120B-835D00

120B-835D00 ATTEND | Alldatasheet

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• Manufacturer or author: Liu Robin
• PDF pages: 4

Technical content

The information contained herein is exclusive property of ATTEND. Do not copy and print except that Attend accepts. 本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。 -1 - SPECIFICATION AND PERFORMANCE Series 120B-835D00 File 120B-835D00_Spec Date 2017/06/27 Scope: This specification covers the requirements for product performance, test methods and quality assurance provisions of 120B-835D00 Performance and Descriptions: The product is designed to meet the electrical, mechanical and environmental performance requirements specification. Unless otherwise specified, all tests are performed at ambient environmental conditions. RoHS: All material in according with the RoHS environment related substances list controlled. MATERIAL AND FINISH INSULATOR Material LCP UL94V-0, Black CONTACT Material Phosphor Bronze C5210, 0.2t Hold down: Brass, C2680, 0.2t Plating 10u” Gold plating on contact area, Tin plating on solder area Hold down: Tin plating SHELL OR COVER Material Stainless Steel, SUS304, 0.2t LOCK Material Stainless Steel, SUS304, 0.2t RATING Voltage Rating: 30VAC Current Rating: 1.5A Temperature Rating: -40°C to +85°C ELECTRICAL Item Requirement Test Condition Contact Resistance 30mΩ max.(initial) ΔR=15mΩ max. Subject mated contacts assembled in housing to 20 mV max. open circuit at 10mA. Dielectric Withstanding Voltage No creeping discharge nor Flashover shall occur. Current leakage: 1mA max. 500V for one minute. test between adjacent circuit. EIA364,TP-20 Insulation Resistance 1000MΩ min, initial 100MΩ min. after test Impressed voltage 500VDC for one minute, test between adjacent circuit EIA364, TP-21 Current Rating 30°C max. under loaded rating current 1.5A DC The contacts shall be wired in series and apply rated current. Measure the temperature rising on contact. IEC512-PT3

The information contained herein is exclusive property of. Do not copy and print except that Attend accepts. 本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。 -2 - MECHANICAL Item Requirement Test Condition Connector durability 30mΩ max, initial ΔR=15mΩ max. Cycle rate: 400 to 600 cycles per hours No. of cycles: 10,000cycles EIA364, TP-09 Total Mating Force 28.8N max.. Measure the card push in force at 25mm/min. EIA364,TP-29 Total Unmating Force 3.7N min. Measure the card extraction force at 25mm/min. EIA364,TP-13 Card Reverse Insertion No electrical connection and Physical damage to connector. 43.2 N Min. Mating force. Test speed: 25mm/min. Mating device: Normal CFast card. Reference: EIA364,TP-3 Solderability Solder Coverage: 95% Min. Solder Temperature: 245±3°C Immersion Duration: 5±0.5sec. Solderability Test Method, Condition C JESD22-B102D ENVIRONMENTAL Item Requirement Test Condition Humidity 1,000MΩ (Initial) 100MΩ (After Test) 30mΩ max. (Initial) ΔR= 15mΩ max. Ambient Temp.: 40±2°C R. H.: 90 to 95%, Duration: 96hrs, D/C engaged. EIA364,TP-31 Method II, Condition A, Thermal Shock 1,000MΩ (Initial) 100MΩ (After Test) 30mΩ max. (Initial) ΔR= 15mΩ max. Temp. Range: -40 to 85°C No. of Cycles: 5 cycles for 60 minutes Dummy card engaged during test EIA364,TP-32 Physical Shock No electrical discontinuity greater than 100n sec. shall occur. 30mΩ max. (Initial) ΔR= 15mΩ max. Accelerated Velocity: 50G (490s/m) Waveform：Semi-Sine Duration：11m sec. No of Shocks: 3/dir., 3 axis,(18 in total), EIA364,TP-27 Vibration (Low Frequency) No electrical discontinuity greater than 100n sec. shall occur. 30mΩ max. (Initial) ΔR= 15mΩ max. Frequency Range: 10-55-10 Total Amplitude: 1.52mm pp or 98.1m/s Duration: 2hrs three axes (6hrs in total) EIA364,TP-28 Temperature Life 30mΩ max. (Initial) ΔR= 15mΩ max. Chamber Temperature: 85±3°C Duration: 250 hours Dummy card engaged during test EIA364,TP-17 Salt Spray 30mΩ max. (Initial) ΔR=15mΩ max. Visual: no damage Atmosphere: salt spray from 5% solution length of test 48hours exposure Temperature: 35±0.5°C No engagement during the test, EIA364, TP-26B

The information contained herein is exclusive property of. Do not copy and print except that Attend accepts. 本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。 -3 - SOLDER ABILITY Item Requirement Test Condition Solder-Heat Resistance No evidence of deformation or fusion of housing and no physical damage after test Test connector on PC board Pre-heat: 150°C to 180°C for 90sec. Heat 230°C for 30sec. Peak Temperature: 255°C±5°C, 10sec.

The information contained herein is exclusive property of. Do not copy and print except that Attend accepts. 本文件係屬立威科技股份有限公司所有；非經同意，不得以任何覆寫、拷貝、翻印等方式私自據有。亦不得擅加毀損、塗改。 -4 - Test Items Test Group A B C D E F G H I Test Sequence Examination of The Product 1,5 1,5 1,6 1,8 1,7 1,7 1,7 1,3 1,3 Low Level Contact Resistance 2,4 2,5 2,4,6 4,6 Dielectric Withstanding Voltage 3,6 3,6 Insulation Resistance 2,5 2,5 Current Rating 7 Total Mating Force 2 Total Unmating Force 3 Durability 3 2 Card Reverse Insertion 4 Vibration 4 Mechanical Shock 3 Temperature Life 3 Reseating 5 5 Humidity 4 Thermal Shock 4 Salt Spray 3 Solderability 2 Resistance to Reflow Soldering Heat