123A

123A ATTEND | Alldatasheet

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• Manufacturer or author: Liu Robin
• PDF pages: 5

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The information contained herein is exclusive property of ATTEND. Do not copy and print except that Attend accepts. 本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。 -1 - SPECIFICATION AND PERFORMANCE Series 123A Series File 123A-XXX00_SPEC_1.1 Date 2019/12/06 Scope: This specification covers the requirements for product performance, test methods and quality assurance provisions of below P/N Descriptions 123A-21A00 M.2 Socket, H2.1 A Key 0.5 Pitch G/F, Black, Reel 123A-21B00 M.2 Socket, H2.1 B Key 0.5 Pitch G/F, Black, Reel 123A-21E00 M.2 Socket, H2.1 E Key 0.5 Pitch G/F, Black, Reel 123A-21M00 M.2 Socket, H2.1 M Key 0.5 Pitch G/F, Black, Reel 123A-30A00 M.2 Socket, H3.0 A Key 0.5 Pitch G/F, Black, Reel 123A-30B00 M.2 Socket, H3.0 B Key 0.5 Pitch G/F, Black, Reel 123A-30E00 M.2 Socket, H3.0 E Key 0.5 Pitch G/F, Black, Reel 123A-30M00 M.2 Socket, H3.0 M Key 0.5 Pitch G/F, Black, Reel 123A-40A00 M.2 Socket, H4.0 A Key 0.5 Pitch G/F, Black, Reel 123A-40B00 M.2 Socket, H4.0 B Key 0.5 Pitch G/F, Black, Reel 123A-40E00 M.2 Socket, H4.0 E Key 0.5 Pitch G/F, Black, Reel 123A-40M00 M.2 Socket, H4.0 M Key 0.5 Pitch G/F, Black, Reel Performance and Descriptions: The product is designed to meet the electrical, mechanical and environmental performance requirements specification. Unless otherwise specified, all tests are performed at ambient environmental conditions. RoHS: All material in according with the RoHS environment related substances list controlled. MATERIALS NO. PART NAME DESCRIPTION

1 Insulator LCP, UL94V-0, Black

2 Upper contact Phosphor Bronze C5210, contact area gold flash, solder area gold flash, all

under plating 50u” nickel.

3 Lower contact Phosphor Bronze C5210, contact area gold flash, solder area gold flash, all

under plating 50u” nickel.

4 Hold down Brass C2680, 100u” matte tin over 50u” nickel plating

Rated Current 0.5A Operating Temperature -40°C~+85°C Storage Temperature -40°C~+85°C Durability 60 mating cycles

The information contained herein is exclusive property of. Do not copy and print except that Attend accepts. 本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。 -2 - ELECTRICAL Item Requirement Test Condition Low Level Contact Resistance Initial: 55mΩ max. After: Δ20mΩ max. Solder connectors on PCB and mate them together, measure by applying closed circuit current of 100mA maximum at open circuit voltage of 20mV (max). (JIS C5402 5.4) Dielectric withstanding Voltage No breakdown Mate connectors; apply 300V AC at 60 Hz(rms.) between two adjacent for 1 minute. (Trip current:0.5mA) (MIL-STD-202 METHOD 301) Insulation Resistance 500 MΩ Min. Apply 500V DC between adjacent contacts, or contact and ground. (MIL-STD-202 METHOD 302) Temperature Rating 30°C Max. Mate connector: measure the temperature rise at rated current after 0.5A/Power contact. .(EIA-364-70 Method 2.) MECHANICAL Item Requirement Test Condition Mating/ Unmating Force Mating: 20N Max. Unmating: 25N Max. Card mating/unmating sequence: a) Insert the card at the angle specified by the manufacturer b) Rotate the card into position c) Reverse the installation sequence to unmated Operation Speed:25mm/min. Measure the force required to mating/unmating connector. ( EIA-364-13, Method A.) Durability Finish 1.Contact Resistance: 20mΩ Max. change 2.No Damage After 60 mating and unmating cycles with 1.0mm thick board at the rate of 25±3mm/min. The connector shall be of no damage to the housing or contacts. The connector shall also meet the requirements of contact resistance in the paragraph 5.1. (EIA364-09) Vibration Finish 1. No electrical discontinuity more than 0.1μs. 2 .No Damage 3 .Contact Resistance: 20mΩ Max. change Mate dummy card and subject to the following vibration conditions, for a period of 30 minutes in each of 3 mutually perpendicular axis, passing DC 1 mA during the test. Amplitude: 1.52 mm P-P or 19.6 m/s² Frequency: 10-55-10Hz Shall be traversed in 1minute. (MIL-STD-202 METHOD 201) Shock Finish 1. No electrical discontinuity more than 0.1μs. 2 .No Damage 3 .Contact Resistance: 20mΩ Max. change Solder connectors on PCB and mate them together, subject to he following shock conditions, 3 shocks shall be period along 3 mutually perpendicular axis, passing DC 1mA current during the test. A (50G,11ms Half-sine) (MIL-STD-202 METHOD 213)

