensitivity level, place an ionizer near to the device for charge neutralization purposes. 3. Personal grounding must be worn at all times when handling the devices. Moisture Sensitivity Classifi cation: Level 3\` Preconditioning per JESD22-A113-D Level 3 was per- formed on all devices prior to reliability testing except ESD and mechanical tests MSL3 Preconditioning (JESD22-A113D): 125 C HTSL for 24hrs + 60C/60%RH for 40hrs + 3XIR Refl ow, 260C peak.