SAW81F1D SEOUL | Alldatasheet
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Technical content
SAW81F1D – Chip on Board Product Data Sheet Product Brief
Description
제품사진
- 아래규격에 부합하는 이미지만 가능: 없을 경우 마케팅 팀에 의뢰
- 고해상도
- 흰 배경
- 표준크기: 제품이 가득 차게 가로 5cm 규격 으로 사각 위치에 맞게 (가로세로 비율 고정) Key Applications Features and Benefits Key Message: - ex) Enabling high flux systems while reduces LED count - ex) Enabling compact systems with high reliability - ex) High reliability and High quality of light - ex) Flicker-free AC/DC LED Solution - ex) High-efficient Dimming Solution Product Family: - ex) Mid-Power LED - ex) High-Power LED for Automotive - ex) Chip on Board Product ID (part number): - ex) STW8C2SA - ex) SZ5-M0-WN-C8 Description Features and Benefits Key Applications
- 표는 반드시 “Table 번호#. 표 설명” 을 제목으로 한다. www.seoulsemicon.com Font 글씨체 표(Table) - 제목: Arial 10pt, 표 내부: Arial 8pt, 본문(Body) – Arial 9pt Certificate 아이콘 삽입 (해당되는 아이콘 오른쪽 에서 왼쪽방향으로 순차 삽입) Rev1.0, Apr 6, 2016 Enable High Flux and Cost Efficient System SAW81F1D Z Power Chip on board – ZC series
- The ZC series are LED arrays which provide High Flux and High Efficacy.
- Especially it is designed for easy assembly of lighting fixtures by eliminating reflow soldering process.
- It‘s thermal management is better than other power LED solutions with wide Metal area.
- ZC series are ideal light sources for general lighting applications including Replacement Lamps, Industrial & Commercial Lightings and other high lumen required applications.
- Replacement Lamps – Bulb, MR16, PAR
- Commercial – Downlight
- Residential
Table 1. Product Selection Table
- Size 10.8mm * 10.8mm
- Power dissipation 3.7W
- ErP 6-step binning
- High Color quality with CRI Min.80(R9>0)
- Uniformed Shadow
- Excellent Thermal management
- RoHS compliant
Rev1.0, Apr 6, 2016 www.seoulsemicon.com Product Data Sheet SAW81F1D – Chip on Board “제품 명 – 제품 군” 을 기입하십시오. 제품 군은 홈페이지 응용분야 분류기준을 참고한다. (예) SZ5M0WWC9 – High-power LED Font 글씨체 표(Table) - 제목: Arial 10pt, 표 내부: Arial 8pt, 본문(Body) – Arial 9pt Revision numbering 기준:
- 가스펙은 0.0 부터 시작 0.x….
- Final 승인원: 1.0 부터 시작
- 기존에서 일부 수정: +0.1
- 새로운 Data 추가 /또는 기존 것 삭제: +1.0 수정일자 표기형식; YYYY-MM-DD (예) 2013-04-01 Table of Contents 는 Product Brief 다음 장에 위치 Table of Contents Index
- Product Brief 1
- Table of Contents 2
- Product Performance & Characterization Guide 3
- Characteristics Graph 5
- Product Nomenclature (Labeling Information) 11
- Color Bin Structure 12
- Mechanical Dimensions 14
- Handling of Silicone Resin for LEDs 17
- Precaution For Use 18
- Company Information 21
- 가스펙은 0.0 부터 시작 0.x….
- Final 승인원: 1.0 부터 시작
- 기존에서 일부 수정: +0.1
- 새로운 Data 추가 /또는 기존 것 삭제: +1.0 수정일자 표기형식; YYYY-MM-DD (예) 2013-04-01 Performance Characteristics 전기적 특성 및 광 특성 스펙 테이블
Table 2. Electro Optical Characteristics, IF=20mA
- Correlated Color Temperature is derived from the CIE 1931 Chromaticity diagram. Color
coordinate(x, y) : 0.005, CCT 5% tolerance.
- Seoul Semiconductor maintains a tolerance of ±5% on flux and power measurements.
- ФV is the total luminous flux output as measured with an integrating sphere.
