124B-150AX2 ATTEND | Alldatasheet
Document overview
- Manufacturer or author: Liu Robin
- PDF pages: 7
Technical content
The information contained herein is exclusive property of Attend. Do not copy and print except that Attend accepts. 本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。 -1 - SPECIFICATION AND PERFORMANCE Series 124B-150AX2 File 124B-150AX2- SPEC_1 Date 2022/10/25 Scope: This specification covers the requirements for product performance, test methods and quality assurance provisions of below P/N DESCRIPTION 124B-150A02 DDR4 Vertical Socket, Type A for 260P DDR SO DIMM 124B-150A12 DDR4 Vertical Socket, Type B for 260P DDR SO DIMM Performance and Descriptions: The product is designed to meet the electrical, mechanical and environmental performance requirements specification. Unless otherwise specified, all tests are performed at ambient environmental conditions. RoHS: All material in according with the RoHS environment related substances list controlled. MATERIALS NO. PART NAME DESCRIPTION
1 Housing LCP, UL94-0, Black
2 Contact Copper alloy, 1u~3u’’ gold plating on contact and solder area , under plating
3 Latch Stainless steel
Rated Current 0.5A per pin Operating Temperature -55°C~85°C 85%RH MAX Durability 50 Cycle ELECTRICAL Item Requirement Test Condition Contact Resistance(Low Level) 40mΩ Max. (Initial) △R 20mΩ Max. (Final) Subject mated contacts assembled in housing to closed circuit current of 100mA (Max.) at open circuit voltage of 20mV voltage (Max.). EIA-364-23 Insulation Resistance 250 MΩ Min. (Initial) 100 MΩ Min. (Final) Measured by applying 500VDC for 2 minutes between adjacent contacts of unmated connector.
The information contained herein is exclusive property of Attend. Do not copy and print except that Attend accepts. 本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。 -2 - EIA-364-21 Withstanding Voltage No Breakdown. Apply 500 VAC for 1 minute between adjacent contacts of unmated connector. EIA-364-20 Contact Current Rating Temperature Rise shall not exceed 30°C above ambient. Contacts of the connector are connected in a series circuit, Supple the rated current (0.5 Amperes) EIA-364 Test Procedure 70 Detail in Annex C Reference impedance Long Pin 46~54Ω Mated connector and module including solder pad and gold finger. EIA-364-108 Short Pin 46~54Ω Insertion Loss -0.4dB (f<=2.0 GHz) -0.5dB (2 GHz <f<=6 GHz) -0.8dB (6 GHz <f<=8 GHz) -1.2dB (8 GHz <f<=10 GHz) Signals with 1:1 S/G EIA-364-101 Return Loss -20dB (f<=2.0 GHz) -18dB (2 GHz <f<=4 GHz) -15dB (4 GHz <f<=6 GHz) -9.0dB (6 GHz <f<=8 GHz) -5.0dB (8 GHz <f<=10 GHz) Signals with 1:1 S/G EIA-364-108 Near End Cross-Talk -35.0dB (f<=1.0 GHz) -31.0dB (1 GHz <f<=2 GHz) -29.0dB (2 GHz <f<=3 GHz) -28.0dB (3 GHz <f<=4 GHz) -27.0dB (4 GHz <f<=10 GHz) 1:1 S/G Same Side Both the victim and the aggressor locate at the same side. EIA-364-90 -16.0dB (f<=1.0 GHz) -11.0dB (1 GHz <f<=2 GHz) -9.0dB (2 GHz <f<=3 GHz) -8.0dB (3 GHz <f<=5 GHz) 2:1 S/G Same Side Both the victim and the aggressor locate at the same side. EIA-364-90 -47.0dB (f<=1.0 GHz) -45.0dB (1 GHz <f<=2 GHz) -42.0dB (2 GHz <f<=3 GHz) -40.0dB (3 GHz <f<=4 GHz) -38.0dB (4 GHz <f<=6 GHz) -35.0dB (6 GHz <f<=8 GHz) -31.0dB (8 GHz <f<=10 GHz) 1:1 S/G Opposite Side The victim and the aggressor locate at the opposite side. EIA-364-90 Far End Cross-Talk -40.0dB (f<=1.0 GHz) -37.0dB (1 GHz <f<=2 GHz) -35.0dB (2 GHz <f<=3 GHz) -32.0dB (3 GHz <f<=4 GHz) -30.0dB (4 GHz <f<=5 GHz) -28.0dB (5 GHz <f<=6 GHz) -27.0dB (6 GHz <f<=7 GHz) -26.0dB (7 GHz <f<=9 GHz) 1:1 S/G Same Side Both the victim and the aggressor locate at the same side. EIA-364-90
The information contained herein is exclusive property of Attend. Do not copy and print except that Attend accepts. 本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。 -3 - -25.0dB (9 GHz <f<=10 GHz) -30.0dB (f<=1.0 GHz) -23.0dB (1 GHz <f<=2 GHz) -20.0dB (2 GHz <f<=3 GHz) -16.0dB (3 GHz <f<=5 GHz) 2:1 S/G Same Side Both the victim and the aggressor locate at the same side. EIA-364-90 -50.0dB (f<=2.0 GHz) -45.0dB (2 GHz <f<=4 GHz) -42.0dB (4 GHz <f<=6 GHz) -38.0dB (6 GHz <f<=8 GHz) -35.0dB (8 GHz <f<=10 GHz) 1:1 S/G Opposite Side The victim and the aggressor locate at the opposite side. EIA-364-90 MECHANICAL Item Requirement Test Condition Module Insertion / Withdrawal Force Insertion force: 59.8 N (6.1kgf) Max. Withdrawal force: 44.6 N (4.55kgf) Max. Measure the force required to mate connectors (Speed: 25.4mm/minute) EIA-364-13 Durability Contact Resistance △R 20mΩ Max. (Final) Connectors shall be subjected to 50 cycles of Insertion and Withdrawal. Automatic Insertion / Withdrawal Speed: 500 cycles/hour Manual Insertion / Withdrawal Speed: 250 cycles/hour EIA-364-09 Reseating No evidence