74ALS08_V01 SS | Alldatasheet
Document overview
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Technical content
www.siliconsupplies.com /g3 Die Size (Unsawn) 1600 x 1100 63 x 43 µm mils Minimum Bond Pad Size 130 x 130 5.12 x 5.12 µm mils Die Thickness 350 (±20) 13.78 (±0.79) µm mils Top Metal Composition Al 1%Si 1.1µm Back Metal Composition N/A – Bare Si Advanced Low Power Schottky Logic – 74ALS08 Quad 2-Input AND Gate in bare die form High speed – 4ns (Min) propagation delay Direct drop-in replacement for obsolete components in long term programs. Rev 1.1 23/01/24 Features:
Ordering Information
The following part suffixes apply: No suffix - MIL-STD-883 /2010B Visual Inspection For High Reliability versions of this product please see 54ALS08 Supply Formats: Mechanical Specification Default – Die in Waffle Pack (300 per tray capacity) Sawn Wafer on Tape – On request Unsawn Wafer – On request Die Thickness <> 350µm(14 Mils) – On request Assembled into Ceramic Package – On request The 74ALS08 quad 2-input AND gate is fabricated using using a 2µm 40V Bipolar process. The device consists of four independent 2-input AND gates with standard push-pull outputs and performs the Boolean function Y = A ● B or Y = A + B. All inputs are protected against ESD and excess voltage transients.
Description
Die Dimensions in µm (mils) 1600 (63) 1100 (43)
www.siliconsupplies.com d Advanced Low Power Schottky Logic – 74ALS08 Rev 1.1 23/01/24 COORDINATES (mm) PAD FUNCTION X Y 1 1A 0.100 0.180 2 1B 0.315 0.100 3 1Y 0.625 0.100 4 2A 0.825 0.100 5 2B 1.025 0.100 6 2Y 1.370 0.260 7 GND 1.370 0.450 8 3Y 1.370 0.640 9 3A 1.015 0.825 10 3B 0.825 0.825 11 4Y 0.625 0.825 12 4A 0.425 0.825 13 4B 0.100 0.725 14 VCC 0.100 0.460 CONNECT CHIP BACK TO GND Pad Layout and Functions 1600µm (62.99 mils) 1100µm (43.41 mils) 0,0 2 3 4 5 9 10 11 12 Function Table INPUTS OUTPUT A B Y L L L L H L H L L H H H H = High level (steady state) L = Low level (steady state) Logic Diagram Pad 14 = VCC Pad 7 = GND
www.siliconsupplies.com Advanced Low Power Schottky Logic – 74ALS08 Rev 1.1 23/01/24 PARAMETER SYMBOL MIN MAX UNITS Supply Voltage VCC 4.5 5.5 V High-Level Input Voltage VIH 2 - V Low-Level Input Voltage VIL - 0.8 V High-Level Output Current IOH - -0.4 mA Low-Level Output Current IOL - 8 mA Operating Temperature Range TJ -40 +55 °C Recommended Operating Conditions Absolute Maximum Ratings1 PARAMETER SYMBOL VALUE UNIT DC Supply Voltage VCC 7.0 V DC Input Voltage VIN 7.0 V Storage Temperature Range TSTG -65 to 150 °C LIMITS PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Minimum High-Level Input Voltage VIH - 2 - - V Maximum Low-Level Input Voltage VIL - - - 0.8 V Input Clamp Diode Voltage VIK VCC = MIN IIN = -18mA - - -1.5 V Output Voltage High VOH VCC = 4.5V to 5.5V, IOH = -0.4mA VCC -2 - - V IOL = 4mA - 0.25 0.4 Output Voltage Low VOL VCC = 4.5V IOL = 8mA - 0.35 0.5 V Input Current IIN VCC = 5.5V, VIN = 7V - - 0.1 mA Input High Current IIH VCC = 5.5V, VIN = 2.7V - - 20 µA Input Low Current IIL VCC = 5.5, VIN = 0.4V - - -0.1 mA Output Current3 IO VCC = 5.5, VOUT = 2.25V -30 - -112 mA ICCH VCC = 5.5V , VIN = 4.5V - 1.3 2.4 Power Supply Current (Total) ICCL VCC = 5.5V , VIN = 0V - 2.2 4 mA 2. All typical values @ VCC = 5V, TJ = 25°C. 3. Output conditions have been chosen to produce a current that closely approximates one half of the true short-circuit output current, IOS 1. Operation above the absolute maximum rating may cause device failure. Operation at the absolute maximum ratings, for extended periods, may reduce device reliability.
www.siliconsupplies.com Advanced Low Power Schottky Logic – 74ALS08 Rev 1.1 23/01/24 AC Electrical Characteristics4 TJ = -40°C to 85°C unless otherwise specified LIMITS PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS tPLH 4 - 14 Propagation Delay, A or B to output Y tPHL VCC = 4.5 to 5.5V, CL = 50pF, RL = 500Ω 3 - 10 ns 4. Not production tested in die form, characterized by chip design and tested in package. DISCLAIMER: The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Silicon Supplies Ltd hereby disclaims any and all warranties and liabilities of any kind. Test Circuit Switching Waveform LIFE SUPPORT POLICY: Silicon Supplies Ltd components may be used in life support devices or systems only with the express written approval of Silicon Supplies Ltd, if a failure of such components can reasonably be expected to cause the failure of that life support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. DUT CL* OUTPUT TEST POINT * Includes all probe and jig capacitance