- Tolerance is ±3% on forward voltage measurements.
- Tolerance is ±2 on CRI measurements.
- No values are provided by real measurement. Only for reference purpose.
- 가스펙은 0.0 부터 시작 0.x….
- Final 승인원: 1.0 부터 시작
- 기존에서 일부 수정: +0.1
- 새로운 Data 추가 /또는 기존 것 삭제: +1.0 수정일자 표기형식; YYYY-MM-DD (예) 2013-04-01 Performance Characteristics 전기적 특성 및 광 특성 스펙 테이블 Parameter Symbol Value Unit Min. Typ. Max. Forward Current IF - 20 40 mA Power Dissipation Pd - 3.7 7.6 W Junction Temperature [1] Tj - - 125 º C Operating Temperature Topr -40 - 85 º C Surface Temperature TS - - 100 º C Storage Temperature Tstg -40 - 100 º C Thermal resistance (J to S) RthJS - 2.9 - K/W ESD Sensitivity(HBM) [2] - Class 2A JESD22-A114-E
Table 3. Absolute Maximum Characteristics, Tj=25ºC
- At thermal Resistance, J to S means junction to COB’s metal PCB bottom.
- At ESD Sensitivity, Class 2 is voltage level between 2000V and 4000V.
- Thermal resistance : RthJS (Junction / solder)
- LED’s properties might be different from suggested values like above and below tables if operation condition will be exceeded our parameter range. Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product.
- Thermal resistance can be increased substantially depending on the heat sink design/operating condition, and the maximum possible driving current will decrease accordingly.
- All measurements were made under the standardized environment of Seoul Semiconductor.
Rev1.0, Apr 6, 2016 www.seoulsemicon.com Product Data Sheet SAW81F1D – Chip on Board “제품 명 – 제품 군” 을 기입하십시오. 제품 군은 홈페이지 응용분야 분류기준을 참고한다. (예) SZ5M0WWC9 – High-power LED Font 글씨체 표(Table) - 제목: Arial 10pt, 표 내부: Arial 8pt, 본문(Body) – Arial 9pt Revision numbering 기준:
- 가스펙은 0.0 부터 시작 0.x….
- Final 승인원: 1.0 부터 시작
- 기존에서 일부 수정: +0.1
- 새로운 Data 추가 /또는 기존 것 삭제: +1.0 수정일자 표기형식; YYYY-MM-DD (예) 2013-04-01 Characteristics Graph Product Data Sheet 차트 사각형에 차트의 X축/ Y축을 맞춘다. -100 -75 -50 -25 0 25 50 75 100 100 Relative Luminous Intensity [%] Angular Displacement [degree] Fig 1. Color Spectrum, IF=20mA, Tj=25℃ Fig 2. Radiant pattern, IF=20mA, Tj=25℃ 400 500 600 700 800 100 Relative Radiant Power [%] Wavelength [nm] 6500K 4000K 3000K
Rev1.0, Apr 6, 2016 www.seoulsemicon.com Product Data Sheet SAW81F1D – Chip on Board “제품 명 – 제품 군” 을 기입하십시오. 제품 군은 홈페이지 응용분야 분류기준을 참고한다. (예) SZ5M0WWC9 – High-power LED Font 글씨체 표(Table) - 제목: Arial 10pt, 표 내부: Arial 8pt, 본문(Body) – Arial 9pt Revision numbering 기준:
- 가스펙은 0.0 부터 시작 0.x….
- Final 승인원: 1.0 부터 시작
- 기존에서 일부 수정: +0.1
- 새로운 Data 추가 /또는 기존 것 삭제: +1.0 수정일자 표기형식; YYYY-MM-DD (예) 2013-04-01 Characteristics Graph Product Data Sheet 차트 사각형에 차트의 X축/ Y축을 맞춘다. Fig 3. Forward Voltage vs. Forward Current, Tj=85℃ Fig 4. Forward Current vs. Relative Luminous Flux, Tj=85℃ 155 160 165 170 175 180 185 190 195 Forward Current [mA] Forward Voltage [V] 0 10 20 30 40 50 120 160 200 Relative Luminous Flux [%] Forward Current [mA]
Rev1.0, Apr 6, 2016 www.seoulsemicon.com Product Data Sheet SAW81F1D – Chip on Board “제품 명 – 제품 군” 을 기입하십시오. 제품 군은 홈페이지 응용분야 분류기준을 참고한다. (예) SZ5M0WWC9 – High-power LED Font 글씨체 표(Table) - 제목: Arial 10pt, 표 내부: Arial 8pt, 본문(Body) – Arial 9pt Revision numbering 기준:
- 가스펙은 0.0 부터 시작 0.x….
