HBP3906S6R_17 CYSTEKEC

Document overview

  • Manufacturer or author: Provided By digicamel.com
  • PDF pages: 7

Technical content

Features

  • HFE, 100--300 • Reduces board space.
  • Low VCE(sat), ≤0.4V • Reduces component count
  • Pb-free lead plating and halogen-free package • Simplifies circuit design Equivalent Circuit Outline

Ordering Information

(Pb-free lead plating and halogen-free package) 3000 pcs / tape & reel HBP3906S6R SOT-363R Q1 Q2 Environment friendly grade : S for RoHS compliant products, G for RoHS compliant and green compound products Packing spec, T1 : 3000 pcs / tape & reel, 7” reel Product rank, zero for no rank products Product name

CYStech Electronics Corp. Spec. No. : C318S6R Issued Date : 2003.04.11 Revised Date : 2017.08.11 Page No. : 2/7 HBP3906S6R CYStek Product Specification The following characteristics apply to both Tr 1 and Tr 2 Absolute Maximum Ratings (Ta=25°C) Parameter Symbol Limits Unit Collector-Base V oltage VCBO -40 V Collector-Emitter V oltage VCEO -40 V Emitter-Base V oltage VEBO -5 V Collector Current IC -200 mA Total Package Dissipation @TA=25℃ PD 200 (Note 1) mW Operating Junction Temperature Range Tj -55~+150 °C Storage Temperature Range Tstg -55~+150 °C Note 1: Device is mounted on a FR-4 glass epoxy PCB with area measuring 1.0×0.75×0.062 in. 150 mW per element can’t be exceeded Characteristics (Ta=25°C) Symbol Min. Typ. Max. Unit Test Conditions BVCBO -40 - - V IC=-10μA BVCEO -40 - - V IC=-1mA BVEBO -5 - - V IE=-10μA ICBO - - -100 nA VCB=-30V ICEX - - -50 nA VCE=-30V , VEB=-3V IEBO - - -100 nA VEB=-4V VCE(sat) - - -0.25 V IC=-10mA, IB=-1mA *VCE(sat) - - -0.4 V IC=-50mA, IB=-5mA VBE(sat) - - -0.85 V IC=-10mA, IB=-1mA *VBE(sat) - - -0.95 V IC=-50mA, IB=-5mA hFE 60 - - - VCE=-1V , IC=-100μA hFE 80 - - VCE=-1V , IC=-1mA hFE 100 - 300 - VCE=-1V , IC=-10mA *hFE 60 - - - VCE=-1V , IC=-50mA *hFE 30 - - - VCE=-1V , IC=-100mA fT 250 - - MHz VCE=-20V , IC=-10mA, f=100MHz Cob - - 4.5 pF VCB=-5V , f=1MHz *Pulse Test: Pulse Width ≤380us, Duty Cycle≤2%

CYStech Electronics Corp. Spec. No. : C318S6R Issued Date : 2003.04.11 Revised Date : 2017.08.11 Page No. : 3/7 HBP3906S6R CYStek Product Specification Typical Characteristics Current Gain vs Collector Current 100 1000 0.1 1 10 100 1000 Collector Current--- IC(mA) Current Gain---HFE HFE@VCE=1V Saturation Voltage vs Collector Current 100 1000 0.1 1 10 100 1000 Collector Current IC-(mA) Saturation Voltage-(mV) VCE(SAT)@IC=10IB Saturation Voltage vs Collector Current 100 1000 10000 0.1 1 10 100 1000 Collector Current---IC(mA) Saturation Voltage-(mV) VBE(SAT)@IC=10IB Capacitance vs Reverse-Biased Voltage 0.1 1 10 100 Reverse-Biased Voltage---(V) Capacitance---(pF) Cob Cutoff frequency vs Collector Current 100 1000 0.1 1 10 100 Collector Current---IC(mA) Cutoff Frequency---fT(MHz) VCE=20V Power Derating Curve 100 150 200 250 0 50 100 150 200 Ambient Temperature---TA(℃) Power Dissipation---PD(mW) Dual Single

CYStech Electronics Corp. Spec. No. : C318S6R Issued Date : 2003.04.11 Revised Date : 2017.08.11 Page No. : 4/7 HBP3906S6R CYStek Product Specification Recommended Soldering Footprint

CYStech Electronics Corp. Spec. No. : C318S6R Issued Date : 2003.04.11 Revised Date : 2017.08.11 Page No. : 5/7 HBP3906S6R CYStek Product Specification Reel Dimension Carrier Tape Dimension

CYStech Electronics Corp. Spec. No. : C318S6R Issued Date : 2003.04.11 Revised Date : 2017.08.11 Page No. : 6/7 HBP3906S6R CYStek Product Specification Recommended wave soldering condition Product Peak Temperature Soldering Time Pb-free devices 260 +0/-5 °C 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Sn-Pb eutectic Assembly Pb-free Assembly Average ramp-up rate (Tsmax to Tp) 3°C/second max. 3°C/second max. Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds Time maintained above: −Temperature (TL) − Time (tL) 183°C 60-150 seconds 217°C 60-150 seconds Peak Temperature(TP) 240 +0/-5 °C 260 +0/-5 °C Time within 5°C of actual peak temperature(tp) 10-30 seconds 20-40 seconds Ramp down rate 6°C/second max. 6°C/second max. Time 25 °C to peak temperature 6 minutes max. 8 minutes max. Note : All temperatures refer to topside of the package, measured on the package body surface.

CYStech Electronics Corp. Spec. No. : C318S6R Issued Date : 2003.04.11 Revised Date : 2017.08.11 Page No. : 7/7 HBP3906S6R CYStek Product Specification SOT-363 Dimension Marking: D 2.000 2.200 0.079 0.087 θ 0° 8° 0° 8° E 1.150 1.350 0.045 0.053 Notes : 1.Controlling dimension : millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material :

  • Lead : Pure tin plated.
  • Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0. Important Notice:
  • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
  • CYStek reserves the right to make changes to its products without notice.
  • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
  • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance. 6-Lead SOT-363 Plastic Surface Mounted Package CYStek Package Code: S6R Style: Pin 1. Emitter1 (E1) Pin 2. Base1 (B1) Pin 3. Collector2 (C2) Pin 4. Emitter2 (E2) Pin 5. Base2 (B2) Pin 6. Collector1 (C1) Device Code A2 ● XX Date Code