Z2K471-RJ-10

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(a) (c)(b) (f) (e) 1. PART NO. EXPRESSION : (b) Dimension code (c) Material code (a) Series code 2. CONFIGURATION & DIMENSIONS : 4. MATERIALS : SUPERWORLD ELECTRONICS (S) PTE LTD (a) Body : Ferrite (b) Termination : Ag/Ni/Sn a 3. SCHEMATIC : (e) R : Reel (f) Current : N = 3000mA 5. GENERAL SPECIFICATION : PG. 1 Unit:m/m b Ag(100%) Ni(100%)-1.5u m(min.) Sn(100%)-3.0u m(min.) (d) (g) (d) Impedance code : 300 = 30.0Ω FERRITE CHIP BEADS 19.01.2015 Z2 SERIES NOTE : Specifications subject to change without notice. Please check our website for latest information. Z 2 K 3 0 0 - R N - □□ a) Operating temp. : -40° C to +125° C ( including self-temperature. rise ) Recommended PC Board Pattern D C A B H L G b) Storage condition (component in its packaging) i) Temperature : -10 to 40° C ii) Humidity : 60% 0.80± 0.15 BD GHL 1.60± 0.15 AC (g) 10: Standard 11 ~ 99 : Internal control number

SUPERWORLD ELECTRONICS (S) PTE LTD PG. 2 6. ELECTRICAL CHARACTERISTICS : Part Number Impedance ( Ω ) DC Resistance ( MHz ) Frequency Test Max. ( Ω ) ( mA ) Rated Current 19.01.2015 Max. Z2K300-RN-10 30 ± 25% 100 0.04 3000 80 ± 25% 100 0.04 3000 120 ± 25% 100 0.10 2000 FERRITE CHIP BEADS Z2 SERIES NOTE : Specifications subject to change without notice. Please check our website for latest information. Z2K800-RN-10 Z2K121-RL-10 150 ± 25% 100 0.10 2000Z2K151-RL-10 220 ± 25% 100 0.10 2000Z2K221-RL-10 300 ± 25% 100 0.20 1000Z2K301-RJ-10 470 ± 25% 100 0.20 1000Z2K471-RJ-10 600 ± 25% 100 0.20 1000Z2K601-RJ-10

SUPERWORLD ELECTRONICS (S) PTE LTD PG. 3 7. CHARACTERISTICS CURVES : 19.01.2015 FERRITE CHIP BEADS Z2 SERIES NOTE : Specifications subject to change without notice. Please check our website for latest information. 1 1 0 100 1000 FREQUENCY(MHz) 120 IMPEDANCE(Ohm) HCB1 60 8KF-3 00T30 Z R X 1 10 1 00 1000 FREQUENCY(MHz) 120 160 IMPEDANCE(Ohm) HCB1 608 KF-800 T30 Z R X 1 10 100 1000 FREQUENCY(MHz) 100 150 200 250 300 IMPEDANCE(Ohm) HCB160 8KF-1 21T2 0 Z R X 1 10 100 1000 FREQUENCY(MHz) 10 0 15 0 20 0 25 0 30 0 IMPE DANCE(Ohm) HCB1 608 KF-15 1T20 Z R X Z2K300-RN-10 Z2K800-RN-10 Z2K121-RL-10 Z2K151-RL-10 11 0 1 0 0 100 0 FREQUENCY(MHz) 100 200 300 400 IMPEDA NCE(Ohm) HCB 160 8KF-22 1T20 Z R X 1 1 0 100 1000 FREQUENCY(MHz) 100 200 300 400 IMPEDANCE(Oh m) HCB 1608 KF-3 01T10 Z R X Z2K221-RL-10 Z2K301-RJ-10

FREQUENCY(MHz) 200 400 600 800 IMPEDANCE (Ohm) HCB 160 8KF-47 1T10 Z R X SUPERWORLD ELECTRONICS (S) PTE LTD PG. 4 19.01.2015 FERRITE CHIP BEADS Z2 SERIES NOTE : Specifications subject to change without notice. Please check our website for latest information. Z2K471-RJ-10 1 10 1 0 0 1000 FREQUENCY(MHz) 200 400 600 800 IMPEDANCE(Ohm) HC B1 60 8KF-6 0 1T1 0 Z R X Z2K601-RJ-10

