Z1GC102-RB-10

Z1GC121-RC-10 SUPERWORLD | Alldatasheet

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(a) (c)(b) (e)(d) 1. PART NO. EXPRESSION : 2. CONFIGURATION & DIMENSIONS : 3. MATERIALS : (a) Body : Ferrite (b) Termination : Ag/Ni/Sn a 4. GENERAL SPECIFICATION : b) Operating temp. : -40°C to +125°C ( including self-temperature. rise ) a) Storage temp. : -40°C to +125°C PG. 1 Unit:m/m C A D B b Ag(100%) Ni(100%)-1.5u m(min.) Sn(100%)-3.0u m(min.) (f) (g) SUPERWORLD ELECTRONICS (S) PTE LTD Ferrite Chip Bead (b) Dimension code (c) Material code (a) Series code (e) R : Reel (f) Current code : C = 300mA (g) 10 : ROHS Copnpliant (d) Impedance code : 121=120Ω 0.50±0.10 BD 1.00±0.10 AC SUPERWORLD ELECTRONICS (S) PTE LTD Z 1 G C 1 2 1 - R C - 1 0 10.11.2011 Z1G Series NOTE : Specifications subject to change without notice. Please check our website for latest information.

PG. 2 SUPERWORLD ELECTRONICS (S) PTE LTDSUPERWORLD ELECTRONICS (S) PTE LTD Ferrite Chip Bead Z1G Series 10.11.2011 NOTE : Specifications subject to change without notice. Please check our website for latest information. 5. ELECTRICAL CHARACTERISTICS : 1000 ±25% 1800 ±25% 220 ±25% 600±25% Impedance ( Ω ) 120 ±25% 100MHz Z1GC121-RC-10 Z1GC102-RB-10 Z1GC182-RB-10 Z1GC221-RB-10 Z1GC601-RC-10 Part Number 0402 0402 0402 0402 0402 Size EIA 1.25 2.20 1.00 0.85 Max. 0.70 DC Resistance ( Ω ) 2000±40% 2700±40% 900±40% 1400±40% 500±40% 1GHz Max. ( mA ) Rated Current 300 250 200 250 300

1. IMPEDANCE VS. FREQUENCY CURVES : PG. 3 SUPERWORLD ELECTRONICS (S) PTE LTDSUPERWORLD ELECTRONICS (S) PTE LTD Ferrite Chip Bead Z1G Series 10.11.2011 NOTE : Specifications subject to change without notice. Please check our website for latest information. 1 10 100 1000 FREQUENCY(MHz) 20 0 40 0 60 0 80 0 IMPEDANCE(Ohm) GHB1 005CF-121T03 Z R X Z1GC121-RC-10 1 10 100 1000 FREQUENCY(MHz) 500 1000 1500 IMPEDANCE(Ohm) GHB1005CF-221T02 Z R X Z1GC221-RB -10 1 10 1 00 1000 FREQUENCY(MHz) 40 0 80 0 12 00 16 00 20 00 I MPE DANCE( Ohm) GHB1005HF-601T03 Z R X Z1GC601-RC- 10 1 10 100 1000 FREQ UENCY(MHz) 600 1200 1800 2400 IMPEDANCE(Ohm) GHB1005HF-102T02 Z R X Z1GC102-RB-10 1 10 100 1000 FRE QUENCY(M Hz) 1000 2000 3000 4000 5000 IMPEDANCE(Ohm) GHB1005HF-182T02 Z R X Z1GC182-RB-10

