Z5K600-RP-10 SUPERWORLD | Alldatasheet
Document overview
- Manufacturer or author: Provided By ALLDATASHEET.COM(FREE DATASHEET DOWNLOAD SITE)
- PDF pages: 8
Technical content
(a) (c)(b) (e) (d) 1. PART NO. EXPRESSION : (b) Dimension code (c) Material code (a) Series code 2. CONFIGURATION & DIMENSIONS : 4. MATERIALS : SUPERWORLD ELECTRONICS (S) PTE LTD (a) Body : Ferrite (b) Termination : Ag/Ni/Sn a 3. SCHEMATIC : (e) R : Reel (f) Current code : P = 4000mA 5. GENERAL SPECIFICATION : b) Rated current : Base on temp. rise a) Temp. rise : 30°C Max. Z5 SERIESFERRITE CHIP BEADS PG. 1 NOTE : Specifications subject to change without notice. Please check our website for latest information. 04.07.2008 PCB Pattern H G 2.50±0.20 BD GHL Unit:m/m L 3.20±0.20 A C 1.30±0.20 C A D B 0.50±0.30 b Ag(100%) Ni(100%)-1.5um(min.) Sn(100%)-3.0um(min.) c) Storage temp. : -55°C to +125°C d) Operating temp. : -55°C to +125°C e) Resistance to solder heat : 260°C.10secs (f) (g) (g) 10 : Lead Free (d) Impedance code : 600 = 60ȍ
SUPERWORLD ELECTRONICS (S) PTE LTD FERRITE CHIP BEADS Z5 SERIES NOTE : Specifications subject to change without notice. Please check our website for latest information. PG. 2 04.07.2008 6. ELECTRICAL CHARACTERISTICS : 7. IMPEDANCE VS. FREQUENCY CURVES : Rated Current 1210 1210 1210 1210 Size EIA Z5K151-RR-10 Z5K201-RP-10 Z5K900-RL-10 Z5K600-RP-10 Part Number 200 ±25% 150 ±25% Impedance 90 ±25% 60 ±25% ( ȍ ) 100 100 ( MHz ) Frequency Test 100 100 DC Resistance 0.10 0.02 0.03 Max. ( ȍ ) 0.03 2000 5000 4000 4000 Max. ( mA ) 1 10 100 1000 FREQUENCY( MHz) 12 0 16 0 20 0 IMP EDAN C E(Ohm ) HCB3225K-600T40 Z R X Z5K6 00- RP-00Z5K600-RP-1 0 1 10 100 1000 FREQUENCY( MHz) 12 0 16 0 IMPEDANCE(O hm) HCB3225K-900T20 Z R X Z5K900- RL- 00Z5K900-RL-1 0 1 10 100 1000 FREQUENCY( MHz) 10 0 20 0 30 0 IMPEDANCE(O hm) HCB3225K-151T50 Z R X Z5K151 -RR- 00Z5K1 51 -RR-1 0 1 10 100 1000 FREQUENCY (MHz) 10 0 20 0 30 0 IMPEDANCE(O hm) HCB3225K-201T40 Z R X Z5K201 -R P -00Z5K201 -RP-1 0
NOTE : Specifications subject to change without notice. Please check our website for latest information. SUPERWORLD ELECTRONICS (S) PTE LTD PG. 3 04.07.2008 FERRITE CHIP BEADS Z5 SERIES 8. RELIABILITY & TEST CONDITION : Bending 40(1.575) not be damaged by the forces applied on the The terminal electrode & the dielectric mustFlexture Strength 100(3.937) 45(1.772) right conditions. 45(1.772) 20(.787) Solder a chip on a test substrate, bend the substrate by 2mm (0.079in) and return. TEST CONDITIONPERFORMANCE not be damaged by the forces applied on the The terminal electrode & the dielectric must More than 90% of the terminal electrode Refer to standard electrical characteristics list Appearance : No significant abnormality 10±0.5 seconds seconds Terminal Strength Solderability right conditions. W should be covered with solder. seconds Preheating 245°C 150°C 4±1.0 seconds cooling Dipping Natural Solder Heat Resistance Temperature Rise Test Electrical Characteristics Test Rated Current DC Resistance Impedance Preheating Impedance change : Within ±30% 30°C max. (ǻt) 260°C 150°C Dipping cooling Natural For Z Series : Force (Kfg) 1.04 2.0 1.5 1.0 1.0 Size 0.5 0.6 0.2 > 25 Time (sec) Solder : Sn-Ag3.0-Cu0.5 Flux for lead free : rosin Dip Time : 4±1sec. Preheat : 150°C, 60sec. Solder Temperature : 245±5°C 2. Temperature measured by digital surface thermometer. Flux for lead free : rosin Dip Time : 10±0.5sec. Preheat : 150°C, 60sec. Solder : Sn-Ag3.0-Cu0.5 Solder Temperature : 260±5°C 1. Applied the allowed DC current. HP4291A, HP4287A+16092A HP4338B No mechanical damage Remaining terminal electrode : 70% min. W ITEM
SUPERWORLD ELECTRONICS (S) PTE LTD NOTE : Specifications subject to change without notice. Please check our website for latest information. PG. 4 04.07.2008 FERRITE CHIP BEADS Z5 SERIES Derating Curve For the ferrite chip bead which withstanding current over 1.5A, as the operating temperature over 85°C, the derating current information is necessary to consider with. For the detail derating of current, please refer to the Derated Current vs. Operating Temperature curve. not be allowed. Impedance : Within ±30% Appearance : Cracking, shipping & any other defects harmful to the characteristics should The ferrite should not be damaged by forces applied on the right condition. Random Vibration Test Bending Strength ITEM directions (Total 6 hours). Amplitude : 1.52mm Frequency : 10-55-10Hz for 1 min. Directions & times : X, Y, Z directions for 2 hours. A period of 2 hours in each of 3 mutually perpendicular A 2.70 (0.106) 2.00 (0.079) 1.40 (0.055) 2.5 2.5 1.0 Series name PERFORMANCE TEST CONDITION P-Kgfmm (inches) 0.80 (0.033) 0.3 Chip height of 75cm. Drop 10 times on a concrete floor from aDrop a. No mechanical damage b. Impedance change : ±30% Appearance : No damage. Impedance : Within ±30% of initial value.Temperature Loading at High Humidity : 90~95% RH. Temperature : 40±2°C Duration : 500±12hrs Duration : 500±12hrs Applied Current : rated current Temperature : 125±5°C Measured at room temperature after placing for 2 to 3hrs. Measured at room temperature after placing for 2 to 3hrs. Humidity Measured : 5 times Appearance : No damage. Phase Impedance : Within ±30% of initial value. Low temperature storage test Thermal Shock Number of cycles : 5 Step2 : +125±5°C 30±3 min. Duration : 500±12hrs Temperature : -55±2°C Measured at room temperature after placing for 2 to 3hrs. Measured at room temperature after placing for 2 to 3hrs.+125±5°C -55±2°C 30±3 30±3 For Z Series : Step1 : -55±2°C 30±3 min. Condition for 1 cycle Temperature (°C) Times (min.) height of 75cm. Drop 10 times on a concrete floor from aDrop a. No mechanical damage b. Impedance change : ±30% 8. RELIABILITY & TEST CONDITION : 1.5A 4A4 Derating Derated Current(A) Operating Temperature(¢XC) 12585 Operating Temperature(°C)
SUPERWORLD ELECTRONICS (S) PTE LTD NOTE : Specifications subject to change without notice. Please check our website for latest information. PG. 6 04.07.2008 FERRITE CHIP BEADS Z5 SERIES may cause the failure of mechanical or electrical perform ance. Solder shall be used not to be exceed as shown in Fig. 4. Accordingly increasing the solder volume, the mechanical st ress to product is also increased. Exceeding solder volume Figure 4 Recommendable Upper limit t 9-3. Solder Volume