SUPERWORLD ELECTRONICS (S) PTE LTD PG. 6 19.01.2015 FERRITE CHIP BEADS Z2 SERIES NOTE : Specifications subject to change without notice. Please check our website for latest information. may cause the failure of mechanical or electrical performance. Solder shall be used not to be exceed as shown in Fig. 3. Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume Figure 3 Recommendable Upper limit t 8-3. Solder Volume Minimum fillet height = soldering thickness + 25% product height

SUPERWORLD ELECTRONICS (S) PTE LTD PG. 7 19.01.2015 FERRITE CHIP BEADS Z2 SERIES NOTE : Specifications subject to change without notice. Please check our website for latest information. 9-1. Reel Dimension 7" x 12mm R0.5 R10.5 13.5± 0.5 7" x 8mm D B 7" x 8mm C 120° 7" x 12mm R1.9 2± 0.5 A 178.0± 2.0 178.0± 2.0 60.0± 2.0 B( mm) 60.0± 2.0 13.5± 0.5 9.0± 0.5 A( mm)Type 13.5± 0.5 13.5± 0.5 C(mm) D(mm) 9. PACKAGING INFORMATION : D1:1± 0.1 F:3.5± 0.05 P2:2± 0.05 P E:1.75± 0.1 Po:4± 0.1 Si ze 3(12) W:8.0± 0.1 Bo Section A- A KoAoA 4(11) t A D:1.5+0.1 1.27± 0.10 1.45± 0.10 3.50± 0.10 2.35± 0.10 1.88± 0.10 1.50± 0.10 4.0± 0.10 4.0± 0.10 0.22± 0.05 0.22± 0.05 Ko(mm)Bo(mm) Ao(mm) P(mm) t(mm) Material of taping is plastic 1.0± 0.10 1.0± 0.10 1.0± 0.10 D1(mm) P(mm) 4.0± 0.10 4.0± 0.10 1.50± 0.05 3(09) 2.30± 0.05 Si ze Bo(mm ) 0.95± 0.05 0.95± 0.05 Ko(mm)Ao(mm) 0.95± 0.05 0.95± 0.05 t(mm) P Po:4± 0.1 P2:2± 0.1 F:3.5± 0.1 E:1.75± 0.1 Ao D:1.56 +0 . 1 -0.05 Bo W:8.0± 0.1 Ko t 2.0± 0.05 P(mm) 0.38± 0.050 Si ze Bo(mm ) 0.68± 0.05 Ko(mm) 0.50max Ao(mm) t(mm) 0.50max Material of taping is paper P Po:4± 0.1 F:3.5± 0.05 E:1.75± 0.1 Ao D:1.5+0.1/-0.0 Bo W:8.0± 0.3 Ko t 9-2.1 Tape Dimension / 8mm

SUPERWORLD ELECTRONICS (S) PTE LTD PG. 8 19.01.2015 FERRITE CHIP BEADS Z2 SERIES NOTE : Specifications subject to change without notice. Please check our website for latest information. 9-2.2 Tape Dimension / 12mm P F:5.5± 0.05 D1:1.5± 0.1 A E:1.75± 0.1 Po:4± 0.1D:1.5+0.1 A Si ze W:12.0± 0.1 Bo Section A- A KoAo P2:2± 0.05 t 6 1.93± 0.1 Ko(mm)Ao(mm)Bo(mm) P(mm) t(mm) Base tape 9-4. Tearing Off Force Top cover tape 165° C to 180° C F Chip Size Chip / Reel Inner Box Middle Box Carton 9-3. Packaging Quantity 125000 62500 40000 20000 75000 150000 2500 125004000 1000 15000 3000 4(11) The force for tearing off cover tape is 15 to 60 grams in the arrow direction under the following conditions. Tearing SpeedRoom HumidityRoom Temp. (° C) 5~35 (%) 45~85 Room atm 860~1060 (hPa) 300 (mm/min) 200000 100000100000 200000 50000 100000 20000 4000 2000010000 2000 4000 3(09)3(12) D1(mm) 1.5± 0.1 500000 250000 50000 10000 750000 375000 75000 15000 80000 40000 2000 8000 75000 150000 3000 15000 4(09) Seri e s Z / L a) Recommended products should be used within 12 months from the time of delivery. b) The packaging material should be kept where no chlorine or sulfur exists in the air. b) The use of tweezers or vacuum pick up is strongly recommended for individual components. c) Bulk handling should ensure that abrasion and mechanical shock are minimized. a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils. To maintain the solderabililty of terminal electrodes : 1. Storage Conditions : Application Notice 2. Transportation :