PG. 4 7. RELIABILITY & TEST CONDITION : SUPERWORLD ELECTRONICS (S) PTE LTDSUPERWORLD ELECTRONICS (S) PTE LTD Bending 40(1.575) not be damaged by the forces applied on the The terminal electrode & the dielectric mustFlexture Strength 100(3.937) 45(1.772) right conditions. 45(1.772) 20(.787) Solder a chip on a test substrate, bend the substrate by 2mm (0.079in) and return. TEST CONDITIONPERFORMANCE not be damaged by the forces applied on the The terminal electrode & the dielectric must More than 95% of the terminal electr ode Refer to standard electrical characteristics list 10±0.5 seconds seconds Terminal Strength Solderability right conditions. W should be covered with solder. seconds Preheating 245°C 150°C 4±1.0 seconds cooling Dipping Natural Solder Heat Resistance Temperature Rise Test Electrical Characteristics Test Rated Current Impedance (Z) Preheating 260°C 150°C Dipping cooling Natural For Z Series : Solder : Sn-Cu0.5 Flux for lead free: ROL0 Dip Time : 4±1sec. Preheat : 150°C, 60sec. Solder Temperature : 245±5°C 2. Temperature measured by digital surface thermometer. Flux for lead free: ROL0 Dip Time : 10±0.5sec. Preheat : 150°C, 60sec. Solder : Sn-Cu0.5 Solder Temperature : 260±5°C 1. Applied the allowed DC current. Agilent4291 Agilent E4991 Appearance: No significant abnormality. Impedance change: Within ± 30%. ITEM 1.05 1.0 1.5 0.6 0.5 1.0 > 30 Size Force (Kfg) Time (sec) Rated Current < 1A ΔT 20°C Max Rated Current 1A ΔT 40°C Max≧ DC Power Supply Over Rated Current requirements, there will be some risk Q Factor Agilent4287 DC Resistance Agilent 4338 Agilent16192 10 . 2 W The duration of the applied forces shall be 60 (+ 5) Sec. Ferrite Chip Bead Z1G Series 10.11.2011 NOTE : Specifications subject to change without notice. Please check our website for latest information.

PG. 5 SUPERWORLD ELECTRONICS (S) PTE LTD Derating Curve For the ferrite chip bead which withstanding current over 1.5A, as the operating temperature over 85°C, the derating current information is necessary to consider with. For the detail derating of current, please refer to the Derated Current vs. Operating Temperature curve. not be allowed. Appearance : Cracking, shipping & any other defects harmful to the characteristics should The ferrite should not be dam aged by forces applied on the right condition. Random Vibration Test Bending Str ength ITEM mutually perpendicular directions (Total 9hours). Amplitude : 1.52mm Frequency : 10-55-10Hz for 15 min. Directions & times : X, Y, Z directions for 15 min. This cycle shall be performed 12 times in each of t hree A PERFORMANCE TEST CONDITION Chip Temperature Life testing at High Humidity : 90~95% RH. Temperature : 40±2°C Duration : 504±8hrs Duration : 1008± 12hrs Applied Current : rated current Temperature : 125±2°C Measured at room temperature after placing for 2 to 3hrs. Measured at room temperature after placing for 2 to 3hrs. Humidity Measured : 500 times Appearance : No dam age. Phase Impedance: within±30%of initial value Low temperature storage test Thermal Shock Number of cycles : 500 Step2 : +105±2°C 30±5 min. Duration : 500±8hrs Temperature : -40±2°C Measured at room temperature after placing for 2 to 3hrs. Measured at room temperature after placing for 2 to 3hrs.room temp -40±2°C 0.5≦ 30±5 Step1 : -40±2°C 30±5 min. Condition for 1 cycle Temperature (°C) Times (min.) height of 75cm. Drop 10 times on a concrete floor from aDrop a. No mechanical damage b. Impedance change: ±30% 7. RELIABILITY & TEST CONDITION : +105±2°C3 30±5 2.52.70 (0.106) 0.80 (0.033) mm (inches) 1.40 (0.055) 2.00 (0.079) Series name 1.0 2.5 0.3 P-Kgf Appearance : No dam age. Impedance: within±30%of initial value Impedance: within±30% Ferrite Chip Bead Z1G Series 10.11.2011 NOTE : Specifications subject to change without notice. Please check our website for latest information. 1. 5A Derating Derated Current(A) O pera tin g Te mpera ture(? C) 12585 Operati ng Temperature(℃)

PG. 7 SUPERWORLD ELECTRONICS (S) PTE LTD may cause the failure of mechanical or electrical performance. Solder shall be used not to be exceed as shown in Fig. 4. Accordingly increasing the solder volume, the mechanical stress to product is also increased. Exceeding solder volume Figure 4 Recommendable Upper limit t 8-3. Solder Volume Minimum fillet height = soldering thickness + 25% product height Ferrite Chip Bead Z1G Series 10.11.2011 NOTE : Specifications subject to change without notice. Please check our website for latest information.

