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(a) (c)(b) (e) (d) 1. PART NO. EXPRESSION : (b) Material code (c) Impedance code (a) Series code 2. CONFIGURATION & DIMENSIONS : 4. MATERIALS : SUPERWORLD ELECTRONICS (S) PTE LTD (a) Body : Ferrite (b) Termination : Ag/Ni/Sn a 3. SCHEMATIC : (d) R : Reel (e) Current code PG. 1 0.20± 0.02 BD Unit:m/m 0.40± 0.02 AC b Ag(100%) Ni(100%)-1.5u m(min.) Sn(100%)-3.0u m(min.) H L G (f) FERRITE CHIP BEADS Z A W 1 0 0 - R E - □□ 5. GENERAL SPECIFICATION : A D B C 28.01.2015 NOTE : Specifications subject to change without notice. Please check our website for latest information. ZA SERIES L 0.5 Ref. G 0.20 Ref. H 0.15~0.30 PC Board Pattern a) Operating temp. : -40° C to +125° C ( including self-temperature. rise ) b) Storage condition (component in its packaging) i) Temperature : -10 to 40° C ii) Humidity : 60% (f) 10: Standard 11 ~ 99 : Internal control number

SUPERWORLD ELECTRONICS (S) PTE LTD PG. 2 6. ELECTRICAL CHARACTERISTICS : ZAW100-RE-10 10± 5 100 0.10 540 FrequencyImpedancePart Number ( Ω ) ( Hz ) Test ( mA )( Ω ) Max. DC Resistance Rated Current Max. 28.01.2015 ZA SERIES ZAW700-RB-10 70± 25% 100 0.37 280 ZAW121-RB-10 120± 25% 100 0.53 240 ZAH750-RB-10 75± 25% 100 0.45 260 ZAH121-RB-10 120± 25% 100 0.60 220 FERRITE CHIP BEADS NOTE : Specifications subject to change without notice. Please check our website for latest information.

SUPERWORLD ELECTRONICS (S) PTE LTD PG. 3 7. CHARACTERISTICS CURVES : 28.01.2015 ZA SERIESFERRITE CHIP BEADS NOTE : Specifications subject to change without notice. Please check our website for latest information. 1 10 100 1000 10000 FREQUENCY(MHz) IMPEDANCE(Ohm) FCM0 40 2WF-1 00 T05 Z R X ZAW100-RE-10 1 10 100 1000 10000 FREQUENCY(MHz) 12 0 16 0 20 0 IMPEDANCE(Ohm) FCM0 40 2WF-7 00 T02 Z R X ZAW700-RB-10 1 10 100 1000 10000 FREQUENCY(MHz) 10 0 20 0 30 0 IMPEDANCE(Ohm) FCM0402WF-121T02 Z R X ZAW121-RB-10 1 10 100 1000 10000 FREQUENCY(MHz) 10 0 20 0 30 0 IMPEDANCE(Ohm) FCM0402HF-750T02 Z R X ZAH750-RB-10 1 10 100 1000 10000 FREQUENCY(MHz) 10 0 20 0 30 0 40 0 IMPEDANCE(Ohm) FCM0402HF -121T02 Z R X ZAH121-RB-10

SUPERWORLD ELECTRONICS (S) PTE LTD PG. 5 28.01.2015 ZA SERIESFERRITE CHIP BEADS NOTE : Specifications subject to change without notice. Please check our website for latest information. may cause the failure of mechanical or electrical performance. Solder shall be used not to be exceed as shown in Fig. 3. Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume Figure 3 Recommendable Upper limit t 8-3. Solder Volume Minimum fillet height = soldering thickness + 25% product height

SUPERWORLD ELECTRONICS (S) PTE LTD PG. 6 9-1. Reel Dimension 7" x 8mm 178.0± 2.0 B( mm) 50 or more10± 1.5 A( mm)Type 13.0± 0.2 C(mm) D(mm) 9. PACKAGING INFORMATION : 2.0± 0.05 P(mm) 0.25± 0.04 Bo(mm) 0.45± 0.04 Ko(mm) 0.36max Ao(mm) t(mm) 0.36max Material of taping is paper F:3.5± 0.1 E:1.75± 0.1 D:1.5 +0 . 1 -0.0 9-2 Tape Dimension / 8mm 28.01.2015 ZA SERIES D EMBOSSED CARRIER B A COVER TAPE 2.0± 0.5 ØC Po : 4± 0.1 PA o Bo W : 8.0± 0.3 Ko t FERRITE CHIP BEADS NOTE : Specifications subject to change without notice. Please check our website for latest information.

SUPERWORLD ELECTRONICS (S) PTE LTD PG. 7 28.01.2015 ZA SERIES 9-3. Packaging Quantity ZA 500000 100000 Middle box Chip / Reel Inner Box Series 20000 1000000Carton FERRITE CHIP BEADS NOTE : Specifications subject to change without notice. Please check our website for latest information. Base tape 9-4. Tearing Off Force Top cover tape 165° C to 180° C F The force for tearing off cover tape is 15 to 60 grams in the arrow direction under the following conditions. Tearing SpeedRoom HumidityRoom Temp. (° C) 5~35 (%) 45~85 Room atm 860~1060 (hPa) 300 (mm/min) a) Recommended products should be used within 12 months from the time of delivery. b) The packaging material should be kept where no chlorine or sulfur exists in the air. b) The use of tweezers or vacuum pick up is strongly recommended for individual components. c) Bulk handling should ensure that abrasion and mechanical shock are minimized. a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils. To maintain the solderabililty of terminal electrodes : 1. Storage Conditions : Application Notice 2. Transportation :