L815PW

L815PW SUPERWORLD | Alldatasheet

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(a) (c) (b) (e) (d) 1. PART NO. EXPRESSION : (b) Type code (c) Inductance code : 1R0 = 1.0uH (a) Series code 2. CONFIGURATION & DIMENSIONS : 7.0 Max. A' A B' 4. MATERIALS : SUPERWORLD ELECTRONICS (S) PTE LTD (a) Core (b) Wire (c) Terminal a 3. SCHEMATIC : (d) Tolerance code : M = ±20% (e) F : Lead Free 5. FEATURES : b) Frequency up to 5MHz a) Shielded Construction L815PW SERIES b c PG. 1 NOTE : Specifications subject to change without notice. Please check our website for latest information. 15.01.2008 PCB Pattern H G 6.47±0.5 BC ' C 4.2 Max. 4.0 Max. D E C B SWORLD R33 A 1.6±0.5 D EGHL Unit:m/m L 7.8 Max. 6.86±0.5 HIGH CURRENT MOLDED POWER INDUCTORS

SUPERWORLD ELECTRONICS (S) PTE LTD 7. ELECTRICAL CHARACTERISTICS : L815PW SERIES NOTE : Specifications subject to change without notice. Please check our website for latest information. PG. 2 15.01.2008 h) Part Temperature (Ambient+Temp. Rise) : Should not exceed 125°C under worst case operating conditions. g) Saturation Current (Isat) : Will cause L to drop approximately 20% typ. a) Test Freq. : 100KHz/1.0VDC; Q : 100KHz/1.0VDC f) Heat Rated Current (Irms) : Will cause the coil temp. rise approximately ǻT=40°C without core loss. b) Ambient Temp. : 20°C c) Operating Temp. : -55°C to +125°C d) Storage Temp. : -55°C to +125°C 6. GENERAL SPECIFICATION : e) Humidity Range : 50 ~ 60% RH Q Min. L815PW-100MF L815PW-4R7MF L815PW-2R2MF L815PW-3R3MF L815PW-6R8MF 4.7 10.0 6.8 2.2 3.3 4.5 5.5 10 13 Inductance L ±20% @ 0 Adc L815PW-R33MF L815PW-1R0MF L815PW-1R5MF L815PW-R68MF L815PW-R47MF 0.68 1.0 1.5 0.33 0.47 Part No. ( µH ) Typ. Typ. Max. 2817 3.8 5.8 8.4 1.4 2.5 ( A ) Isat ( A ) Irms

0 DCR

( mȍ ) HIGH CURRENT MOLDED POWER INDUCTORS

SUPERWORLD ELECTRONICS (S) PTE LTD L815PW SERIES NOTE : Specifications subject to change without notice. Please check our website for latest information. PG. 3 15.01.2008 8. CHARACTERISTICS CURVES : 0 7.2 14.4 21.6 28.8 36 DC CURRENT(A) 0.1 0.2 0.3 0.4 0.5 INDUCTANCE (uH) 100 TE MP . RISE(oC) SMPI0604PW-R33L815PW-R33MF 0 6 12 18 24 30 DC CURRENT(A) 0.1 0.2 0.3 0.4 0.5 0.6 INDUCTANCE (uH) 100 TE MP . RISE(oC) SMPI0604PW-R47L815PW-R47MF 0 7 14 21 28 DC CURRENT(A) 0.2 0.4 0.6 0.8 INDUCTANCE (uH) 100 TEMP. RISE( oC) SMPI0604PW-R68L815PW-R68MF 0 4.8 9.6 14.4 19.2 24 DC CURRENT(A) 0.3 0.6 0.9 1.2 1.5 INDUCTANCE (uH) 100 TEMP. RISE( oC) SM PI0 60 4PW-1R 0L815PW-1R0MF 0 3.6 7.2 10.8 14.4 18 DC CURRENT(A) 0.5 1.5 INDUCTANCE (uH) 100 TEMP. RISE( oC) S MPI0604PW-1R5L815PW-1R5MF 03 . 6 7 . 2 1 0 . 8 1 4 . 4 1 8 DC CURRENT(A) 0.6 1.2 1.8 2.4 INDUCTANCE (uH) 100 TE MP . RISE(oC) SMPI0604PW-2R2L815PW-2R2MF HIGH CURRENT MOLDED POWER INDUCTORS

NOTE : Specifications subject to change without notice. Please check our website for latest information. SUPERWORLD ELECTRONICS (S) PTE LTD PG. 4 15.01.2008 8. CHARACTERISTICS CURVES : L815PW SERIES 0 2.6 5.2 7.8 10.4 13 DC CURRENT(A) 0.8 1.6 2.4 3.2 INDUCTANCE (uH) 100 TEMP. RISE( oC) S MPI0604PW-3R3L815PW-3R3MF 0 1.8 3.6 5.4 7.2 9 DC CURRENT(A) 1.4 2.8 4.2 5.6 INDUCTANCE (uH) 100 TEMP. RISE( oC) SMPI0604PW-4R7L815PW-4R7MF 02468 DC CURRENT(A) INDUCTANCE (uH) 100 TE MP . RISE(oC) SMPI0604PW-6R8L815PW-6R8MF 012345 DC CURRENT(A) INDUCTANCE (uH) 100 TEMP. RISE( oC) SMPI0604PW-100L815PW-100MF HIGH CURRENT MOLDED POWER INDUCTORS