PG. 8 SUPERWORLD ELECTRONICS (S) PTE LTDSUPERWORLD ELECTRONICS (S) PTE LTD 9-1. Reel Dimension 7" x 12mm R0.5 R10.5 13.5±0.5 7" x 8mm D B 7" x 8mm C 120° 7" x 12mm R1.9 2±0.5 A 178.0±2.0 178.0±2.0 60.0±2.0 B( mm) 60.0±2.0 13.5±0.5 9.0±0.5 A( mm)Type 13.5±0.5 13.5±0.5 C(mm) D(mm) 9. PACKAGING INFORMATION : D1:1±0.1 F:3.5±0.05 P2:2±0.05 P E:1.75±0.1 Po:4±0.1 3(09) Si ze 3(12) W:8.0±0.1 Bo Section A- A KoAoA 5 4(11) t A D:1.5+0.1 1.27±0.10 1.45±0.10 3.50±0.10 2.35±0.10 1.88±0.10 1.50±0.10 4.0±0.1 0.22±0.05 4.0±0.1 4.0±0.1 0.22±0.05 0.22±0.05 1.05±0.10 Ko(mm)Bo(mm) Ao(mm) P(mm) 4.0±0.1 0.23±0.05 t(mm) Material of taping is plastic 1.0±0.10 1.0±0.10 1.0±0.10 1.0±0.10 none D1(mm) 2.0±0.1 P(mm) 4.0±0.1 4.0±0.1 0.62±0.03 1.50±0.05 3(09) 2.30±0.05 Si ze Bo(mm ) 1.12±0.03 0.95±0.05 0.95±0.05 Ko(mm) 0.60±0.03 Ao(mm) none0.95±0.05 0.95±0.05 none t(mm) 0.60±0.03 D1(mm) none P Po:4±0.1 P2:2±0.1 F:3.5±0.1 E:1.75±0.1 Ao D:1.56 +0 . 1 -0.05 Bo W:8.0±0.1 Ko t 2.0±0.05 P(mm) 0.38±0.050 Si ze Bo(mm ) 0.68±0.05 Ko(mm) 0.50max Ao(mm) t(mm) 0.50max D1(mm) none Material of taping is paper P Po:4±0.1 F:3.5±0.05 E:1.75±0.1 Ao D:1.5 +0 . 1 -0.0 Bo W:8.0±0.3 Ko t 9-2 Tape Dimension / 8mm Seri e s Z / L Z / L Seri e s Z / L Seri e s Ferrite Chip Bead Z1G Series 10.11.2011 NOTE : Specifications subject to change without notice. Please check our website for latest information.

PG. 9 SUPERWORLD ELECTRONICS (S) PTE LTDSUPERWORLD ELECTRONICS (S) PTE LTD 9-2.1 Tape Dimension / 12mm P F:5.5±0.05 D1:1.5±0.1 A E:1.75±0.1 Po:4±0.1D:1.5+0.1 A Si ze W:12.0±0.1 Bo Section A- A KoAo P2:2±0.05 t 6 1.93±0.1 Ko(mm)Ao(mm)Bo(mm) 4.95±0.1 1.93±0.1 P(mm) t(mm) 4.0±0.1 0.24±0.05 Application Notice a) Products should be handled with care to avoid damage or contamination from perspiration and skin oils. c) Bulk handling should ensure that abrasion and mechanical shock are minimized. b) The use of tweezers or vacuum pick up is strongly recommended for individual components. c) The packaging material should be kept where no chlorine or sulfur exists in the air. b) Recommended products should be used within 6 months from the time of delivery. a) Temperature and humidity conditions : -10~ 40°C and 30~70% RH. 2. Transportation : 1. Storage Conditions : To maintain the solderabililty of terminal electrodes : Base tape 9-4. Tearing Off Force Top cover tape 165° to 180° F Bulk (Bags) Chip Size Chip / Reel Inner Box Middle Box Carton 9-3. Packaging Quantity 30000 125000 62500 12000 40000 20000 50000 75000 150000 2500 125004000 1000 15000 3000 4(11) The force for tearing off cover tape is 15 to 60 grams in the arrow direction under the following conditions. Tearing SpeedRoom HumidityRoom Temp. (°C) 5~35 (%) 45~85 Room atm 860~1060 (hPa) 300 (mm/min) 200000 200000 100000 100000 150000 100000 200000 50000 100000 20000 4000 2000010000 2000 4000 3(09)3(12) D1(mm) 1.5±0.1 300000 500000 250000 50000 10000 750000 375000 75000 15000 20000 80000 40000 2000 8000 50000 75000 150000 3000 15000 4(09) Seri e s Z / L Ferrite Chip Bead Z1G Series 10.11.2011 NOTE : Specifications subject to change without notice. Please check our website for latest information.