- Final 승인원: 1.0 부터 시작
- 기존에서 일부 수정: +0.1
- 새로운 Data 추가 /또는 기존 것 삭제: +1.0 수정일자 표기형식; YYYY-MM-DD (예) 2013-04-01 Characteristics Graph Product Data Sheet 차트 사각형에 차트의 X축/ Y축을 맞춘다. 20 40 60 80 100 120 140 100 Relative forward voltage[%] Junction Temperature [ o Fig 5. Relative Light Output vs. Junction Temperature, IF=20mA Fig 6. Forward Voltage vs. Junction Temperature, IF=20mA CCT: 3000K CCT: 3000K 20 40 60 80 100 120 140 100 Relative Luminous Flux [%] Junction Temperature [ o
Rev1.0, Apr 6, 2016 www.seoulsemicon.com Product Data Sheet SAW81F1D – Chip on Board “제품 명 – 제품 군” 을 기입하십시오. 제품 군은 홈페이지 응용분야 분류기준을 참고한다. (예) SZ5M0WWC9 – High-power LED Font 글씨체 표(Table) - 제목: Arial 10pt, 표 내부: Arial 8pt, 본문(Body) – Arial 9pt Revision numbering 기준:
- 가스펙은 0.0 부터 시작 0.x….
- Final 승인원: 1.0 부터 시작
- 기존에서 일부 수정: +0.1
- 새로운 Data 추가 /또는 기존 것 삭제: +1.0 수정일자 표기형식; YYYY-MM-DD (예) 2013-04-01 Characteristics Graph Product Data Sheet 차트 사각형에 차트의 X축/ Y축을 맞춘다. Fig 7. Forward Current vs. CIE x, y Shift, Tj = 85ºC CCT: 3700-7000K CCT: 2600-3700K 20 30 40 50 60 70 80 -0.02 -0.01 0.00 0.01 0.02 CIEx CIEy Relative Variation[a.u.] Forward Current [mA] 20 30 40 50 60 70 80 -0.02 -0.01 0.00 0.01 0.02 CIEx CIEy Relative Variation[a.u.] Forward Current [mA]
Rev1.0, Apr 6, 2016 www.seoulsemicon.com Product Data Sheet SAW81F1D – Chip on Board “제품 명 – 제품 군” 을 기입하십시오. 제품 군은 홈페이지 응용분야 분류기준을 참고한다. (예) SZ5M0WWC9 – High-power LED Font 글씨체 표(Table) - 제목: Arial 10pt, 표 내부: Arial 8pt, 본문(Body) – Arial 9pt Revision numbering 기준:
- 가스펙은 0.0 부터 시작 0.x….
- Final 승인원: 1.0 부터 시작
- 기존에서 일부 수정: +0.1
- 새로운 Data 추가 /또는 기존 것 삭제: +1.0 수정일자 표기형식; YYYY-MM-DD (예) 2013-04-01 Characteristics Graph Product Data Sheet 차트 사각형에 차트의 X축/ Y축을 맞춘다. 25 50 75 100 125 150 -0.02 -0.01 0.00 0.01 0.02 CIEx CIEy Relative Variation[a.u.] Junction Temperature [ o 25 50 75 100 125 150 -0.02 -0.01 0.00 0.01 0.02 CIEx CIEy Relative Variation[a.u.] Junction Temperature [ o CCT: 3700-7000K CCT: 2600-3700K Fig 8. Junction Temperature vs. CIE x, y Shift, IF=20mA
Rev1.0, Apr 6, 2016 www.seoulsemicon.com Product Data Sheet SAW81F1D – Chip on Board “제품 명 – 제품 군” 을 기입하십시오. 제품 군은 홈페이지 응용분야 분류기준을 참고한다. (예) SZ5M0WWC9 – High-power LED Font 글씨체 표(Table) - 제목: Arial 10pt, 표 내부: Arial 8pt, 본문(Body) – Arial 9pt Revision numbering 기준:
- 가스펙은 0.0 부터 시작 0.x….
