Z1K100-RL-10 SUPERWORLD | Alldatasheet

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(a) (c)(b) (e) (d) 1. PART NO. EXPRESSION : (b) Dimension code (c) Material code (a) Series code 2. CONFIGURATION & DIMENSIONS : 4. MATERIALS : SUPERWORLD ELECTRONICS (S) PTE LTD (a) Body : Ferrite (b) Termination : Ag/Ni/Sn a 3. SCHEMATIC : (e) R : Reel (f) Current code : L = 2000mA 5. GENERAL SPECIFICATION : b) Rated current : Base on temp. rise a) Temp. rise : 30°C Max. Z1 SERIESFERRITE CHIP BEADS PG. 1 NOTE : Specifications subject to change without notice. Please check our website for latest information. 03.07.2008 PCB Pattern H G 0.50±0.10 BD GHL Unit:m/m L 1.00±0.10 A C 0.50±0.10 C A D B 0.25±0.10 b Ag(100%) Ni(100%)-1.5um(min.) Sn(100%)-3.0um(min.) c) Storage temp. : -55°C to +125°C d) Operating temp. : -55°C to +125°C ( include self-temp. rise ) e) Resistance to solder heat : 260°C.10secs Z 1 K 1 0 0 - R L - 1 0 (f) (g) (d) Impedance code : 100 = 10ȍ (g) 10 : Lead Free

SUPERWORLD ELECTRONICS (S) PTE LTD FERRITE CHIP BEADS Z1 SERIES NOTE : Specifications subject to change without notice. Please check our website for latest information. PG. 2 03.07.2008 6. ELECTRICAL CHARACTERISTICS : ( MHz ) Frequency 10010 ±25%Z1K100-RL-10 Z1K900-RL-10 Z1K600-RL-10 Z1K800-RL-10 Z1K300-RL-10 90 ±25% 60 ±25% 80 ±25% 30 ±25% 100 100 100 100 Part Number Impedance ( ȍ ) Test 20000.10 0.10 0.10 0.10 0.10 2000 2000 2000 2000 Rated Current Max. DC Resistance ( ȍ ) ( mA ) Z1K221-RK-10 Z1K301-RK-10 Z1K101-RL-10 Z1K121-RL-10 100220 ±25% 300 ±25% 100 100 ±25% 120 ±25% 100 100 15000.15 0.15 1500 0.10 0.10 2000 2000 7. IMPEDANCE VS. FREQUENCY CURVES : 1 10 100 1000 FREQUENCY(MHz) IMPEDANCE(Ohm) HCB1005KF-100T20 Z R X Z1K100-RL-10 1 10 100 1000 FREQUENCY(MHz) IMPEDANCE(Ohm) HCB1005KF-300T20 Z R X Z1K300-RL-10 11 0 1 0 0 1 0 0 0 FREQUENCY(MHz) 120 160 IMPEDANCE(Ohm) HCB1005KF- 600T20 Z R X Z1K600-RL-10 1 10 100 1000 FREQUENCY(MHz) 120 160 IMPEDANCE(Ohm) HCB1005KF-800T20 Z R X Z1K800-RL-10 Packaging : Paper Carrier Tape

SUPERWORLD ELECTRONICS (S) PTE LTD NOTE : Specifications subject to change without notice. Please check our website for latest information. PG. 3 03.07.2008 FERRITE CHIP BEADS Z1 SERIES 7. IMPEDANCE VS. FREQUENCY CURVES : 11 0 1 0 0 1 0 0 0 FREQUENCY(MHz) 120 160 200 IMPE DA NCE (Ohm) HCB1005KF- 900T20 Z R X Z1K900-RL-10 11 0 1 0 0 1 0 0 0 FREQUENCY(MHz) 100 150 200 250 IMPE DA NCE(Ohm) HCB1005KF-101T20 Z R X Z1K101-RL-10 1 10 100 1000 FREQUENCY(MHz) 100 150 200 250 IMPEDANCE(Ohm) HCB1005KF- 121T20 Z R X Z1K121-RL-10 11 0 1 0 0 1 0 0 0 FREQUENCY(MHz) 100 200 300 400 IMPEDANCE(Ohm) HCB1005KF-221T15 Z R X Z1K221-RK-10 11 0 1 0 0 1 0 0 0 FREQUENCY(MHz) 200 400 600 800 IMPEDANCE(Ohm) HCB1005KF-301T15 Z R X Z1K301-RK-10

