7407_V01 SS | Alldatasheet
Document overview
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Technical content
www.siliconsupplies.com Die Size (Unsawn) 1450 x 1400 57 x 55 µm mils Minimum Bond Pad Size 140 x 140 5.5 x 5.5 µm mils Die Thickness 350 (±20) 13.78 (±0.79) µm mils Top Metal Composition Al 1%Si 1.1µm Back Metal Composition N/A – Bare Si Bipolar TTL Logic – 7407 High Voltage Hex Buffer / Driver Logic IC in bare die form High Sink-Current Capability: 40mA High Voltage Open-Collector Driver Minimum breakdown voltage: 30V Input Clamp Diodes minimize transmission-line effects TTL compatible inputs Direct drop-in replacement fo r obsolete components in long term programs. Rev 1.0 29/07/20 Features:
Ordering Information
The following part suffixes apply: No suffix - MIL-STD-883 /2010B Visual Inspection For High Reliability versions of this product please see 5407 Supply Formats: Mechanical Specification Default – Die in Waffle Pack (400 per tray capacity) Sawn Wafer on Tape – On request Unsawn Wafer – On request Die Thickness <> 350µm(14 Mils) – On request Assembled into Ceramic Package – On request
Description
Die Dimensions in µm (mils) 1450 (57) 1400 (55) The 7407 comprises x6 buffer/drivers with high voltage open-collector outputs. The device finds use as high-level circuit interface or for driving high-current loads and is also characterised to drive TTL inputs as buffer. The device has a 30V minimum breakdown voltage and 40mA maximum sink current. PART OBSOLETE - DISCONTINUED
d Bipolar TTL Logic – 7407 Rev 1.0 29/07/20 Pad Layout and Functions COORDINATES (mm) PAD FUNCTION X Y 1 1A 0.090 0.380 2 1Y 0.090 0.090 3 2A 0.460 0.090 4 2Y 0.830 0.090 5 3A 1.220 0.090 6 3Y 1.220 0.380 7 GND 1.220 0.630 8 4Y 1.220 0.880 9 4A 1.220 1.170 10 5Y 0.830 1.170 11 5A 0.460 1.170 12 6Y 0.090 1.170 13 6A 0.090 0.880 14 VCC 0.090 0.630 CONNECT CHIP BACK TO GND OR FLOAT Logic Diagram 1450µm (57.11 mils) 10 9 1400µm (55.12 mils) 5 4 3 2 11 12 DIE ID 0,0 Truth Table INPUTS A OUTPUT Y H L Z L H = High level (steady state) L = Low level (steady state) Z = High Impedance Y = A Pad 14 = VCC Pad 7 = GND Page 2 of 4 www.siliconsupplies.com PART OBSOLETE - DISCONTINUED
www.siliconsupplies.com Bipolar TTL Logic – 7407 Rev 1.0 29/07/20 PARAMETER SYMBOL MIN MAX UNITS Supply Voltage VCC 4.75 5.25 V High-Level Input Voltage VIH 2 - V Low-Level Input Voltage VIL - 0.8 V High-Level Output Voltage VOH - 30 V Low-Level Output Current IOL - 40 mA Operating Temperature Range TJ -40 +85 °C Recommended Operating Conditions Absolute Maximum Ratings1 PARAMETER SYMBOL VALUE UNIT DC Supply Voltage VCC 7.0 V DC Input Voltage VIN 5.5 V DC Output Voltage VOUT 30 Storage Temperature Range TSTG -65 to 150 °C LIMITS PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Input Clamp Voltage VIK VCC = 4.75V, IIN = -12mA - - -1.5 V High-Level Output Current IOH VCC = 4.75V, VIH = 2V, VOH = 30V - - 0.25 mA VCC = 4.75V, VIL = 0.8V, IOL = 16mA - - 0.4 Low-Level Output Voltage VOL VCC = 4.75V, VIL = 0.8V, IOL = 40mA - - 0.7 V Input Current IIN VCC = 5.25V, VIN = 5.25V - - 1 mA High-Level Input Current IIH VCC = 5.25V, VIH = 2.4V - - 0.04 mA Low-Level Input Current IIL VCC = 5.25V, VIL = 0.4V - - -1.6 mA VCC = 5.25V ,Output High - - 41 Supply Current ICC VCC = 5.25V ,Output Low - - 30 mA 1. Operation above the absolute maximum rating may cause device failure. Operation at the absolute maximum ratings, for extended periods, may reduce device reliability. PART OBSOLETE - DISCONTINUED
www.siliconsupplies.com Bipolar TTL Logic – 7407 Rev 1.0 29/07/20 AC Electrical Characteristics2 LIMITS PARAMETER SYMBOL CONDITIONS MIN TYP MAX UNITS Turn-Off Delay, Input to Output tPLH - - 10 Turn-On Delay, Input to Output tPHL TA = 25°C, VCC = 5V, RL = 110Ω, CL = 15pF, Input tr = tf = 10ns - - 35 ns 2. Not production tested in die form, characterized by chip design DISCLAIMER: The information given in this document shall in no event be regarded as a guarantee of conditions or characteristics. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Silicon Supplies Ltd hereby disclaims any and all warranties and liabilities of any kind. LIFE SUPPORT POLICY: Silicon Supplies Ltd components may be used in life support devices or systems only with the express written approval of Silicon Supplies Ltd, if a failure of such components can reasonably be expected to cause the failure of that life support device or system or to affect the safety or effectiveness of that device or system. Life support devices or systems are intended to be implanted in the human body or to support and/or maintain and sustain and/or protect human life. If they fail, it is reasonable to assume that the health of the user or other persons may be endangered. Switching Waveform Test Circuit TEST POINT VCC RL DUT OUTPUT CL* * Includes all probe and jig capacitance PART OBSOLETE - DISCONTINUED