ZX7365 ZHAOXINGWEI | Alldatasheet
Document overview
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Technical content
Features
600mA Low Dropout Regulator with EN Very low IQ: 35µA Wide Input Voltage Range: 2V to 6V Wide Adjustable Output: 0.8V to 5.0V Fixed Output Options: 0.8V to 3.9V (0.1V Step Size Possible) High PSRR: 65dB at 1kHz Fast Start-Up Time: 200µ s Stable with Low ESR, 1µ F Ceramic Output Capacitor Excellent Load/Line Transient Response Low Dropout: 300mV at 600mA Current Limit and Short Circuit Protection Thermal Shutdown Protection Ambient Temperature Range: -40°C to +85°C Totally Lead-Free & Fully RoHS Compliant (Notes 1 & 2) Halogen and Antimony Free. “Green” Device (Note 3)
Applications
Servers and Notebook Computers Low and Medium Power Applications FPGA and DSP Core or I/O Power Consumer Electronics Pin Assignments SOT25 (Fixed Output) IN EN OUT (Top View) GND NC (W Package) IN EN ADJ OUT (Top View) GND SOT25 (ADJ Output) (W Package) NC NC OUT GND EN IN (Top View) U-DFN2020-6 (Fixed Output) (SN Package) ADJ NC OUT GND EN IN (Top View) U-DFN2020-6 (ADJ Output) (SN Package) IN OUT GND (TAB) SOT89 (Fixed output) (Top View) (Y Package) OUT GND IN (TAB) SOT89 (Fixed output) (Top View) (YR Package) IN OUT GND (TAB) SOT223 (Fixed output) (Top View) (E Package) OUT GND IN (TAB) SOT223 (Fixed output) (Top View) (ER Package) OUT (TAB) GND IN SOT223 (Fixed output) (Top View) (EV Package) SMD Type IC SMD Type IC ZX7365
Typical Applications Circuit 1μF IN GND EN OUT Enable ADJ 1μF VIN VOUT Adjustable Output 1μF IN GND EN OUT Enable 1μF VIN VOUT 7365 Fixed Output K80RwhereR R1VV 2 REFOUT Pin Descriptions Pin Name Pin Number Functions SOT25 (Fixed) SOT25 (ADJ) U-DFN2020-6 (Fixed) U-DFN2020-6 (ADJ) SOT89 (Y Package) SOT223 (E Package) SOT89 (YR Package) SOT223 (ER Package) SOT223 (EV Package) IN 1 1 3 3 3 2 3 Voltage Input Pin. Bypass to ground through at least 1µ F MLCC capacitor GND 2 2 2 2 2 1 1 Ground EN 3 3 1 1 — — — Enable Input, Active High ADJ — 4 — 6 — — — Output Feedback Pin NC 4 — 5, 6 5 — — — No Connection OUT 5 5 4 4 1 3 2 Voltage Output Pin. Bypass to ground through 1µ F MLCC capacitor Functional Block Diagram IN EN GND OUT Gate Driver 0.8V Current Limit and Thermal Shutdown Fixed Version R R IN EN GND ADJ OUT Gate Driver 0.8V Current Limit and Thermal Shutdown Adjustable Version SMD Type IC SMD Type IC
Absolute Maximum Ratings (@TA = +25° C, unless otherwise specified.) Symbol Parameter Ratings Unit ESD HBM Human Body Model ESD Protection 2000 V ESD MM Machine Model ESD Protection 200 V VIN Input Voltage 6.5 V OUT, EN Voltage VIN +0.3 V Continuous Load Current per Channel Internal Limited TST Storage Temperature Range -65 to +150 °C TJ Maximum Junction Temperature +150 °C Recommended Operating Conditions (@TA = +25° C, unless otherwise specified.) Symbol Parameter Min Max Unit VIN Input Voltage 2 6 V IOUT Output Current (Note 4) 0 600 mA TA Operating Ambient Temperature -40 +85 °C Note: 