HBP2907S6R CYSTEKEC

Document overview

  • Manufacturer or author: Provided By digicamel.com
  • PDF pages: 5

Technical content

Features

  • Two BTP2907 chips in a SOT-363 package.
  • Mounting possible with SOT-323 automatic mounting machines.
  • Transistor elements are independent, eliminating interference.
  • Mounting cost and area can be cut in half.
  • Excellent HFE linearity.
  • Complementary to HBN2222S6R.
  • Pb-free package Equivalent Circuit Outline SOT-363R HBP2097S6R Tr1 Tr2 The following characteristics apply to both Tr1 and Tr2 Absolute Maximum Ratings (Ta=25°C) Parameter Symbol Limits Unit Collector-Base V oltage VCBO -60 V Collector-Emitter V oltage VCEO -60 V Emitter-Base V oltage VEBO -5 V Collector Current IC -600 mA Power Dissipation Pd 200(total) (Note) mW Junction Temperature Tj 150 °C Storage Temperature Tstg -55~+150 °C Note: 150mW per element must not be exceeded.

CYStech Electronics Corp. Spec. No. : C317S6R Issued Date : 2006.11.08 Revised Date : Page No. : 2/5 HBP2907S6R CYStek Product Specification Characteristics (Ta=25°C) Symbol Min. Typ. Max. Unit Test Conditions BVCBO -60 - - V IC=-100μA BVCEO -60 - - V IC=-10mA BVEBO -6 - - V IE=-10μA ICBO - - -10 nA VCB=-50V ICEX - - -50 nA VCE=-30V , VBE(OFF)=-0.5V *VCE(sat) - -0.2 -0.4 V IC=-150mA, IB=-15mA *VCE(sat) - -0.5 -1.6 V IC=-500mA, IB=-50mA *VBE(sat) - - -1.3 V IC=-150mA, IB=-15mA *VBE(sat) - - -2.6 V IC=-500mA, IB=-50mA *hFE 1 75 - - - VCE=-10V , IC=-100μA *hFE 2 100 - - - VCE=-10V , IC=-1mA *hFE 3 100 - - - VCE=-10V , IC=-10mA *hFE 4 100 - 300 - VCE=-10V , IC=-150mA *hFE 5 50 - - - VCE=-10V , IC=-500mA fT 200 - MHz VCE=-20V , IC=-50mA, f=100MHz Cob - - 8 pF VCB=-30V , IE=0A,f=1MHz *Pulse Test: Pulse Width ≤380μs, Duty Cycle≤2%

Ordering Information

Device Package Shipping Marking HBP2907S6R SOT-363 (Pb-free) 3000 pcs / Tape & Reel 2F

CYStech Electronics Corp. Spec. No. : C317S6R Issued Date : 2006.11.08 Revised Date : Page No. : 3/5 HBP2907S6R CYStek Product Specification Characteristic curves Current Gain vs Collector Current 100 1000 0.1 1 10 100 1000 Collector Current---IC(mA) Current Gain---HFE HFE@VCE=3V Saturation Voltage vs Collector Current 100 1000 1 10 100 1000 Collector Current---IC(mA) Saturation Voltage---(mV) VCE(SAT)@IC=10IB Saturation Voltage vs Collector Current 100 1000 0.1 1 10 100 1000 Collector Current---IC(mA) Saturation Voltage---(mV) VBE(SAT)@IC=10IB Cutoff Frequency vs Collector Current 0.1 1 10 100 Collector Current---IC(mA) Cutoff Frequency-FT(GHZ) FT@VCE=5V Power Derating Curves 100 150 200 250 0 50 100 150 200 Ambient Temperature --- Ta(℃ ) Power Dissipation---PD(mW) Dual Single

CYStech Electronics Corp. Spec. No. : C317S6R Issued Date : 2006.11.08 Revised Date : Page No. : 4/5 HBP2907S6R CYStek Product Specification Reel Dimension Carrier Tape Dimension

CYStech Electronics Corp. Spec. No. : C317S6R Issued Date : 2006.11.08 Revised Date : Page No. : 5/5 HBP2907S6R CYStek Product Specification SOT-363R Dimension *:Typical Inches Millimeters Inches Millimeters DIM Min. Max. Min. Max. 6-Lead SOT-363R Plastic Surface Mounted Package CYStek Package Code: S6R Style: Pin 1. Emitter1 (E1) Pin 2. Base1 (B1) Pin 3. Collector2 (C2) Pin 4. Emitter2 (E2) Pin 5. Base2 (B2) Pin 6. Collector1 (C1) Marking: DIM Min. Max. Min. Max. H - 0.004 - 0.1 Notes : 1.Controlling dimension : millimeters. 2.Maximum lead thickness includes lead finish thickness, and minimum lead thickness is the minimum thickness of base material. 3.If there is any question with packing specification or packing method, please contact your local CYStek sales office. Material :

  • Lead : 42 Alloy ; solder plating
  • Mold Compound : Epoxy resin family, flammability solid burning class:UL94V-0 Important Notice:
  • All rights are reserved. Reproduction in whole or in part is prohibited without the prior written approval of CYStek.
  • CYStek reserves the right to make changes to its products without notice.
  • CYStek semiconductor products are not warranted to be suitable for use in Life-Support Applications, or systems.
  • CYStek assumes no liability for any consequence of customer product design, infringement of patents, or application assistance.