X92050C SEOUL | Alldatasheet

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Technical content

Features

Z-Power series is designed for high current operation and high flux output applications. Furthermore, its thermal Management characteristic is better than other LED Solutions. By package SMD design and good thermal emission material. According to these advantages, it enables to apply various lighting applications and design solution, Automotive lighting, and large size LCD backlight etc. Applications

  • Mobile phone flash
  • Automotive interior / exterior lighting
  • Automotive signal lighting
  • Automotive forward lighting
  • General Torch
  • Architectural lighting
  • LCD TV / Monitor Backlight
  • Projector light source
  • Traffic signals
  • Task lighting
  • Decorative / Pathway lighting
  • Remote / Solar powered lighting
  • Household appliances *The appearance and specifications of the product may be changed for improvement without notice.

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Rev. 03 Rev. 03 May 2008 May 2008 www.ZLED.com www.ZLED.com 2 Full Code of Z-Power LED Series Full code form : X1 X2 X3 X4 X5 X6 X7–X 8 X9 –X 10 X11 X12 X13 X14 1. Part Number -X 1 : Color -X 2 : Z-Power LED series number -X 3 : LENS type -X 4 : Chip quantity or Watt -X 5 : Package outline size -X 6 : Type of PCB -X 7 : Grade of characteristic code 2. Internal Number -X 8 -X 9 3. Code Labeling -X 10 : Luminous flux (or Radiant flux for royal blue) -X 11 X12 X13 : Dominant wavelength (or x, y coordinates rank code) -X 14 : Forward voltage 4. Sticker Diagram on Reel & Aluminum Vinyl Bag For more information about binning and labeling, refer to the Application Note -1 PART NO. : QUANTITY : ### BIN CODE : X1 X2 X3 X4 X5 X6 X7 –X 8 X9 X10 X11 X12 X13 X14

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Rev. 03 Rev. 03 May 2008 May 2008 www.ZLED.com www.ZLED.com 3 Outline Dimension Notes : Notes : 1. All dimensions are in millimeters. ( Lens tolerance : +0.25 Package tolerance : ±0.2 ) 2. Scale : none 3. Slug of package is connected to anode.

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Rev. 03 Rev. 03 May 2008 May 2008 www.ZLED.com www.ZLED.com 4 Characteristics for Z-Power LED 1. Pure White (W92050C) 1-1 Electro-Optical characteristics at IF=150mA, TA=25ºC *Notes : [1] SSC maintains a tolerance of ±10% on flux and power measurements. [2] ФV is the total luminous flux output as measured with an integrating sphere. [3] CCT ±5% tester tolerance [4] A tolerance of ±0.06V on forward voltage measurements [5] Rθ is measured with a SSC metal core pcb.(25 ºC ≤TJ ≤ 110 ºC) Break voltage of Metal PCB is 6.5kVAC [6] It is included the zener chip to protect the product from ESD. * Caution 1. Please do not drive at rated current more than 5 sec. without proper heat sink Corr deg.typ. 1232Θ ½View Angle ºC /W23RθThermal resistance [5] V-3.65-VFForward Voltage [4] K-6300-CCTelated Color Temperature [3] MaxTypMin --RaCRI lm-ФV [2]Luminous Flux [1] Unit Value SymbolParameter ºC125TjJunction Temperature -±15,000V HBM-ESD Sensitivity [6] ºC-40 ~ +120TstgStorage Temperature W0.8PDPower Dissipation ºC-40 ~ +85ToprOperating Temperature A0.2IFForward Current UnitValueSymbolParameter

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Rev. 03 Rev. 03 May 2008 May 2008 www.ZLED.com www.ZLED.com 5 Characteristics for Z-Power LED -3.65 ºC /W23RθThermal resistance [5] V-VFForward Voltage [4] K-3000-CCTelated Color Temperature [3] MaxTypMin deg.typ. 1202Θ ½View Angle --RaCRI lm-ФV [2]Luminous Flux [1] Unit Value SymbolParameter Corr 2. Warm White (N92050C) 2-1 Electro-Optical characteristics at IF=150mA, TA=25ºC *Notes : [1] SSC maintains a tolerance of ±10% on flux and power measurements. [2] ФV is the total luminous flux output as measured with an integrating sphere. [3] CCT ±5% tester tolerance [4] A tolerance of ±0.06V on forward voltage measurements [5] Rθ is measured with a SSC metal core pcb.(25 ºC ≤TJ ≤ 110 ºC) Break voltage of Metal PCB is 6.5kVAC [6] It is included the zener chip to protect the product from ESD. * Caution 1. Please do not drive at rated current more than 5 sec. without proper heat sink ºC125TjJunction Temperature -±15,000V HBM-ESD Sensitivity [6] ºC-40 ~ +120TstgStorage Temperature W0.8PDPower Dissipation ºC-40 ~ +85ToprOperating Temperature A0.2IFForward Current UnitValueSymbolParameter

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Rev. 03 Rev. 03 May 2008 May 2008 www.ZLED.com www.ZLED.com 6 Color Spectrum 1. Pure White 300 400 500 600 700 800 0.0 0.2 0.4 0.6 0.8 1.0 Standard eye response curve Relative Spectral Power Distribution Wavelength (nm) 300 400 500 600 700 800 0.0 0.2 0.4 0.6 0.8 1.0 Relative Spectral Power Distribution Wavelength (nm) 2. Warm White

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Rev. 03 Rev. 03 May 2008 May 2008 www.ZLED.com www.ZLED.com 7 Light Output Characteristics Relative Light Output vs. Junction Temperature at IF=150mA 25 50 75 100 125 100 120 Relative Light Output [%] Junction Temperature, TJ [ o White