NOTE : Specifications subject to change without notice. Please check our website for latest information. SUPERWORLD ELECTRONICS (S) PTE LTD PG. 5 15.01.2008 L815PW SERIES 9. CORE LOSS : 500KHz 100KHz 100KHz and 500KHz 0 200 400 600 800 1000 gauss 10000 20000 30000 40000 KW/m3 100KHZ 500KHZ KW / m3 gauss material gauss loss 100 - 266 200 - 1,234 300 351.7 2,932 400 665.9 5,195 500 1,039 8,336 600 1,471 12,025 700 1,923 15,715 800 2,537 20,444 900 3,148 25,429 1000 3,902 31,002 100KHz 500KHz 200 400 600 800 1000 gauss 1000 2000 3000 4000 KW/m3KW / m3 gauss material gauss loss 300 351.7 400 665.9 500 1,039 600 1,471 700 1,923 800 2,537 900 3,148 1000 3,902 100KHz 0 200 400 600 800 1000 gauss 10000 20000 30000 40000 KW/m3KW / m3 gauss HIGH CURRENT MOLDED POWER INDUCTORS

SUPERWORLD ELECTRONICS (S) PTE LTD NOTE : Specifications subject to change without notice. Please check our website for latest information. PG. 6 15.01.2008 L815PW SERIES 10. RELIABILITY AND TEST CONDITION : Time : 500±12 hours Measure at room temperature after placing for 2 to 3 hrs. Measure at room temperature after placing for 2 to 3 hrs. Measure at room temperature after placing for 2 to 3 hrs. Measure at room temperature after placing for 2 to 3 hrs. Times (min.) 2. Temperature measured by digital surface thermometer Isat(A) will cause Lo to drop approximately 20% typ. cooling Natural cooling Natural 1. Applied the allowed DC current CH16502, Agilent33420A Micro-Ohm Meter. HP4284A, CH11025, CH3302, CH1320, CH1320S approximately ǻT=40°C without core loss Irms(A) will cause the coil temperature rise TEST CONDITION No disconnection or short circuit. 2. Inductance : Within ±20% of initial value. 1. Appearance : No damage No disconnection or short circuit. 2. Inductance : Within ±20% of initial value. Humidity Resistance Thermal Shock Room Temperature4 Temperature : 40±5°C Applied Current : Rated Curent Humidity : 90% to 95% Total : 5 cycles Conditions of 1 cycle. Room Temperature -55±3 +125±3 Temperature (°C)Step 1. Appearance : No damage High Temperature Life Test Low Temperature Reliability Test Life Test Temperature : 125±5°C Temperature : -55±5°C Time : 500±12 hours Time : 500±12 hours Dip Time : 10±0.5sec. Flux for lead free : rosin 10±0.5 seconds 260°C seconds 150°C Preheating Dipping Mechanical Performance Test 1. Appearance : No significant abnormality 2. Inductance change : Within ±20% should be covered with solder. More than 90% of the terminal electrode Solder Heat Resistance Solderability Test 230°C Preheat : 150°C, 60sec. Solder : Sn99.95-Cu0.05 Solder Temperature : 260±5°C seconds 150°C 4±1 seconds Solder : Sn99.95-Cu0.05 Preheat : 150°C, 60sec. Flux for lead free : rosin Solder Temperature : 230±5°C Dip Time : 4±1sec. Preheating Dipping PERFORMANCE Refer to standard electrical characteristics list Heat Rated Current (Irms) Saturation Current (Isat) DCR Electrical Characteristics Test Inductance ITEM LCR meter. Within 3 30±3 Within 3 30±3 HIGH CURRENT MOLDED POWER INDUCTORS

SUPERWORLD ELECTRONICS (S) PTE LTD NOTE : Specifications subject to change without notice. Please check our website for latest information. PG. 8 15.01.2008 L815PW SERIES 12. PACKAGING INFORMATION : Bo Ko 1.75±0.1 Bo(mm) 7.8±0.1 12-3. Packaging Quantity

0.15 MIN

Series Ao(mm) 7.0±0.1 Ao P(mm) 12.0±0.1 Ko(mm) 4.3±0.1 W(mm) 16.0±0.3 P 0.35±0.05 t(mm) W 12-2 Tape Dimension 16.0±0.5 A(mm) 13" x 16mm Type 100±2.0 B(mm) D D(mm) 13.5±0.5 330 C(mm) EMBOSSED CARRIER B A COVER TAPE 12-1. Reel Dimension L815PW 8000 2000 Carton Chip / Reel Inner Box Size 1000 2.0±0.5 ØC 7.5±0.1 F(mm) F HIGH CURRENT MOLDED POWER INDUCTORS

SUPERWORLD ELECTRONICS (S) PTE LTD NOTE : Specifications subject to change without notice. Please check our website for latest information. PG. 9 15.01.2008 L815PW SERIES 12-4. Tearing Off Force The force for tearing off cover tape is 15 to 60 grams in the arrow direction under the following conditions. a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils. 1. Storage Conditions : To maintain the solderabililty of terminal electrodes : a) Temperature and humidity conditions : Less than 30°C and 70% RH. b) Recommended products should be used within 6 months from the time of delivery. c) The packaging material should be kept where no chlorine or sulfur exists in the air. b) The use of tweezers or vacuum pick up is strongly recommended for individual components. c) Bulk handling should ensure that abrasion and mechanical shock are minimized. 2. Transportation : Application Notice Top cover tape F Base tape 165° to 180° Room Temp. (°C) 5~35 Room Humidity (%) 45~85 Tearing Speed (mm/min) 300 Room atm (hPa) 860~1060 HIGH CURRENT MOLDED POWER INDUCTORS