- Final 승인원: 1.0 부터 시작
- 기존에서 일부 수정: +0.1
- 새로운 Data 추가 /또는 기존 것 삭제: +1.0 수정일자 표기형식; YYYY-MM-DD (예) 2013-04-01 Product Data Sheet Characteristics Graph 차트 사각형에 차트의 X축/ Y축을 맞춘다. Fig 9. Ambient Temperature vs. Maximum Forward Current, Tj(max.)=125℃ 0 20 40 60 80 100 120 Rth(j-a) = 6K/W Rth(j-a) = 8K/W Rth(j-a) = 10K/W Forward Current [mA] Ambient Temperature Ta [ O
- 가스펙은 0.0 부터 시작 0.x….
- Final 승인원: 1.0 부터 시작
- 기존에서 일부 수정: +0.1
- 새로운 Data 추가 /또는 기존 것 삭제: +1.0 수정일자 표기형식; YYYY-MM-DD (예) 2013-04-01 Product Nomenclature 제품 명명법 (nomenclature) Part Number Code Description Part Number Value X1 Company S X3X4 Color Specification W8 CRI 80 X5 Series number 1 X6 Lens type F Flat X7 PCB type 1 PCB Lot Number Code Description Lot Number Value Y1Y2 Year Y3Y4 Month Y5Y6 Day Y7Y8Y9Y10 Mass order Y11Y12Y13 Tray No.
Table 4. Part Numbering System : X1X2X3 X4X5 X6X7 X8 Table 5. Lot Numbering System : Y1Y2Y3Y4Y5Y6 – Y7Y8Y9Y10 – Y11Y12Y13
Rev1.0, Apr 6, 2016 www.seoulsemicon.com Product Data Sheet SAW81F1D – Chip on Board “제품 명 – 제품 군” 을 기입하십시오. 제품 군은 홈페이지 응용분야 분류기준을 참고한다. (예) SZ5M0WWC9 – High-power LED Font 글씨체 표(Table) - 제목: Arial 10pt, 표 내부: Arial 8pt, 본문(Body) – Arial 9pt Revision numbering 기준:
- 가스펙은 0.0 부터 시작 0.x….
- Final 승인원: 1.0 부터 시작
- 기존에서 일부 수정: +0.1
- 새로운 Data 추가 /또는 기존 것 삭제: +1.0 수정일자 표기형식; YYYY-MM-DD (예) 2013-04-01 Color Bin Structure Color Bin CIE 그래프는 한 장에 넣는다. CCT Rank Center Point a b Ellipse Rotation Angle(degrees) Cx Cy CIE Chromaticity Diagram, IF = 20mA, Ts=85℃ 1. Cx and Cy are the center coordinates of the ellipse, a the length of the major axis, b the length of the minor axis and Θ the angle of the major axis as defined in IEC 60081. Notes : 0.30 0.33 0.36 0.39 0.42 0.45 ANSI ErP 6step Ellipse 2700K 3000K 5000K 6500K 4000K Y X
- 가스펙은 0.0 부터 시작 0.x….
- Final 승인원: 1.0 부터 시작
- 기존에서 일부 수정: +0.1
- 새로운 Data 추가 /또는 기존 것 삭제: +1.0 수정일자 표기형식; YYYY-MM-DD (예) 2013-04-01 Color Bin Structure Color Bin CIE 그래프는 한 장에 넣는다.
Table 6. Bin Code description, IF = 20mA
- Flux values @ 85 °C are calculated and for reference only.