NOTE : Specifications subject to change without notice. Please check our website for latest information. SUPERWORLD ELECTRONICS (S) PTE LTD PG. 4 03.07.2008 FERRITE CHIP BEADS Z1 SERIES 8. RELIABILITY & TEST CONDITION : Bending 40(1.575) not be damaged by the forces applied on the The terminal electrode & the dielectric mustFlexture Strength 100(3.937) 45(1.772) right conditions. 45(1.772) 20(.787) Solder a chip on a test substrate, bend the substrate by 2mm (0.079in) and return. TEST CONDITIONPERFORMANCE not be damaged by the forces applied on the The terminal electrode & the dielectric must More than 90% of the terminal electrode Refer to standard electrical characteristics list Appearance : No significant abnormality 10±0.5 seconds seconds Terminal Strength Solderability right conditions. W should be covered with solder. seconds Preheating 245°C 150°C 4±1.0 seconds cooling Dipping Natural Solder Heat Resistance Temperature Rise Test Electrical Characteristics Test Rated Current DC Resistance Impedance Preheating Impedance change : Within ±30% 30°C max. (ǻt) 260°C 150°C Dipping cooling Natural For Z Series : Force (Kfg) 1.04 2.0 1.5 1.0 1.0 Size 0.5 0.6 0.2 > 25 Time (sec) Solder : Sn-Ag3.0-Cu0.5 Flux for lead free : rosin Dip Time : 4±1sec. Preheat : 150°C, 60sec. Solder Temperature : 245±5°C 2. Temperature measured by digital surface thermometer. Flux for lead free : rosin Dip Time : 10±0.5sec. Preheat : 150°C, 60sec. Solder : Sn-Ag3.0-Cu0.5 Solder Temperature : 260±5°C 1. Applied the allowed DC current. HP4291A, HP4287A+16092A HP4338B W ITEM

SUPERWORLD ELECTRONICS (S) PTE LTD NOTE : Specifications subject to change without notice. Please check our website for latest information. PG. 5 03.07.2008 FERRITE CHIP BEADS Z1 SERIES Derating Curve For the ferrite chip bead which withstanding current over 1.5A, as the operating temperature over 85°C, the derating current information is necessary to consider with. For the detail derating of current, please refer to the Derated Current vs. Operating Temperature curve. not be allowed. Impedance : Within ±30% Appearance : Cracking, shipping & any other defects harmful to the characteristics should The ferrite should not be damaged by forces applied on the right condition. Random Vibration Test Bending Strength ITEM directions (Total 6 hours). Amplitude : 1.52mm Frequency : 10-55-10Hz for 1 min. Directions & times : X, Y, Z directions for 2 hours. A period of 2 hours in each of 3 mutually perpendicular A 2.70 (0.106) 2.00 (0.079) 1.40 (0.055) 2.5 2.5 1.0 Series name PERFORMANCE TEST CONDITION P-Kgfmm (inches) 0.80 (0.033) 0.3 Chip height of 75cm. Drop 10 times on a concrete floor from aDrop a. No mechanical damage b. Impedance change : ±30% Appearance : No damage. Impedance : Within ±30% of initial value.Temperature Loading at High Humidity : 90~95% RH. Temperature : 40±2°C Duration : 1008±12hrs Duration : 1008±12hrs Applied Current : rated current Temperature : 125±5°C Measured at room temperature after placing for 2 to 3hrs. Measured at room temperature after placing for 2 to 3hrs. Humidity Measured : 5 times Appearance : No damage. Phase Impedance : Within ±30% of initial value. Low temperature storage test Thermal Shock Number of cycles : 5 Step2 : +125±5°C 30±3 min. Duration : 1008±12hrs Temperature : -55±2°C Measured at room temperature after placing for 2 to 3hrs. Measured at room temperature after placing for 2 to 3hrs.+125±5°C -55±2°C 30±3 30±3 For Z Series : Step1 : -55±2°C 30±3 min. Condition for 1 cycle Temperature (°C) Times (min.) height of 75cm. Drop 10 times on a concrete floor from aDrop a. No mechanical damage b. Impedance change : ±30% 8. RELIABILITY & TEST CONDITION : 1.5A 4A4 Derating Derated Current(A) Operating Temperature(¢XC) 12585 Operating Temperature(°C)