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Rev. 03 Rev. 03 May 2008 May 2008 www.ZLED.com www.ZLED.com 8 Forward Current Characteristics 1. Forward Voltage vs. Forward Current 0 50 100 150 200 0.0 0.2 0.4 0.6 0.8 1.0 1.2

1.4 White

Relative LuminousFlux(a.U) Forward Current(mA) 100 150 200 White Average Forward Current [mA] Forward Voltage [V] 2. Forward Current vs. Normalized Relative Luminous Flux

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Rev. 03 Rev. 03 May 2008 May 2008 www.ZLED.com www.ZLED.com 9 Ambient Temperature vs Allowable Forward Current 1. White (TJMAX = 125 ℃, @150mA) 0 25 50 75 100 125 150 100 150 200 RjaT = 70 o C/W RjaT = 50 o C/W RjaT = 30 o C/W Current [mA] Ambient Temperature [ o

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Rev. 03 Rev. 03 May 2008 May 2008 www.ZLED.com www.ZLED.com 10 Typical Dome Type Radiation pattern 1. Pure White -80 -60 -40 -20 0 0.0 0.2 0.4 0.6 0.8 1.0 Relative luminous flux Angle(deg.) 2. Warm White -80 -60 -40 -20 0 0.0 0.2 0.4 0.6 0.8 1.0 Relative luminous flux Angle(deg.)

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Rev. 03 Rev. 03 May 2008 May 2008 www.ZLED.com www.ZLED.com 11 Recommended Solder Pad 1. Solder pad 2. Solder paste pattern Silk (t=15um) Copper <Rear view> PCB <Footprint & Solder pad> 3 solder point Paste thickness : 0.2mm Note : 1. All dimensions are in millimeters (tolerance : ±0.2 ) 2. Scale none 3. This drawing without tolerances are for reference only

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Rev. 03 Rev. 03 May 2008 May 2008 www.ZLED.com www.ZLED.com 12 3. Reflow Soldering Conditions / Profile 4. Hand Soldering conditions Lead : Not more than 3 seconds @MAX280℃ Slug : Use a thermal-adhesives Pre-heating 200 180 150 ~ 220 240 260 Rising 5 °C/sec Tm : Reflow machine setting temp (max 30 sec.) Ts : Surface temp of PCB (min) Ts : Surface temp of PCB (max) Ts : Surface temp of PCB (recommend) Cooling -5 °C/sec Time [Hr] * Caution 1. Reflow soldering should not be done more than one time. 2. Repairing should not be done after the LEDs have been soldered. When repairing is unavoidable, suitable tools have to be used. 3. Die slug is to be soldered. 4. When soldering, do not put stress on the LEDs during heating. 5. After soldering, do not warp the circuit board. 6. Recommend to use a convection type reflow machine with 7 ~ 8 zones.

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Rev. 03 Rev. 03 May 2008 May 2008 www.ZLED.com www.ZLED.com 13 Emitter Type Reel Packaging Note : 1. The number of loaded products in the reel is 1000ea 2. All dimensions are in millimeters (tolerance : ±0.2 ) 3. Scale none *The appearance and specifications of the product may be changed for improvement without notice. DMJR RAIE PS MARK

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Rev. 03 Rev. 03 May 2008 May 2008 www.ZLED.com www.ZLED.com 14 Precaution for use

  • S torage Avoid the absorption of moisture, we recommended to store Z Power LEDs in a dry box (or desiccator) with a desiccant . Otherwise, store them in the following environment: Temperature : 5℃~30℃ Humidity : 50% max.
  • Precaution after opening packaging However LED is correspond SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed. a. Soldering should be done right after opening the package(within 24Hrs). b. Keeping of a fraction -S ealing - Temperature : 5 ~ 40℃ Humidity : less than 30% c. If the package has been opened more than 1week or the color of desiccant changes, components should be dried for 10-12hr at 60±5℃
  • Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temp. after soldering.
  • Avoid quick cooling
  • Components should not be mounted on warped direction of PCB.
  • Anti radioactive ray design is not considered for the products listed here in.
  • Gallium arsenide is used in some of the products listed in this publication. These products are dangerous if they are burned or smashed in the process of disposal. It is also dangerous to drink the liquid or inhale the gas generated by such products when chemically disposed.
  • This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When washing is required, IPA(Isopropyl Alcohol) should be used.
  • When the LEDs are illuminating, operating current should be decided after considering the package maximum temperature.
  • LEDs must be stored to maintain a clean atmosphere. If the LEDs are stored for 3 months or more after being shipped from SSC, a sealed container with a nitrogen atmosphere should be used for storage.
  • The appearance and specifications of the product may be modified for improvement without notice.
  • Long time exposure of sunlight or occasional UV exposure will cause lens discoloration.
  • Slug polarity is anode.

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Rev. 03 Rev. 03 May 2008 May 2008 www.ZLED.com www.ZLED.com 15 Handling of Silicone resin LEDs Z-Power LED is encapsulated by silicone resin for the highest flux efficiency. Notes for handling of Silicone resin Z-Power LEDs

  • Avoid touching silicone resin parts especially by sharp tools such as pincette (Tweezers)
  • Avoid leaving fingerprints on silicone resin parts.
  • Dust sensitivity silicone resin need containers having cover for storage.
  • When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevent.
  • Please do not force over 3000 gf impact or pressure diagonally on the silicon lens. It will cause fatal damage of this product
  • Please do not recommend to cover the silicone resin of the LEDs with other resin (epoxy, urethane, etc)