Rev1.0, Apr 6, 2016 www.seoulsemicon.com Product Data Sheet SAW81F1D – Chip on Board “제품 명 – 제품 군” 을 기입하십시오. 제품 군은 홈페이지 응용분야 분류기준을 참고한다. (예) SZ5M0WWC9 – High-power LED Font 글씨체 표(Table) - 제목: Arial 10pt, 표 내부: Arial 8pt, 본문(Body) – Arial 9pt Revision numbering 기준:
- 가스펙은 0.0 부터 시작 0.x….
- Final 승인원: 1.0 부터 시작
- 기존에서 일부 수정: +0.1
- 새로운 Data 추가 /또는 기존 것 삭제: +1.0 수정일자 표기형식; YYYY-MM-DD (예) 2013-04-01 Mechanical Dimensions Notes : 1. All dimensions are in millimeters. 2. Scale : none 3. Undefined tolerance is ±0.2mm Cathode Anode < Inner Circuit Diagram> X 4 Marking1 Top view Side view
Rev1.0, Apr 6, 2016 www.seoulsemicon.com Product Data Sheet SAW81F1D – Chip on Board “제품 명 – 제품 군” 을 기입하십시오. 제품 군은 홈페이지 응용분야 분류기준을 참고한다. (예) SZ5M0WWC9 – High-power LED Font 글씨체 표(Table) - 제목: Arial 10pt, 표 내부: Arial 8pt, 본문(Body) – Arial 9pt Revision numbering 기준:
- 가스펙은 0.0 부터 시작 0.x….
- Final 승인원: 1.0 부터 시작
- 기존에서 일부 수정: +0.1
- 새로운 Data 추가 /또는 기존 것 삭제: +1.0 수정일자 표기형식; YYYY-MM-DD (예) 2013-04-01 Packaging Specification 1. Quantity : 30pcs/Tray 2. All dimensions are in millimeters (tolerance : ±0.3) 3. Scale none Notes : Top view Side view
Rev1.0, Apr 6, 2016 www.seoulsemicon.com Product Data Sheet SAW81F1D – Chip on Board “제품 명 – 제품 군” 을 기입하십시오. 제품 군은 홈페이지 응용분야 분류기준을 참고한다. (예) SZ5M0WWC9 – High-power LED Font 글씨체 표(Table) - 제목: Arial 10pt, 표 내부: Arial 8pt, 본문(Body) – Arial 9pt Revision numbering 기준:
- 가스펙은 0.0 부터 시작 0.x….
- Final 승인원: 1.0 부터 시작
- 기존에서 일부 수정: +0.1
- 새로운 Data 추가 /또는 기존 것 삭제: +1.0 수정일자 표기형식; YYYY-MM-DD (예) 2013-04-01 Packaging Specification Notes : 1. Heat Sealed after packing (Use Zipper Bag) 2. Quantity : 3Tray(90pcs) /Bag Aluminum Bag Outer Box
Rev1.0, Apr 6, 2016 www.seoulsemicon.com Product Data Sheet SAW81F1D – Chip on Board “제품 명 – 제품 군” 을 기입하십시오. 제품 군은 홈페이지 응용분야 분류기준을 참고한다. (예) SZ5M0WWC9 – High-power LED Font 글씨체 표(Table) - 제목: Arial 10pt, 표 내부: Arial 8pt, 본문(Body) – Arial 9pt Revision numbering 기준:
- 가스펙은 0.0 부터 시작 0.x….
- Final 승인원: 1.0 부터 시작
- 기존에서 일부 수정: +0.1
- 새로운 Data 추가 /또는 기존 것 삭제: +1.0 수정일자 표기형식; YYYY-MM-DD (예) 2013-04-01 Handling of Silicone Resin for LEDs (1) During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound. (3) Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions must be considered during the handling of such devices. Compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As mentioned previously, the increased sensitivity to dust requires special care during processing. In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of wire. (4) Seoul Semiconductor suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED. (5) Please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this product with acid or sulfur material in sealed space. (6) Avoid leaving fingerprints on silicone resin parts. (2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs without a silicone sealant, since the surface can also become scratched.
Rev1.0, Apr 6, 2016 www.seoulsemicon.com Product Data Sheet SAW81F1D – Chip on Board “제품 명 – 제품 군” 을 기입하십시오. 제품 군은 홈페이지 응용분야 분류기준을 참고한다. (예) SZ5M0WWC9 – High-power LED Font 글씨체 표(Table) - 제목: Arial 10pt, 표 내부: Arial 8pt, 본문(Body) – Arial 9pt Revision numbering 기준:
- 가스펙은 0.0 부터 시작 0.x….