The information contained herein is exclusive property of. Do not copy and print except that Attend accepts. 本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。 -3 - ENVIRONMENTAL Item Requirement Test Condition Thermal Shock Finish 1. Contact Resistance: 20mΩ Max change 2. No abnormality Stage Temp. ±5°(°C) Time (Minute) t1 -55°C 30 t2 -55°C~+85°C 5 t3 +85°C 30 t4 +85°C~-55°C 5 Test time: 5 cycles (MIL-STD-202 METHOD 107) Temperature Life Contact Resistance: 20mΩ Max. change Mated Connector 105°C, 120 hours, (EIA-364-17, Method A.) Cold Resistance Contact Resistance: 20mΩ Max. change Solder connectors on PCB and mate them together, expose to -55 for 96hrs. Upon completion of the exposure period, the test specimens shall be conditioned at ambient room conditions for 1 of 2hrs, after which the specified measurements shall be performed.(EIA364-59) Humidity Contact Resistance: 20mΩ Max change Insulation Resistance: 100MΩ (Min) Humidity storage at +40±3°C with 90±5% RH for 96 hours. (EIA364-31) Salt Spray Contact Resistance: 20mΩ Max change No Damage 5 ±1% salt solutions, at 35 ±2°C duration 24 hours. Connectors detached (MIL-STD-1344) SOLDER ABILITY Item Requirement Test Condition Solder ability 95% of immersed area must show no voids , pin holes. Dip solder tails into the molten solder(held at 245 ±5°C) up to 0.5mm from the tip of tails for 3±0.5 seconds. (MIL-STD-202 METHOD 208) Resistance to soldering heat No melting, cracks or functional damage allowed All connectors designed for PCB soldering within this specification must be able to withstand the heat from solder oven according to the graph below. The cycle should be repeated twice. (MIL-STD-202 METHOD 210)

The information contained herein is exclusive property of. Do not copy and print except that Attend accepts. 本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。 -4 - Preheating temperature: 150 ~ 200°C, 60~120 seconds Liquidus temperature (TL): 217°C, 60~150 seconds Peak temperature: 260°C 5 seconds Time within 5 °C of peak temperature (Tc): 255°C, 30seconds

The information contained herein is exclusive property of. Do not copy and print except that Attend accepts. 本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。 -5 - Table: Products Qualification Test Sequence No. Test item Test Group and Sequence A B C D E F G H I J K

1 Contact Resistance 1,6 1,3 1,3 1,3 1,3 1,3 1,3 1,4 1,3

2 Insulation Resistance 2,5

3 Dielectric Withstanding Voltage 2

4 Temperature Rise 2

5 Mating/ Unmating Force 3,5

6 Durability 4

7 Vibration 2

8 Shock 2

9 Thermal Shock 2

10 Temperature Life 2

11 Cold Resistance 2

12 Humidity 3

13 Salt Spray 2

14 Solder Ability 1

15 Resistance to Soldering Heat 1

Sample Quantity 4 4 4 4 4 4 4 4 4 4 4