A623308 AMICC | Alldatasheet

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Preliminary 8K X 8 BIT CMOS SRAM PRELIMINARY (December, 2002, Version 0.3) AMIC Technology, Corp. Document Title 8K X 8 BIT CMOS SRAM

Revision History

Rev. No. History Issue Date Remark

0.0 Initial issue July 2, 1999 Preliminary

0.1 Erase 55ns part December 14, 2000

0.2 Add –SI/SU part no. and change ICC1, Isb1 December 11, 2002

0.3 Erase 28-pin TSOP reverse type package December 23, 2002

Preliminary 8K X 8 BIT CMOS SRAM PRELIMINARY (December, 2002, Version 0.3) 1 AMIC Technology, Corp.

Features

n External Operating Voltage: 4.5V to 5.5V n Access times: 70 ns (max.) n Current: A623308-S series: Operating: 35mA (max.) Standby: 10µA (max.) A623308-SI/SU series: Operating: 35mA (max.) Standby: 15µA (max.) n Extended operating temperature range: 0 °C to 70 °C for -S series, -25°C to 85 °C for -SI series, -40°C to 85°C for -SU series. n Full static operation, no clock or refreshing required n All inputs and outputs are directly TTL compatible n Common I/O using three-state output n Data retention voltage: 2.0V (min.) n Available in 28 -pin SOP and TSOP (forward type) packages General Description The A623308 is a low op erating current 65,536 -bit static random access memory organized as 8,192 words by 8 bits and operates on a single 5V power supply. Inputs and three -state outputs are TTL compatible and allow for direct interfacing with common system bus structures. Minimum standby power is drawn by this device when CE is at a high level, independent of the other input levels. Data retention is guaranteed at a power supply voltage as low as 2.0V. Pin Configurations n SOP n TSOP NC A12 I/O0 I/O1 I/O2 GND I/O3 I/O4 I/O5 I/O6 I/O7 CE OE A11 NC WE VCC A10 A623308M 14 15 A623308V A11 2 NC NC A12 I/O6 I/O5 I/O4 I/O3 VSS I/O2 I/O1 I/O0 A10 VCC I/O7 OE WE CE ~~~~

PRELIMINARY (December, 2002, Version 0.3) 2 AMIC Technology, Corp. Block Diagram ROW DECODER

128 X 512

Pin No. Symbol Description 1,26 NC No Connection 2-10, 21, 23-25 A0 - A12 Address Input 11-13, 15-19 I/O0 - I/O7 Data Inputs/Outputs

14 GND Ground

20 CE Chip Enable

22 OE Output Enable

27 WE Write Enable

28 VCC Power Supply

Pin No. Symbol Description 5,8 NC No Connection

1 OE Output Enable

2-4, 9-17, 28 A0 - A12 Address Input

7 VCC Power Supply

6 WE Write Enable

18-20, 22-26 I/O0 - I/O7 Data Inputs/Outputs

21 GND Ground

27 CE Chip Enable

PRELIMINARY (December, 2002, Version 0.3) 3 AMIC Technology, Corp. Recommended DC Operating Conditions (TA = 0°C to +70°C, -25°C to +85°C or -40°C to +85°C) Symbol Parameter Min. Typ. Max. Unit VCC Supply Voltage 4.5 5.0 5.5 V GND Ground 0 0 0 V VIH Input High Voltage 2.2 3.5 VCC + 0.3 V VIL Input Low Voltage -0.3 0 +0.8 V Absolute Maximum Ratings* *Comments Stresses above those listed under "Absolute Maximum Ratings" may cause pe rmanent damage to the device. These are stress ratings only. Functional operation of this device at these or any other conditions above those indicated in the operational sections of this specification is not implied and exposure to absolute maximum rating conditions for extended periods may affect device reliability. Symbol Parameter A623308-70S A623308-70SI/SU Unit Conditions Min. Max. Min. Max. ILI Input Leakage Current - 1 - 1 µA VIN = GND to VCC ILO Output Leakage Current - 1 - 1 µA CE = VIH or OE = VIH or WE = VIH VI/O = GND to VCC ICC Active Power Supply Current - 5 - 5 mA CE = VIL, II/O = 0mA ICC1 Dynamic Operating Current - 35 - 35 mA Min. Cycle, Duty = 100% CE = VIL, II/O = 0mA ICC2 Dynamic Operating Current - 5 - 5 mA CE = VIL, VIH = VCC VIL = 0V, f = 1 MHz II/O = 0 mA

PRELIMINARY (December, 2002, Version 0.3) 4 AMIC Technology, Corp. Symbol Parameter A623308-70S A623308-70SI/SU Unit Conditions Min. Max. Min. Max. ISB Supply Current - 0.5 - 0.5 mA CE = VIH ISB1 Standby Power - 10 - 15 µA CE ≥ VCC - 0.2V VIN ≥ 0V VOL Output Low Voltage - 0.4 - 0.4 V IOL = 2.1mA VOH Output High Voltage 2.4 - 2.4 - V IOH = -1.0mA Truth Table Mode CE OE WE I/O Operation Supply Current Standby H X X High Z ISB, ISB1 Output Disable L H H High Z ICC, ICC1, ICC2 Read L L H DOUT ICC, ICC1, ICC2 Write L X L DIN ICC, ICC1, ICC2 Note: X: H or L Capacitance (TA = 25°C, f = 1.0 MHz) Symbol Parameter Min. Max. Unit Conditions CIN* Input Capacitance 6 pF VIN = 0V CI/O* Input/Output Capacitance 8 pF VI/O = 0V * These parameters are sampled and not 100% tested.