4. The device maintains a stable, regulated output voltage without a load current. Electrical Characteristics (@TA = +25° C, VIN = VOUT +1V, COUT = 1μF, CIN = 1μF, VEN = 2V, unless otherwise specified.) Symbol Parameter Test Conditions Min Typ Max Unit VREF ADJ Reference Voltage (Adjustable Version) IOUT = 0mA — 0.8 — V IADJ ADJ Leakage (Adjustable Version) — — 0.1 1.0 μA VOUT Output Voltage Accuracy TA = -40°C to +85°C, IOUT = 10% of IOUT-Max -2 — +2 % VOUT /VIN/V Line Regulation VIN = (VOUT +1V) to VIN-Max, VEN = VIN, IOUT = 1mA — 0.02 0.20 %/V VOUT/VOUT Load Regulation VIN = (VOUT +1V) to VIN-Max, IOUT = 1mA to 600mA -1.0 — +1.0 % VDROPOUT Dropout Voltage (Note 5) VOUT < 2.5V, IOUT = 600mA — 370 600 mV VOUT ≥ 2.5V, IOUT = 600mA — 300 400 IQ Input Quiescent Current VEN = VIN, IOUT = 0mA — 35 80 μA ISHDN Input Shutdown Current VEN = 0V, IOUT = 0mA — 0.1 1.0 μA ILEAK Input Leakage Current VEN = 0V, OUT grounded — 0.1 1.0 μA tST Start-Up Time VEN = 0V to 2.0V in 1μs, IOUT = 600mA — 200 — μs PSRR PSRR (Note 6) VIN = [VOUT +1V] VDC + 0.5VppAC, f = 1kHz, IOUT = 50mA — 65 — dB ISHORT Short-Circuit Current VIN = VIN-Min to VIN-Max, VOUT < 0.2V (fixed version) or 25% of VOUT (ADJ version) — 240 — mA ILIMIT Current limit VIN = VIN-Min to VIN-Max, VOUT/ROUT = 2.5A 0.8 1.4 — A VIL EN Input Logic Low Voltage VIN = VIN-Min to VIN-Max — — 0.4 V VIH EN Input Logic High Voltage VIN = VIN-Min to VIN-Max 1.4 — — V IEN EN Input Current VIN = 0V or VIN-Max -1 — +1 μA TSHDN Thermal Shutdown Threshold — — +145 — °C THYS Thermal Shutdown Hysteresis — — +15 — °C Notes: 5. Dropout voltage is the voltage difference between the input and the output at which the output voltage drops 2% below its nom inal value. This parameter only applies to input voltages above minimum V IN = 2.0V. 6. At VIN < 2.3V, the PSRR performance may be reduced. SMD Type IC SMD Type IC
Electrical Characteristics (Cont.) (@TA = +25° C, VIN = VOUT +1V, COUT = 1μF, CIN = 1μF, VEN = 2V, unless otherwise specified.) Symbol Parameter Test Conditions Min Typ Max Unit JA Thermal Resistance Junction-to-Ambient SOT25 (Note 7) — 169 — °C/W U-DFN2020-6 (Note 7) — 132 — SOT89 (Note 7) — 133 — SOT223 (Note 7) — 142 — JC Thermal Resistance Junction-to-Case SOT25 (Note 7) — 31 — °C/W U-DFN2020-6 (Note 7) — 48 — SOT89 (Note 7) — 30 — SOT223 (Note 7) — 39 — Note: 7. Test condition for all packages: Device mounted on FR-4 substrate PC board, 1oz copper, with minimum recommended pad layout. Typical Performance Characteristics Time (40μs/div) Start-Up Time Time (40μs/div) Start-Up Time Time (40μs/div) Line Transient Response Time (40μs/div) Line Transient Response VOUT = 3.3V (1V/div) with 600mA load VEN = 0 to 2V (1V/div) VIN = 5V CIN = COUT = 1μF VOUT = 3.3V (20mV/div) IOUT = 60mA (200mA/div) VIN = 4.3V to 5.3V (1V/div) tR = tF = 2μs CIN = none, COUT = 1μF VOUT = 3.3V (20mV/div) IOUT = 300mA (200mA/div) VIN = 4.3V to 5.3V (1V/div) tR = tF = 2μs CIN = none, COUT = 1μF VEN = 0 to 2V (1V/div) VIN = 5V CIN = COUT = 1μF VOUT = 3.3V (1V/div) with no load SMD Type IC SMD Type IC
