HBP1037S5 CYSTEKEC

Document overview

  • Manufacturer or author: Provided By digicamel.com
  • PDF pages: 6

Technical content

Features

  • Two BTA1037 chips in a SOT-353 package.
  • Mounting possible with SOT-323 automatic mounting machines.
  • Mounting cost and area can be cut in half.
  • Excellent hFE linearity
  • Pb-free lead plating and halogen free package. Equivalent Circuit Outline HBP1037S5 SOT-353 Tr1 Tr2 The following characteristics apply to both Tr1 and Tr2 Absolute Maximum Ratings (Ta=25°C) Parameter Symbol Limits Unit Collector-Base V oltage VCBO -60 V Collector-Emitter V oltage VCEO -50 V Emitter-Base V oltage VEBO -6 V Collector Current IC -150 mA Base Current IB -30 mA Power Dissipation PD 200(total) *1 mW Junction Temperature Tj 150 °C Storage Temperature Tstg -55~+150 °C Note : *1 150mW per element must not be exceeded

CYStech Electronics Corp. Spec. No. : C306S5 Issued Date : 2011.01.07 Revised Date : Page No. : 2/6 HBP1037S5 CYStek Product Specification Characteristics (Ta=25°C) Symbol Min. Typ. Max. Unit Test Conditions BVCBO -60 - - V IC=-50μA BVCEO -50 - - V IC=-1mA BVEBO -6 - - V IE=-50μA ICBO - - -0.1 μA VCB=-60V IEBO - - -0.1 μA VEB=-6V *VCE(sat) - -0.2 -0.3 V IC=-100mA, IB=-10mA *hFE 200 - 400 VCE=-6V , IC=-1mA fT 80 110 - MHz VCE=-12V , IC=-1mA, f=100MHz Cob - 2.3 3.5 pF VCB=-10V , f=1MHz *Pulse Test: Pulse Width ≤380μs, Duty Cycle≤2%

Ordering Information

Device Package Shipping Marking HBP1037S5 SOT-353 (Pb-free lead plating and halogen free package) 3000 pcs / Tape & Reel SGR

CYStech Electronics Corp. Spec. No. : C306S5 Issued Date : 2011.01.07 Revised Date : Page No. : 3/6 HBP1037S5 CYStek Product Specification Typical Characteristics Current Gain vs Collector Current 100 1000 0.1 1 10 100 1000 Collector Current---IC(mA) Current Gain---HFE HFE@VCE=6V Saturation Voltage vs Collector Current 100 1000 0.1 1 10 100 1000 Collector Current---IC(mA) Saturation Voltage---(mV) VCE(SAT)@IC=10IB Saturation Voltage vs Collector Current 100 1000 10000 0.1 1 10 100 1000 Collector Current---IC(mA) Saturation Voltage---(mV) VBE(SAT)@IC=10IB Cutoff Frequency vs Collector Current 100 1000 0.1 1 10 100 Collector Current---IC(mA) Cutoff Frequency---FT(MHZ) FT@VCE=12V Capacitance Characteristics 100 0.1 1 10 100 Reverse-biased Voltage---(V) Capacitance---(pF) fT=1MHz Cib Cob Power Derating Curves 100 150 200 250 0 50 100 150 200 Ambient Temperature --- Ta(℃ ) Power Dissipation---PD(mW) dual single

CYStech Electronics Corp. Spec. No. : C306S5 Issued Date : 2011.01.07 Revised Date : Page No. : 4/6 HBP1037S5 CYStek Product Specification Reel Dimension Carrier Tape Dimension

CYStech Electronics Corp. Spec. No. : C306S5 Issued Date : 2011.01.07 Revised Date : Page No. : 5/6 HBP1037S5 CYStek Product Specification Recommended wave soldering condition Product Peak Temperature Soldering Time Pb-free devices 260 +0/-5 °C 5 +1/-1 seconds Recommended temperature profile for IR reflow Profile feature Sn-Pb eutectic Assembly Pb-free Assembly Average ramp-up rate (Tsmax to Tp) 3°C/second max. 3°C/second max. Preheat −Temperature Min(TS min) −Temperature Max(TS max) −Time(ts min to ts max) 100°C 150°C 60-120 seconds 150°C 200°C 60-180 seconds Time maintained above: −Temperature (TL) − Time (tL) 183°C 60-150 seconds 217°C 60-150 seconds Peak Temperature(TP) 240 +0/-5 °C 260 +0/-5 °C Time within 5°C of actual peak temperature(tp) 10-30 seconds 20-40 seconds Ramp down rate 6°C/second max. 6°C/second max. Time 25 °C to peak temperature 6 minutes max. 8 minutes max.

CYStech Electronics Corp. Spec. No. : C306S5 Issued Date : 2011.01.07 Revised Date : Page No. : 6/6 HBP1037S5 CYStek Product Specification SOT-353 Dimension *:Typical Millimeters Inches Millimeters Inches DIM Min. Max. Min. Max. 5-Lead SOT-353 Plastic Surface Mounted Package CYStek Package Code: S5 Style: Pin 1. Base1 (B1) Pin 2. Emitter1 (E1)/Emitter 2(E2) Pin 3. Base2 (B2) Pin 4. Collector2 (C2) Pin 5. Collector1 (C1) Marking: SGR DIM Min. Max. Min. Max. D 2.000 2.200 0.079 0.087 θ 0° 8° 0° 8° E 1.150 1.350 0.045 0.053 Notes : 1.Controlling dimension : millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material :

  • Lead : Pure tin plated.
  • Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0. Important Notice:
  • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
  • CYStek reserves the right to make changes to its products without notice.
  • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
  • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.