PRELIMINARY (December, 2002, Version 0.3) 5 AMIC Technology, Corp. AC Characteristics (TA = 0°C to +70°C, -25°C to +85°C or -40°C to +85°C, VCC = 5.0V ± 10%) Symbol Parameter A623308-70S/SI/SU Unit Min. Max. Read Cycle tRC Read Cycle Time 70 - ns tAA Address Access Time - 70 ns tACE Chip Enable Access Time - 70 ns tOE Output Enable to Output Valid - 35 ns tCLZ Chip Enable to Output in Low Z 10 - ns tOLZ Output Enable to Output in Low Z 5 - ns tCHZ Chip Disable to Output in High Z - 25 ns tOHZ Output Disable to Output in High Z - 25 ns tOH Output Hold from Address Change 5 - ns Write Cycle tWC Write Cycle Time 70 - ns tCW Chip Enable to End of Write 60 - ns tAS Address Set up Time 0 - ns tAW Address Valid to End of Write 60 - ns tWP Write Pulse Width 50 - ns tWR Write Recovery Time 0 - ns tWHZ Write to Output in High Z - 30 ns tDW Data to Write Time Overlap 30 - ns tDH Data Hold from Write Time 0 - ns tOW Output Active from End of Write 5 - ns Notes: tCHZ, t OHZ and t WHZ are defined as the time at which the outputs achieve the open circuit condition and are not referred to output voltage levels.

PRELIMINARY (December, 2002, Version 0.3) 6 AMIC Technology, Corp. Timing Waveforms Read Cycle 1 (1) tRC tAA tOH Address DOUT tOHZ5 tCHZ5 tACE tCLZ5 tOLZ5 tOE CE OE Read Cycle 2 (1, 2, 4) tRC tOH tAA tOH Address DOUT

PRELIMINARY (December, 2002, Version 0.3) 7 AMIC Technology, Corp. Timing Waveforms (continued) Read Cycle 3 (1, 3, 4) tCLZ 5 tACE tCHZ 5 CE DOUT Notes: 1. WE is high for Read Cycle. 2. Device is continuously enabled, CE = VIL. 3. Address valid prior to or coincident with CE transition low. 4. OE = VIL. 5. Transition is measured ±500mV from steady state. This parameter is sampled and not 100% tested. Write Cycle 1 (6) (Write Enable Controlled) tWC Address CE DIN tOW 7 tDHtDW tWHZ 7 tWP2tAS1 (4) tCW5 tAW tWR3 WE DOUT

PRELIMINARY (December, 2002, Version 0.3) 8 AMIC Technology, Corp. Timing Waveforms (continued) Write Cycle 2 (6) (Chip Enable Controlled) tWC Address CE DIN tDHtDW (4) tCW5 tAW tWR3 WE DOUT tWHZ7 tWP2 tAS1 Notes: 1. tAS is measured from the address valid to the beginning of Write. 2. A Write occurs during the overlap (tWP) of a low CE and a low WE . 3. tWR is measured from the earliest of CE or WE going high to the end of the Write cycle. 4. If the CE low transition occurs simultaneously with the WE low transition or after the WE transition, outputs remain in a high impedance state. 5. tCW is measured from the later of CE going low to the end of Write. 6. OE level is high or low. 7. Transition is measured ±500mV from steady. This parameter is sampled and not 100% tested.

PRELIMINARY (December, 2002, Version 0.3) 9 AMIC Technology, Corp. Figure 1. Output Load Figure 2. Output Load for tCLZ

PRELIMINARY (December, 2002, Version 0.3) 10 AMIC Technology, Corp.

Ordering Information

Part No. Access Time (ns) Operating Current Max. (mA) Standby Current Max. (µA) Package A623308M-70S 35 10 28L SOP A623308V-70S 35 10 28L TSOP (Forward) A623308M-70SI 35 15 28L SOP A623308V-70SI 35 15 28L TSOP (Forward) A623308M-70SU 35 15 28L SOP A623308V-70SU 35 15 28L TSOP (Forward)

PRELIMINARY (December, 2002, Version 0.3) 11 AMIC Technology, Corp.

Package Information

SOP (W.B.) 28L Outline Dimensions unit: inches/mm E H L c See Detail F Detail F B 1528 A1 A2 A S D Seating Plane D y ey θ Dimensions in inches Dimensions in mm Symbol Min Nom Max Min Nom Max D - 0.713 0.728 - 18.11 18.49 θ 0° - 8° 0° - 8° Notes: 1. The maximum value of dimension D includes end flash. 2. Dimension E does not include resin fins. 3. Dimension S includes end flash.

PRELIMINARY (December, 2002, Version 0.3) 12 AMIC Technology, Corp. E e D L A c Detail "A" D y Detail "A" S b θ TSOP 28L TYPE I (8 X 13.4mm) Outline Dimensions unit: inches/mm Dimensions in inches Dimensions in mm Symbol Min Nom Max Min Nom Max c 0.005 - 0.008 0.12 - 0.21 e 0.022 BSC 0.55 BSC S 0.017 TYP 0.425 TYP θ 0° - 5° 0° - 5° Notes: 1. The maximum value of dimension D1 includes end flash. 2. Dimension E does not include resin fins. 3. Dimension S includes end flash.