STA0A12AP

LAT801-S SEOUL | Alldatasheet

Document overview

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• PDF pages: 23

Technical content

Description

제품사진

• 아래규격에 부합하는 이미지만 가능: 없을 경우 마케팅 팀에 의뢰
• 고해상도
• 흰 배경
• 표준크기: 제품이 가득 차게 가로 5cm 규격 으로 사각 위치에 맞게 (가로세로 비율 고정) Key Applications Features and Benefits Key Message: - ex) Enabling high flux systems while reduces LED count - ex) Enabling compact systems with high reliability - ex) High reliability and High quality of light - ex) Flicker-free AC/DC LED Solution - ex) High-efficient Dimming Solution Product Family: - ex) Mid-Power LED - ex) High-Power LED for Automotive - ex) Chip on Board Product ID (part number): - ex) STW8C2SA - ex) SZ5-M0-WN-C8 Description Features and Benefits Key Applications
• 표는 반드시 “Table 번호#. 표 설명” 을 제목으로 한다. www.seoulsemicon.com Product Data Sheet LAT801-S - 801 Series Amber Rev3.4, July 2019 Applicable for automotive interior light LAT801-S / STA0A12AP

801 Series Amber

• This White Colored surface-mount LED comes in standard package dimension. Package Size: 3.5x2.8x1.9mm
• It has a substrate made up of a molded plastic reflector sitting on top of a lead frame.
• The die is attached within the reflector cavity and the cavity is encapsulated by silicone.
• The package design coupled with careful selection of component materials allow these products to perform with high reliability.
• White PLCC2 Amber Color
• ESD min 2kV
• MSL 2a Level
• Viewing angle 120˚
• AEC-Q101 Qualified
• RoHS compliant
• Interior automotive
• Electronic sign and signals
• Electrical Equipment, Home appliance TV, PC, NB, MNT, Mobile Automotive Lighting, MR16, PAR, down light Bulb, LFT Outdoor, streetlight, tunnel, parking Home appliance Architectural, Entertainment Sign, Channel Sensor, Torch Application 응용제품 아이콘 삽입 AEC-Q101 RoHS

www.seoulsemicon.com Product Data Sheet  “제품 명 – 제품 군” 을 기입하십시오. 제품 군은 홈페이지 응용분야 분류기준을 참고한다. (예) SZ5M0WWC9 – High-power LED 글씨체는 : Arial, 10pt  Revision numbering 기준:

• 가스펙은 0.0 부터 시작 0.x….
• Final 승인원: 1.0 부터 시작
• 기존에서 일부 수정: +0.1
• 새로운 Data 추가 /또는 기존 것 삭제: +1.0  수정일자 표기형식; YYYY-MM-DD (예) 2013-04-01 LAT801-S - 801 Series Amber Rev3.4, July 2019  Table of Contents 는 Product Brief 다음 장에 위치 Table of Contents Index
• Product Brief 1
• Table of Contents 2
• Performance Characteristics 3
• Characteristics Graph 5
• Color Bin Structure 11
• Mechanical Dimensions 12
• Material Structure 13
• Recommended Solder Pad 14
• Reflow Soldering Characteristics 15
• Emitter Tape & Reel Packaging 16
• Product Nomenclature 18
• Handling of Silicone Resin for LEDs 19
• Precaution For Use 20
• Company Information 23

Product Data Sheet  “제품 명 – 제품 군” 을 기입하십시오.

• 가스펙은 0.0 부터 시작 0.x….
• Final 승인원: 1.0 부터 시작
• 기존에서 일부 수정: +0.1
• 새로운 Data 추가 /또는 기존 것 삭제: +1.0  수정일자 표기형식; YYYY-MM-DD (예) 2013-04-01 LAT801-S - 801 Series Amber Rev3.4, July 2019 Performance Characteristics  전기적 특성 및 광 특성 스펙 테이블

Table 1. Electro Optical Characteristics, IF = 20mA, Tj = 25ºC, RH30% Viewing Angle [3] 2θ1/2 120 deg. aligned with the mechanical axis of the LED package.