- Final 승인원: 1.0 부터 시작
- 기존에서 일부 수정: +0.1
- 새로운 Data 추가 /또는 기존 것 삭제: +1.0 수정일자 표기형식; YYYY-MM-DD (예) 2013-04-01 Precaution for Use (1) Storage To avoid the moisture penetration, we recommend storing Power LEDs in a dry box with a desiccant. The recommended storage temperature range is 5C to 30C and a maximum humidity of 50%. (2) Use Precaution after Opening the Packaging. Pay attention to the following: a. Recommend conditions after opening the package - Sealing - Temperature : 5 ~ 40℃ Humidity : less than RH30% b. If the package has been opened more than 4 week or the color of the desiccant changes. (3) For manual soldering Seoul Semiconductor recommends the soldering condition (ZC series product is not adaptable to reflow process) a. Use lead-free soldering b. Soldering should be implemented using a soldering equipment at temperature lower than 350°C. c. Before proceeding the next step, product temperature must be stabilized at room temperature. (4) Components should not be mounted on warped (non coplanar) portion of PCB. (5) Radioactive exposure is not considered for the products listed here in. (6) It is dangerous to drink the liquid or inhale the gas generated by such products when chemically disposed of. (7) This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When washing is required, IPA (Isopropyl Alcohol) should be used. (8) When the LEDs are in operation the maximum current should be decided after measuring the package temperature. (9) LEDs must be stored properly to maintain the device. If the LEDs are stored for 3 months or more after being shipped from Seoul Semiconductor, a sealed container with vacuum atmosphere should be used for storage. (10) The appearance and specifications of the product may be modified for improvement without notice.
Rev1.0, Apr 6, 2016 www.seoulsemicon.com Product Data Sheet SAW81F1D – Chip on Board “제품 명 – 제품 군” 을 기입하십시오. 제품 군은 홈페이지 응용분야 분류기준을 참고한다. (예) SZ5M0WWC9 – High-power LED Font 글씨체 표(Table) - 제목: Arial 10pt, 표 내부: Arial 8pt, 본문(Body) – Arial 9pt Revision numbering 기준:
- 가스펙은 0.0 부터 시작 0.x….
- Final 승인원: 1.0 부터 시작
- 기존에서 일부 수정: +0.1
- 새로운 Data 추가 /또는 기존 것 삭제: +1.0 수정일자 표기형식; YYYY-MM-DD (예) 2013-04-01 Precaution for Use (11) Long time exposure of sun light or occasional UV exposure will cause silicone discoloration. (12) Attaching LEDs, do not use adhesive that outgas organic vapor. (13) The driving circuit must be designed to allow forward voltage only when it is ON or OFF. If the reverse voltage is applied to LED, migration can be generated resulting in LED damage. (14) Please do not touch any of the circuit board, components or terminals with bare hands or metal while circuit is electrically active. (15) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures can penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy. The result can be a significant loss of light output from the fixture. Knowledge of the properties of the materials selected to be used in the construction of fixtures can help prevent these issues. (16) LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS). Below is a list of suggestions that Seoul Semiconductor purposes to minimize these effects. a. ESD (Electro Static Discharge) Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come into contact. While most ESD events are considered harmless, it can be an expensive problem in many industrial environments during production and storage. The damage from ESD to an LEDs may cause the product to demonstrate unusual characteristics such as: - Increase in reverse leakage current lowered turn-on voltage - Abnormal emissions from the LED at low current The following recommendations are suggested to help minimize the potential for an ESD event. One or more recommended work area suggestions: - Ionizing fan setup - ESD table/shelf mat made of conductive materials - ESD safe storage containers One or more personnel suggestion options: - Antistatic wrist-strap - Antistatic material shoes - Antistatic clothes Environmental controls: - Humidity control (ESD gets worse in a dry environment)
Rev1.0, Apr 6, 2016 www.seoulsemicon.com Product Data Sheet SAW81F1D – Chip on Board “제품 명 – 제품 군” 을 기입하십시오. 제품 군은 홈페이지 응용분야 분류기준을 참고한다. (예) SZ5M0WWC9 – High-power LED Font 글씨체 표(Table) - 제목: Arial 10pt, 표 내부: Arial 8pt, 본문(Body) – Arial 9pt Revision numbering 기준:
- 가스펙은 0.0 부터 시작 0.x….