of physical Damage Manually unplug/plug the connector or socket. Perform 3 such cycles. Vibration Contact Resistance △R 20mΩ Max. (Final) Discontinuity: 1µ Sec Max Subject mated connectors 15 minutes in each of 3 mutually perpendicular directions. Both mating halves should be rigidly fixed so as not to contribute to the relative motion of one contact against another. The method of fixturing should be detailed in the test report. EIA-364-28 test condition VII, test condition letter D Physical Shock Contact Resistance △R 20mΩ Max. (Final) Discontinuity: 1µ Sec Max The connectors shall be soldered on the P.C. board. Acceleration: 50 G. Time: 11ms. (half sine wave). Cycle: 3 drops each to normal and reversed directions of X, Y and Z axes, totally 18 drops. EIA-364-27 condition A ENVIRONMENTAL Item Requirement Test Condition Thermal shock Contact Resistance △R 20 mΩ Max.(Final) Mated connectors Temperature:-55+0/-385+3/-0(°C)
The information contained herein is exclusive property of Attend. Do not copy and print except that Attend accepts. 本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。 -4 - Temp. Time: 3030(minute) Cycle: 10 cycles. EIA-364-32, condition I Temperature Life Contact Resistance △R 20 mΩ Max.(Final) Mated connectors Temperature:105°C±2°C Duration: 120 hours EIA-364-17, condition IV Temperature Life (preconditioning) Contact Resistance △R 20 mΩ Max.(Final) Mated connectors Temperature:105°C±2°C Duration: 72 hours EIA-364-17, condition IV Thermal Cycling Contact Resistance △R 20 mΩ Max.(Final) Mated connectors, Cycle the connector or socket between 15°C ±3°C and 85°C ±3°C, as measured on the part. Ramps should be a minimum of 2°C per minute, and dwell times, should insure that the contacts reach the temperature extremes (a minimum of 5 minutes). Humidity is not controlled. Perform 500 such cycles. Humidity-Temperature Cycling Contact Resistance △R 20 mΩ Max.(Final) Mated connectors Temperature Range 25°C~65°C in temperature and 90~95% RH, Duration 10 cycles. (240hours.) EIA-364-31, Method III, Test condition B Mixed flowing ags Contact Resistance △R 20 mΩ Max.(Final) Exposure unmated connector for 112 hours in MFG chamber, expose mated (to same test module mated during temp life preconditioning) connector for 56 hours in MFG chamber. EIA-364-65, class IIA Thermal disturbance Contact Resistance △R 20 mΩ Max.(Final) Cycle the connector or socket between 15°C±3°C and 85°C±3°C, as measured on the part. Ramps should be a minimum of 2°C per minute, and dwell times should ensure that the contacts reach the temperature extremes (a minimum of 5 minutes). Humidity is not controlled. Perform 10 such cycles. Salt spray Contact Resistance △R 20 mΩ Max.(Final) Salt concentration: 5±1% Temperature: 35°C ±2°C Testing time: 48 hours, after salt is removed by running water and a drop is removed, it is measured. EIA-364-26
The information contained herein is exclusive property of Attend. Do not copy and print except that Attend accepts. 本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。 -5 - SOLDER ABILITY Item Requirement Test Condition Solderability 95% min. of solder area 10x the magnifying glass of view Soldering time: 4~5 Second Solder Temperature:245°C±5°C EIA-364-52 Resistance to Reflow Soldering Heat No physical damage shall occur. Test connector on PCB Pre-heat: 150°C~200°C, 60~120 Sec Heat: Up 217°C, 60~150 Sec Ramp up rate 3°C/Sec Max. Ramp down rate 6°C/Sec Max. Peak temp: 260°C Max. IPC/JEDEC J-STD-020D.1
The information contained herein is exclusive property of Attend. Do not copy and print except that Attend accepts. 本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。 -6 - Reflow Profile Preheating temperature: 150 ~ 200°C, 60~120 seconds Liquidus temperature (TL): 217°C, 60~150 seconds Peak temperature: 260°C Time within 5 °C of peak temperature (Tc): 255°C, 30seconds
The information contained herein is exclusive property of Attend. Do not copy and print except that Attend accepts. 本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。 -7 - Product Qualifications and Test Sequence Test of Examination Test Group A B C D E F G H I J K Test Sequence Examination or product 1,9 1,3 1,7 1,8 1,8 1,10 1,10 1,10 1,12 1,5 1,4 Insulation resistance 3,7 Withstanding Voltage 4,8 Contact Current Rating 2 Reference impedance 2 Insertion Loss 3 Return Loss 4 Near End Cross-Talk 5 Far End Cross-Talk 6 Module insertion / Withdrawal Force 3,6 Durability 5 4 3 3 3 3 3 Reseating 5 6 8 8 10 Vibration 6 Physical Shock 8 Solder ability 3 Thermal Shock 4 Temperature Life 4 Temperature Life (preconditioning) 4 4 4 Thermal Cycling 6 Humidity-Temperature Cycling 6 Mixed flowing gas 6 Thermal disturbance 8 Salt spray 3 Resistance to Reflow Soldering Heat 2