Product Data Sheet  “제품 명 – 제품 군” 을 기입하십시오.

• 가스펙은 0.0 부터 시작 0.x….
• Final 승인원: 1.0 부터 시작
• 기존에서 일부 수정: +0.1
• 새로운 Data 추가 /또는 기존 것 삭제: +1.0  수정일자 표기형식; YYYY-MM-DD (예) 2013-04-01 LAT801-S - 801 Series Amber Rev3.4, July 2019 Performance Characteristics  전기적 특성 및 광 특성 스펙 테이블

Table 2. Absolute Maximum Ratings

• LED’s properties might be different from suggested values like above and below tables if operation condition will be exceeded our parameter range. Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product.
• All measurements were made under the standardized environment of Seoul Semiconductor. Parameter Symbol Value Unit Power Dissipation (Ta=25℃) Pd 81 mW Forward Current (Ta=25℃) IF 30 mA Peak Forward Current (t≤ 10μsec,D≤5/1000,Ta=25℃) IFM 100 mA Operating Temperature Topr -40 ~ +110 ℃ Storage Temperature Tstg -40 ~ +110 ℃ Junction Temperature Tj 125 ℃ Soldering Temperature Tsld Reflow Soldering : 260 ℃ for 10sec. Hand Soldering : 315 ℃ for 4sec. ESD (R=1.5kΩ, C= 100pF) [1] Min 2 kV

www.seoulsemicon.com Product Data Sheet  “제품 명 – 제품 군” 을 기입하십시오. 제품 군은 홈페이지 응용분야 분류기준을 참고한다. (예) SZ5M0WWC9 – High-power LED 글씨체는 : Arial, 10pt  Revision numbering 기준:

• 가스펙은 0.0 부터 시작 0.x….
• Final 승인원: 1.0 부터 시작
• 기존에서 일부 수정: +0.1
• 새로운 Data 추가 /또는 기존 것 삭제: +1.0  수정일자 표기형식; YYYY-MM-DD (예) 2013-04-01 LAT801-S - 801 Series Amber Rev3.4, July 2019 Characteristics Graph  차트 사각형에 차트의 X축/ Y축을 맞춘다. Fig 1. Color Spectrum, IF = 10mA, Tj = 25ºC, RH30% Fig 2. Viewing Angle Distribution, IF = 10mA Relative Emission Intensity Wavelength [nm] 0.0 0.2 0.4 0.6 0.8 1.0 0.0 0.2 0.4 0.6 0.8 1.0 0.0 0.2 0.4 0.6 0.8 1.0 -90 -60 -30 0 400 500 600 700 800 0.0 0.2 0.4 0.6 0.8 1.0 Relative intensity Dominant wavelength (nm)

www.seoulsemicon.com Product Data Sheet  “제품 명 – 제품 군” 을 기입하십시오. 제품 군은 홈페이지 응용분야 분류기준을 참고한다. (예) SZ5M0WWC9 – High-power LED 글씨체는 : Arial, 10pt  Revision numbering 기준:

• 가스펙은 0.0 부터 시작 0.x….
• Final 승인원: 1.0 부터 시작
• 기존에서 일부 수정: +0.1
• 새로운 Data 추가 /또는 기존 것 삭제: +1.0  수정일자 표기형식; YYYY-MM-DD (예) 2013-04-01 LAT801-S - 801 Series Amber Rev3.4, July 2019 Characteristics Graph  차트 사각형에 차트의 X축/ Y축을 맞춘다. Fig 3. Forward Voltage vs. Forward Current, Tj = 25ºC Fig 4. Forward Current vs. Relative Luminous Intensity, Tj = 25ºC Forward Voltage [V] Forward Current [mA] ▷IV Forward Current [mA] △IV = IV / IV(10mA) 0 5 10 15 20 25 30 0.0 0.5 1.0 1.5 2.0 2.5 3.0 0 5 10 15 20 25 30 1.90 1.95 2.00 2.05 2.10 2.15

www.seoulsemicon.com Product Data Sheet  “제품 명 – 제품 군” 을 기입하십시오. 제품 군은 홈페이지 응용분야 분류기준을 참고한다. (예) SZ5M0WWC9 – High-power LED 글씨체는 : Arial, 10pt  Revision numbering 기준:

• 가스펙은 0.0 부터 시작 0.x….
• Final 승인원: 1.0 부터 시작
• 기존에서 일부 수정: +0.1
• 새로운 Data 추가 /또는 기존 것 삭제: +1.0  수정일자 표기형식; YYYY-MM-DD (예) 2013-04-01 LAT801-S - 801 Series Amber Rev3.4, July 2019 Characteristics Graph  차트 사각형에 차트의 X축/ Y축을 맞춘다. Fig 5. Forward Current vs. Wd Shift , Tj = 25ºC ▷Wd Forward Current [mA] △Wd = Wd - Wd(10mA) 0 5 10 15 20 25 30 -0.4 -0.2 0.0 0.2 0.4 0.6 0.8

www.seoulsemicon.com Product Data Sheet  “제품 명 – 제품 군” 을 기입하십시오. 제품 군은 홈페이지 응용분야 분류기준을 참고한다. (예) SZ5M0WWC9 – High-power LED 글씨체는 : Arial, 10pt  Revision numbering 기준:

• 가스펙은 0.0 부터 시작 0.x….
• Final 승인원: 1.0 부터 시작
• 기존에서 일부 수정: +0.1
• 새로운 Data 추가 /또는 기존 것 삭제: +1.0  수정일자 표기형식; YYYY-MM-DD (예) 2013-04-01 LAT801-S - 801 Series Amber Rev3.4, July 2019 Characteristics Graph  차트 사각형에 차트의 X축/ Y축을 맞춘다. Fig 6. Relative Light Output vs. Junction Temperature, IF = 10mA Fig 7. Junction Temperature vs. Forward Voltage shift, IF = 10mA △IV = IV / IV(25℃) Junction Temperature [℃] Junction Temperature [℃] △VF = VF - VF(25℃) ▷IV ▷VF -40 -20 0 20 40 60 80 100 0.4 0.6 0.8 1.0 1.2 1.4 -40 -20 0 20 40 60 80 100 -0.15 -0.10 -0.05 0.00 0.05 0.10

www.seoulsemicon.com Product Data Sheet  “제품 명 – 제품 군” 을 기입하십시오. 제품 군은 홈페이지 응용분야 분류기준을 참고한다. (예) SZ5M0WWC9 – High-power LED 글씨체는 : Arial, 10pt  Revision numbering 기준:

• 가스펙은 0.0 부터 시작 0.x….
• Final 승인원: 1.0 부터 시작
• 기존에서 일부 수정: +0.1
• 새로운 Data 추가 /또는 기존 것 삭제: +1.0  수정일자 표기형식; YYYY-MM-DD (예) 2013-04-01 LAT801-S - 801 Series Amber Rev3.4, July 2019 Characteristics Graph  차트 사각형에 차트의 X축/ Y축을 맞춘다. Fig 8. Relative dominant wavelength vs. Junction Temperature, IF = 10mA Junction Temperature [℃] ▷Wd △Wd = Wd - Wd(25℃) -40 -20 0 20 40 60 80 100

www.seoulsemicon.com Product Data Sheet  “제품 명 – 제품 군” 을 기입하십시오. 제품 군은 홈페이지 응용분야 분류기준을 참고한다. (예) SZ5M0WWC9 – High-power LED 글씨체는 : Arial, 10pt  Revision numbering 기준:

• 가스펙은 0.0 부터 시작 0.x….
• Final 승인원: 1.0 부터 시작
• 기존에서 일부 수정: +0.1
• 새로운 Data 추가 /또는 기존 것 삭제: +1.0  수정일자 표기형식; YYYY-MM-DD (예) 2013-04-01 LAT801-S - 801 Series Amber Rev3.4, July 2019 Characteristics Graph  차트 사각형에 차트의 X축/ Y축을 맞춘다. Fig 9. Maximum Forward Current vs. Temperature Forward Current IF [mA] Ambient Temperature Ta[℃] -40 -20 0 20 40 60 80 100 Ts B A Ta Ta : Ambient Ts : Solder point

Product Data Sheet  “제품 명 – 제품 군” 을 기입하십시오.