SUPERWORLD ELECTRONICS (S) PTE LTD NOTE : Specifications subject to change without notice. Please check our website for latest information. PG. 7 03.07.2008 FERRITE CHIP BEADS Z1 SERIES may cause the failure of mechanical or electrical performance. Solder shall be used not to be exceed as shown in Fig. 4. Accordingly increasing the solder volume, the mechanica l stress to product is also increased. Exceeding solder volume Figure 4 Recommendable Upper limit t 9-3. Solder Volume

  1. PACKAGING INFORMATION : SUPERWORLD ELECTRONICS (S) PTE LTD NOTE : Specifications subject to change without notice. Please check our website for latest information. PG. 8 03.07.2008 FERRITE CHIP BEADS Z1 SERIES 10-1. Reel Dimension 7" x 12mm R0.5 R10.5 13.5±0.5 7" x 8mm D 10-2 Tape Dimension / 8mm B 7" x 8mm C 120° 7" x 12mm R1.9 2±0.5 A 178.0±2.0 178.0±2.0 60.0±2.0 B(mm) 60.0±2.0 13.5±0.5 9.0±0.5 A(mm)Type 13.5±0.5 13.5±0.5 C(mm) D(mm) D1:1±0.1 10-2.1 Tape Dimension / 12mm P F:5.5±0.05 D1:1.5±0.1 A E:1.75±0.1 Po:4±0.1D:1.5+0.1 A F:3.5±0.05 P2:2±0.05 P E:1.75±0.1 Po:4±0.1 Material : Plastic Size W:12.0±0.1 Bo Section A-A KoAo P2:2±0.05 t Series 7Z / L 1.93±0.1 1.85±0.1 Ko(mm)Ao(mm)Bo(mm) 4.95±0.1 4.95±0.1 1.93±0.1 3.66±0.1 t(mm)P(mm) 4.0±0.1 8.0±0.1 0.24±0.05 0.24±0.05 3(09) Size 3(12) W:8.0±0.1 Bo Ko Section A-A AoA Z / L t A D:1.5+0.1 Series 1.27±0.10 1.45±0.10 3.50±0.10 2.35±0.10 1.88±0.10 1.50±0.10 4.0±0.1 0.22±0.05 4.0±0.1 4.0±0.1 0.22±0.05 0.22±0.05 1.05±0.10 Ko(mm)Bo(mm) Ao(mm) P(mm) 4.0±0.1 0.23±0.05 t(mm) 1.5±0.1 D1(mm) 1.5±0.1 1.5±0.1 1.0±0.1 1.0±0.1 1.0±0.1 1.0±0.1 none D1(mm) Po:4±0.1 P2:2±0.1 E:1.75±0.1 F:3.5±0.1 P Ao Material : Paper Size 3(09) t Ko W:8.0±0.1 Bo D:1.56 +0.1 -0.05 Z / L 2 Series 1 0.60±0.03 Ko(mm) 0.95±0.05 1.12±0.03 Bo(mm) Ao(mm) 0.62±0.03 0.95±0.054.0±0.1 4.0±0.1 0.95±0.05 P(mm) 2.0±0.1 0.60±0.03 t(mm) none none none D1(mm)

NOTE : Specifications subject to change without notice. Please check our website for latest information. SUPERWORLD ELECTRONICS (S) PTE LTD 03.07.2008 FERRITE CHIP BEADS Z1 SERIES PG. 9 Application Notice a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils. c) Bulk handling should ensure that abrasion and mechanical shock are minimized. b) The use of tweezers or vacuum pick up is strongly recommended for individual components. c) The packaging material should be kept where no chlorine or sulfur exists in the air. b) Recommended products should be used within 6 months from the time of delivery. a) Temperature and humidity conditions : -10 ~ 40°C and 30 ~ 70% RH. 2. Transportation : 1. Storage Conditions : To maintain the solderabililty of terminal electrodes : Base tape 10-4. Tearing Off Force Top cover tape 165° to 180° F Bulk (Bags) Chip Size Chip / Reel Inner Box Middle Box Carton 10-3. Packaging Quantity 12000 40000 20000 7000 40000 20000 20000 30000 40000 80000 62500 125000 1000 40004000 1000 8000 2000 2500 12500 The force for tearing off cover tape is 15 to 60 grams in the arrow direction under the following conditions. Tearing SpeedRoom Humidity 45~85 Room Temp. (°C) 5~35 (%) Room atm 860~1060 (hPa) 300 (mm/min) 300000 250000 500000 150000 200000 100000 50000 100000 50000 100000 75000 150000 200000 100000 200000 20000 3 (09) 4000 1000015000 3000 2000 3 (12)4 20000 4000 10000 50000