Typical Performance Characteristics (Cont.) Load Transient Response Time (100μs/div) Load Transient Response Time (100μs/div) Load Transient Response Time (100μs/div) Load Transient Response Time (100μs/div) VOUT = 1.8V (200mV/div) VOUT = 1.8V ( 200mV/div) VIN = VEN = 2.8V CIN = COUT = 1μF tR = tF = 1μs VIN = VEN = 2.8V CIN = COUT = 1μF tR = tF = 1μs IOUT = 10mA to 300mA (500mA/div) IOUT = 10mA to 600mA (500mA/div) VOUT = 3.3V (200mV/div) VIN = VEN = 4.3V CIN = COUT = 1μF tR = tF = 1μs IOUT = 10mA to 300mA (500mA/div) VOUT = 3.3V (200mV/div) VIN = VEN = 4.3V CIN = COUT = 1μF tR = tF = 1μs IOUT = 10mA to 600mA ( 500mA/div) SMD Type IC SMD Type IC
Typical Performance Characteristics (Cont.) 0.1 1.0 10.0 100.0 FREQUENCY (kHz) PSRR P S R R ( d B ) I = 50mA OUT I =300mA OUT V = 2.25V +0.5V V = 0.8V C = none, C = 1µ F T = +25° C IN ppAC OUT IN OUT A I = 50mA OUT I =300mA OUT 0.1 1.0 10.0 100.0 FREQUENCY (kHz) PSRR V = 2.25V +0.5V V = 1.2V C = none, C = 1µ F T = +25° C IN ppAC OUT IN OUT A P S R R ( d B ) INPUT VOLTAGE (V) Input Quiescent Current vs. Input Voltage INPUT QUIESCENT CURRENT (µA) T = 25 癈 V = 3.3V I = 0mA A OUT OUT -50 -25 75 12525 TEMPERATURE ( 癈 Input Quiescent Current vs. Temperature 0 50 100 INPUT QUIESCENT CURRENT (µA) V = 3.3V I = 0mA OUT OUT V = V = 4.3VIN EN PSRR (dB) PSRR (dB) I = 50mA OUT I = 300mA OUT 0.1 1.0 10.0 100.0 FREQUENCY (kHz) PSRR P S R R ( d B ) V = 2.8V +0.5VppAC V = 1.8V C = none, C = 1µ F T = +25° C IN OUT IN OUT A PSRR (dB) V = 4.3V +0.5VppAC V = 3.3V C = none, C = 1µ F T = +25° C IN OUT IN OUT A I = 50mA OUT I = 300mA OUT 0.1 1.0 10.0 100.0 FREQUENCY (kHz) PSRR P S R R ( d B ) PSRR (dB) TA = 25°C VOUT = 3.3V IOUT = 0mA (°C) SMD Type IC SMD Type IC
Typical Performance Characteristics (Cont.) -50 -25 0 75 100 12525 50 TEMPERATURE ( 癈 Short Circuit Current vs. Temperature 500 400 100 200 SHORT CIRCUIT CURRENT (mA) 300 V = 4.3VIN ADJ Reference Voltage vs Temperature 0.78 0.79 0.80 0.81 0.82 -50 -25 0 25 50 75 100 125 Temperature(℃) ADJ Reference Voltage(V) 0 100 600 300 OUTPUT CURRENT (mA) Load Regulation 200 400 500 0.1 0.0 -0.1 -0.3 -0.4 -0.5 -0.2 O U T P U T V A R I A T I O N ( % ) V = V = 4.3V IN EN V = 3.3V OUT +25° C +90° C -45° C OUTPUT VARIATION (%) V = 3.3V I = 1mA OUT OUT 4.0 4.5 5.5 6.0 5.0 INPUT VOLTAGE (V) Line Regulation 0.08 -0.04 -0.08 0.00 O U T P U T V A R I A T I O N % ) 0.04 +25° C -45° C +90° C OUTPUT VARIATION (%) 0 100 600 300 OUTPUT CURRENT (mA) Dropout Voltage vs. Output Current 200 400 500 600 100 300 D R O P O U T V O L T A G E ( m V ) 500 400 200 +25° C +90° C -45° C V = 1.8V OUT DROPOUT VOLTAGE (mV) V = 3.3V OUT +25° C +90° C -45° C 0 100 600 300 OUTPUT CURRENT (mA) Dropout Voltage vs. Output Current 200 400 500 100 300 D R O P O U T V O L T A G E ( m V ) 500 400 200 DROPOUT VOLTAGE (mV) (°C) SMD Type IC SMD Type IC
Typical Performance Characteristics (Cont.)