- PACKAGING INFORMATION : SUPERWORLD ELECTRONICS (S) PTE LTD NOTE : Specifications subject to change without notice. Please check our website for latest information. PG. 7 04.07.2008 FERRITE CHIP BEADS Z5 SERIES 10-1. Reel Dimension 7" x 12mm R0.5 R10.5 13.5±0.5 7" x 8mm D B 7" x 8mm C 120° 7" x 12mm R1.9 2±0.5 A 178.0±2.0 178.0±2.0 60.0±2.0 B(mm) 60.0±2.0 13.5±0.5 9.0±0.5 A(mm)Type 13.5±0.5 13.5±0.5 C(mm) D(mm) D1:1±0.1 P 10-2.1 Tape Dimension / 12mm F:5.5±0.05 D1:1.5±0.1 A E:1.75±0.1 Po:4±0.1D:1.5+0.1 A F:3.5±0.05 P2:2±0.05 P E:1.75±0.1 Po:4±0.1 Material : Plastic Size W:12.0±0.1 Bo Section A-A KoAo P2:2±0.05 t Series 7Z / L 1.93±0.1 1.85±0.1 Ko(mm)Ao(mm)Bo(mm) 4.95±0.1 4.95±0.1 1.93±0.1 3.66±0.1 t(mm)P(mm) 4.0±0.1 8.0±0.1 0.24±0.05 0.24±0.05 Size 3(12) 3(09) W:8.0±0.1 Bo Ko Section A-A AoA Z / L t A D:1.5+0.1 Series 1.27±0.10 1.45±0.10 3.50±0.10 2.35±0.10 1.88±0.10 1.50±0.10 4.0±0.1 0.22±0.05 4.0±0.1 4.0±0.1 0.22±0.05 0.22±0.05 1.05±0.10 Ko(mm)Bo(mm) 1.95±0.10 Ao(mm) 1.05±0.10 P(mm) 4.0±0.1 0.23±0.05 t(mm) 1.5±0.1 D1(mm) 1.5±0.1 1.5±0.1 1.0±0.1 1.0±0.1 1.0±0.1 1.0±0.1 none D1(mm) 10-2 Tape Dimension / 8mm P2:2±0.1 Po:4±0.1 E:1.75±0.1 F:3.5±0.1 P Ao Material : Paper Size 3(09) t Ko W:8.0±0.1 Bo +0.1 -0.05D:1.56 2Z / L Series 1 0.60±0.03 Ko(mm) 0.95±0.05 1.12±0.03 Bo(mm) Ao(mm) 0.62±0.03 0.95±0.054.0±0.1 4.0±0.1 0.95±0.05 P(mm) 2.0±0.1 0.60±0.03 t(mm) none none none D1(mm)
NOTE : Specifications subject to change without notice. Please check our website for latest information. SUPERWORLD ELECTRONICS (S) PTE LTD PG. 8 04.07.2008 FERRITE CHIP BEADS Z5 SERIES Application Notice a) Temperature and humidity conditions : -10 ~ 40°C and 30 ~ 70% RH. b) Recommended products should be used within 6 months from the time of delivery. c) The packaging material should be kept where no chlorine or sulfur exists in the air. b) The use of tweezers or vacuum pick up is strongly recommended for individual components. c) Bulk handling should ensure that abrasion and mechanical shock are minimized. a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils. To maintain the solderabililty of terminal electrodes : 2. Transportation : 1. Storage Conditions : Base tape 10-4. Tearing Off Force Top cover tape 165° to 180° F 10-3. Packaging Quantity Bulk (Bags) Carton Middle Box Inner Box Chip / Reel Chip Size 12000 20000 40000 7000 20000 40000 20000 30000 80000 40000 125000 62500 4000 10001000 4000 2000 8000 12500 2500 in the arrow direction under the following conditions. The force for tearing off cover tape is 15 to 60 grams Tearing Speed 45~85 Room Humidity 5~35 (°C) Room Temp. (%) 860~1060 Room atm (hPa) (mm/min) 300 50000 10000 300000 500000 250000 150000 100000 200000 10000050000 100000 50000 150000 75000 200000 200000 100000 4000 20000 3 (09) 10000 3000 15000 2000 3 (12)4 4000 20000