- Final 승인원: 1.0 부터 시작
- 기존에서 일부 수정: +0.1
- 새로운 Data 추가 /또는 기존 것 삭제: +1.0 수정일자 표기형식; YYYY-MM-DD (예) 2013-04-01 Precaution for Use b. EOS (Electrical Over Stress) Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is subjected to a current or voltage that is beyond the maximum specification limits of the device. The effects from an EOS event can be noticed through product performance like: - Changes to the performance of the LED package (If the damage is around the bond pad area and since the package is completely encapsulated the package may turn on but flicker show severe performance degradation.) - Changes to the light output of the luminaire from component failure - Components on the board not operating at determined drive power Failure of performance from entire fixture due to changes in circuit voltage and current across total circuit causing trickle down failures. It is impossible to predict the failure mode of every LED exposed to electrical overstress as the failure modes have been investigated to vary, but there are some common signs that will indicate an EOS event has occurred: - Damaged may be noticed to the bond wires (appearing similar to a blown fuse) - Damage to the bond pads located on the emission surface of the LED package (shadowing can be noticed around the bond pads while viewing through a microscope) - Anomalies noticed in the encapsulation and phosphor around the bond wires. - This damage usually appears due to the thermal stress produced during the EOS event. c. To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing: - A surge protection circuit - An appropriately rated over voltage protection device - A current limiting device
Rev1.0, Apr 6, 2016 www.seoulsemicon.com Product Data Sheet SAW81F1D – Chip on Board “제품 명 – 제품 군” 을 기입하십시오. 제품 군은 홈페이지 응용분야 분류기준을 참고한다. (예) SZ5M0WWC9 – High-power LED Font 글씨체 표(Table) - 제목: Arial 10pt, 표 내부: Arial 8pt, 본문(Body) – Arial 9pt Revision numbering 기준:
- 가스펙은 0.0 부터 시작 0.x….
- Final 승인원: 1.0 부터 시작
- 기존에서 일부 수정: +0.1
- 새로운 Data 추가 /또는 기존 것 삭제: +1.0 수정일자 표기형식; YYYY-MM-DD (예) 2013-04-01 Company Information Published by Seoul Semiconductor © 2013 All Rights Reserved. Company Information Seoul Semiconductor (SeoulSemicon.com) manufacturers and packages a wide selection of light emitting diodes (LEDs) for the automotive, general illumination/lighting, appliance, signage and back lighting markets. The company is the world’s fifth largest LED supplier, holding more than 10,000 patents globally, while offering a wide range of LED technology and production capacity in areas such as “nPola”, deep UV LEDs, "Acrich", the world’s first commercially produced AC LED, and "Acrich MJT - Multi-Junction Technology" a proprietary family of high-voltage LEDs. The company’s broad product portfolio includes a wide array of package and device choices such as Acrich, high-brightness LEDs, mid-power LEDs, side-view LEDs, through-hole type LED lamps, custom displays, and sensors. The company is vertically integrated from epitaxial growth and chip manufacture in it’s fully owned subsidiary, Seoul Viosys, through packaged LEDs and LED modules in three Seoul Semiconductor manufacturing facilities. Seoul Viosys also manufactures a wide range of unique deep-UV wavelength devices. Legal Disclaimer Information in this document is provided in connection with Seoul Semiconductor products. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Seoul Semiconductor hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. The appearance and specifications of the product can be changed to improve the quality and/or performance without notice. ※ 주의사항 1) Revision은 내부 관리용으로 사용하고 홈페이지 등록 또는 고객사 제출시에는 이 페이지는 빼고 PDF로 변환하여 제출 2) Data Sheet 제출시에는 누락된 부분이 없는지 다시 한번 확인