Application Information
A 1µ F ceramic capacitor is recommended between IN and GND pins to decouple input power supply glitch and noise. The amount of the capacitance may be increased without limit. This input capacitor must be located as close as possible to the devi ce to assure input stability and reduce noise. For PCB layout, a wide copper trace is required for both IN and GND pins. A lower ESR capacitor type allows the use of less capacitance, while higher ESR type requires more capacitance. Output Capacitor The output capacitor is required to stabilize and improve the transient response of the LDO. The ZX7365 is stable with very small ceramic output capacitors. Using a ceramic capacitor value that is at least 1 μF with ESR > 15mΩ on the output ensures stability . Higher capacitance values help to improve line and load transient response. The output capacitance may be increased to keep low undershoot and overshoot. Ou tput capacitor must be placed as close as possible to OUT and GND pins. 3002001000 600500400 LOAD CURRENT (mA) Region of Stable C ESR vs. Load CurrentOUT 100 0.1 0.01 0.001 C ESR ( )OUT Unstable Range Stable Range V = 4.3V C = C = 1 礔 IN IN OUT -50 -25 0 75 100 12525 50 TEMPERATURE ( 癈 Current Limit vs. Temperature 2.0 1.6 0.4 0.0 0.8 CURRENT LIMIT (A) 1.2 V = 4.3V V = 3.3V IN OUT (°C) VIN = 4.3V CIN = COUT = 1µF Unstable Range Stable Range Unstable Range SMD Type IC SMD Type IC
Application Information (Cont.) Adjustable Operation The ZX7365 provides output voltage from 0.8V to 5.0V through external resistor divider as shown below. 1μF IN GND EN OUT Enable ADJ 1μF VIN VOUT 7365 The output voltage is calculated by: 1R1RE FVOUTV Where VREF = 0.8V (the internal reference voltage) Rearranging the equation will give the following that is used for adjusting the output to a particular voltage: 1 RE FV OUTV 2R1R To maintain the stability of the internal reference voltage, R2 needs to be kept smaller than 80kΩ. No Load Stability Other than external resistor divider, no minimum load is required to keep the device stable. The device will remain stable an d regulated in no load condition. ON/OFF Input Operation The ZX7365 is turned on by setting the EN pin high, and is turned off by pulling it low. If this feature is not used, the EN pin should be tied to IN pin to keep the regulator output on at all time. To ensure proper operation, the signal source used to drive the EN pin must be able to swing above and below the specified turn-on/off voltage thresholds listed in the Electrical Characteristics section under VIL and VIH. Current Limit Protection When output current at OUT pin is higher than current limit threshold, the current limit protection will be triggered and clamp the output current to approximately 1.4A to prevent overcurrent and to protect the regulator from damage due to overheating. Short Circuit Protection When OUT pin is short-circuit to GND, short circuit protection will be triggered and clamp the output current to approximately 240mA. This feature protects the regulator from overcurrent and damage due to overheating. Thermal Shutdown Protection Thermal protection disables the output when the junction temperature rises to approximately +145° C, allowing the device to cool down. When the junction temperature reduces to approximately +1 30°C, the output circuitry is enabled again. Depending on power dissipation, thermal resistance and ambient temperature, the thermal protection circuit may cycle on and off. This cycling limits the heat dissipation of the regulator, protecting it from damage due to overheating. Ultra Fast Start-Up After enabled, the ZX7365 is able to provide full power in a s little as hundreds of microseconds, typically 200µs, without sacrificing low ground current. This feature will help load circuitry move in and out of standby mode in real time, eventually extend battery life f or mobile phones and other portable devices. SMD Type IC SMD Type IC
