74ALS00 SS | Alldatasheet
Document overview
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Technical content
www.siliconsupplies.com /g3 Die Size (Unsawn) 1300 x 1200 51 x 47 µm mils Minimum Bond Pad Size 130 x 130 5.12 x 5.12 µm mils Die Thickness 350 (±20) 13.78 (±0.79) µm mils Top Metal Composition Al 1%Si 1.1µm Back Metal Composition N/A – Bare Si Advanced Low Power Schottky Logic – 74ALS00 Quad 2-Input NAND Gates in bare die form High speed – 3ns (Min) propagation delay Direct drop-in replacement for obsolete components in long term programs. Rev 1.0 23/11/19 Features:
Ordering Information
The following part suffixes apply: No suffix - MIL-STD-883 /2010B Visual Inspection For High Reliability versions of this product please see 54ALS00 Supply Formats: Mechanical Specification Default – Die in Waffle Pack (300 per tray capacity) Sawn Wafer on Tape – On request Unsawn Wafer – On request Die Thickness <> 350µm(14 Mils) – On request Assembled into Ceramic Package – On request Die Dimensions in µm (mils) 1300 (51) 1200 (47) 74ALS00 provides x4 independent 2-input NAND gates performing the Boolean function Y = A • B or Y = A + B. The device is fabricated using a 1.5µm 40V Bipolar process. Internal circuitry comprises of 3 stages and includes buffered outputs for high noise immunity and stability. All inputs are equipped with protection circuits against static discharge and transient excess voltage.
Description
www.siliconsupplies.com d Advanced Low Power Schottky Logic – 74ALS00 Rev 1.0 23/11/19 COORDINATES (mm) PAD FUNCTION X Y 1 1A 0.100 0.345 2 1B 0.155 0.100 3 1Y 0.345 0.100 4 2A 0.535 0.100 5 2B 0.725 0.100 6 2Y 0.770 0.345 7 GND 0.770 0.535 8 3Y 0.770 0.725 9 3A 0.725 0.970 10 3B 0.535 0.970 11 4Y 0.345 0.970 12 4A 0.155 0.970 13 4B 0.100 0.725 14 VCC 0.100 0.535 CONNECT CHIP BACK TO GND OR FLOAT Pad Layout and Functions 1300µm (51.18 mils) 1200µm (47.24 mils) 0,0 5 4 3 2 1 6 9 10 11 12 Logic Diagram Function Table INPUTS OUTPUT A B Y L L H H L H L H H H H L H = High level (steady state) L = Low level (steady state)
www.siliconsupplies.com Advanced Low Power Schottky Logic – 74ALS00 Rev 1.0 23/11/19 PARAMETER SYMBOL MIN MAX UNITS Supply Voltage VCC 4.5 5.5 V High-Level Input Voltage VIH 2 - V Low-Level Input Voltage VIL - 0.8 V High-Level Output Current IOH - -0.4 mA Low-Level Output Current IOL - 8 mA Operating Temperature Range TJ -40 +85 °C Recommended Operating Conditions Absolute Maximum Ratings1 PARAMETER SYMBOL VALUE UNIT DC Supply Voltage VCC 7.0 V DC Input Voltage VIN 7.0 V Storage Temperature Range TSTG -65 to 150 °C LIMITS PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Minimum High-Level Input Voltage VIH - 2 - - V Maximum Low-Level Input Voltage VIL - - - 0.8 V Input Clamp Diode Voltage VIK VCC = MIN IIN = -18mA - - -1.5 V Output Voltage High VOH VCC = 4.5V to 5.5V, IOH = -0.4mA VCC -2 - - V IOL = 4mA - 0.25 0.4 Output Voltage Low VOL VCC = 4.5V IOL = 8mA - 0.35 0.5 V Input Current IIN VCC = 5.5V, VIN = 7V - - 0.1 mA Input High Current IIH VCC = 5.5V, VIN = 2.7V - - 20 µA Input Low Current IIL VCC = 5.5, VIN = 0.4V - - -0.1 mA Output Current3 IO VCC = 5.5, VOUT = 2.25V -30 - -112 mA ICCH VCC = 5.5V , VIN = 4.5V - 0.5 0.85 Power Supply Current (Total) ICCL VCC = 5.5V , VIN = 0V - 1.5 3 mA 2. All typical values @ VCC = 5V, TJ = 25°C. 3. Output conditions have been chosen to produce a current that closely approximates one half of the true short-circuit output current, IOS 1. Operation above the absolute maximum rating may cause device failure. Operation at the absolute maximum ratings, for extended periods, may reduce device reliability.
www.siliconsupplies.com Advanced Low Power Schottky Logic – 74ALS00 Rev 1.0 23/11/19 AC Electrical Characteristics4 TJ = -55°C to 125°C unless otherwise specified LIMITS PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS tPLH 3 - 11 Propagation Delay, A or B to output Y VCC = 4.5 to 5.5V, CL = 50pF, RL = 500Ω 2 - 8 ns tPHL 4. Not production tested in die form, characterized by chip design and tested in package. DISCLAIMER: The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Silicon Supplies Ltd hereby disclaims any and all warranties and liabilities of any kind. LIFE SUPPORT POLICY: Silicon Supplies Ltd components may be used in life support devices or systems only with the express written approval of Silicon Supplies Ltd, if a failure of such components can reasonably be expected to cause the failure of that life support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Switching Waveform DUT CL* OUTPUT TEST POINT Test Circuit * Includes all probe and jig capacitance