Application Information (Cont.) Fast Transient Response Fast transient response LDO can extend battery life. TDMA-based cell phone protocols such as Global System for Mobile Communications (GSM) have a transmit/receive duty factor of only 12.5%, enabling power savings by putting much of the baseband circuitry into standby mode in between transmit cycles. In baseband circuits, the load often transitions virtually instantaneously from 100 µA to 100mA. To meet this load requirement, the LDO must react very qui ckly without a large voltage drop or overshoot — a requirement that cannot be met with conventional, general -purpose LDO. The 7365’s fast transient response from 0 to 600mA provides stable voltage supply for fast DSP and GSM chipset with fast changing load. Low Quiescent Current The ZX7365, consuming only around 35µA for all input ranges, provides great power saving in portable and low power applications. Wide Output Range The ZX7365, with a wide output range of 0.8V to 5.0V, provides a versatile LDO solution for many portable applications. Power Dissipation The device power dissipation and proper sizing of the thermal plane connected to the thermal pad is critical to avoid thermal shutdown and ensure reliable operation. Power dissipation of the device depends on input voltage and load conditions and can be calculated by: PD = (VIN - VOUT) X IOUT The maximum power dissipation, handled by the device, depends on the maximum junction to ambient thermal resistance, maximum ambient temperature, and maximum device junction temperature, which can be calculated by the equation in the following: JAR )AT-C145()TA@M AX(PD
Ordering Information
G : Green 7/13 : Tape & Reel Blank : ADJ (Note 8) Output 10 : 1.0V 12 : 1.2V 15 : 1.5V 18 : 1.8V 25 : 2.5V 28 : 2.8V 30 : 3.0V 33 : 3.3V 20 : 2.0V 39 : 3.9V 08 : 0.8V W : SOT25 SN : U-DFN2020-6 Y/YR : SOT89 E/ER/EV : SOT223 SMD Type IC SMD Type IC
Package Outline Dimensions (1) Package Type: SOT25 (2) Package Type: U-DFN2020-6 SOT25 Dim Min Max Typ A 0.35 0.50 0.38 B 1.50 1.70 1.60 C 2.70 3.00 2.80 D 0.95 H 2.90 3.10 3.00 J 0.013 0.10 0.05 K 1.00 1.30 1.10 L 0.35 0.55 0.40 M 0.10 0.20 0.15 N 0.70 0.80 0.75 0° 8° All Dimensions in mm U-DFN2020-6 Dim Min Max Typ A 0.57 0.63 0.60 A1 0 0.05 0.03 A3 - - 0.15 b 0.20 0.30 0.25 D 1.95 2.075 2.00 D2 1.45 1.65 1.55 e - - 0.65 E 1.95 2.075 2.00 E2 0.76 0.96 0.86 L 0.30 0.40 0.35 All Dimensions in mm A M J LD B C H K N D E e b L A D2/2 E2/2 R0.100 Seating Plane Pin #1 ID SMD Type IC SMD Type IC
(3) Package Type: SOT89 E H B e c L A D 8° (4X) z R0.200 (4) Package Type: SOT223 A D b e C L 0°-10° Q E 0.25 Seating Plane Gauge Plane SOT89 Dim Min Max Typ A 1.40 1.60 1.50 B 0.50 0.62 0.56 B1 0.42 0.54 0.48 c 0.35 0.43 0.38 D 4.40 4.60 4.50 D1 1.62 1.83 1.733 D2 1.61 1.81 1.71 E 2.40 2.60 2.50 E2 2.05 2.35 2.20 e - - 1.50 H 3.95 4.25 4.10 H1 2.63 2.93 2.78 L 0.90 1.20 1.05 L1 0.327 0.527 0.427 z 0.20 0.40 0.30 All Dimensions in mm SOT223 Dim Min Max Typ A 1.55 1.65 1.60 A1 0.010 0.15 0.05 b 0.60 0.80 0.70 b1 2.90 3.10 3.00 C 0.20 0.30 0.25 D 6.45 6.55 6.50 E 3.45 3.55 3.50 E1 6.90 7.10 7.00 e - - 4.60 e1 - - 2.30 L 0.85 1.05 0.95 Q 0.84 0.94 0.89 All Dimensions in mm SMD Type IC SMD Type IC