• 가스펙은 0.0 부터 시작 0.x….
• Final 승인원: 1.0 부터 시작
• 기존에서 일부 수정: +0.1
• 새로운 Data 추가 /또는 기존 것 삭제: +1.0  수정일자 표기형식; YYYY-MM-DD (예) 2013-04-01 LAT801-S - 801 Series Amber Rev3.4, July 2019 Color Bin Structure  Color Bin CIE 그래프는 한 장에 넣는다. *Notes : (1) All measurements were made under the standardized environment of Seoul Semiconductor In order to ensure availability, single color rank will not be orderable. Available ranks

Table 3. Bin Code description, IF = 10mA, Tj = 25ºC

www.seoulsemicon.com Product Data Sheet  “제품 명 – 제품 군” 을 기입하십시오. 제품 군은 홈페이지 응용분야 분류기준을 참고한다. (예) SZ5M0WWC9 – High-power LED 글씨체는 : Arial, 10pt  Revision numbering 기준:

• 가스펙은 0.0 부터 시작 0.x….
• Final 승인원: 1.0 부터 시작
• 기존에서 일부 수정: +0.1
• 새로운 Data 추가 /또는 기존 것 삭제: +1.0  수정일자 표기형식; YYYY-MM-DD (예) 2013-04-01 LAT801-S - 801 Series Amber Rev3.4, July 2019 Mechanical Dimensions (1) All dimensions are in millimeters. (2) Scale : none (3) Undefined tolerance is ±0.1mm Top View Side View Circuit 0.80 1.9 0.15 0.50 1.50 0.85 Cathode mark (-) 3.20 C0.8 2.40 1.65 2.20 2.80 3.50 Anode Cathode 2 1

www.seoulsemicon.com Product Data Sheet  “제품 명 – 제품 군” 을 기입하십시오. 제품 군은 홈페이지 응용분야 분류기준을 참고한다. (예) SZ5M0WWC9 – High-power LED 글씨체는 : Arial, 10pt  Revision numbering 기준:

• 가스펙은 0.0 부터 시작 0.x….
• Final 승인원: 1.0 부터 시작
• 기존에서 일부 수정: +0.1
• 새로운 Data 추가 /또는 기존 것 삭제: +1.0  수정일자 표기형식; YYYY-MM-DD (예) 2013-04-01 LAT801-S - 801 Series Amber Rev3.4, July 2019 Material Structure * PKG 단면 도식도 넣을 것 Parts No. Name Description Materials ① LEAD FRAME Metal Copper Alloy (Ag Plated) ② Chip Source Amber LED AlInGaP ③ Wire Metal Gold Wire ④ Encapsulation Silicone ⑤ Body PPA Heat-resistant Polymer ② ③ ④

www.seoulsemicon.com Product Data Sheet  “제품 명 – 제품 군” 을 기입하십시오. 제품 군은 홈페이지 응용분야 분류기준을 참고한다. (예) SZ5M0WWC9 – High-power LED 글씨체는 : Arial, 10pt  Revision numbering 기준:

• 가스펙은 0.0 부터 시작 0.x….
• Final 승인원: 1.0 부터 시작
• 기존에서 일부 수정: +0.1
• 새로운 Data 추가 /또는 기존 것 삭제: +1.0  수정일자 표기형식; YYYY-MM-DD (예) 2013-04-01 LAT801-S - 801 Series Amber Rev3.4, July 2019 Recommended Solder Pad Notes : (1) All dimensions are in millimeters. (2) Scale : none (3) This drawing without tolerances are for reference only. (4) Undefined tolerance is ±0.1mm. Paddesign for improved heat dissipation Solder resistCu-area > 16mm2 Recommended Solder Pad Heat pad

www.seoulsemicon.com Product Data Sheet  “제품 명 – 제품 군” 을 기입하십시오. 제품 군은 홈페이지 응용분야 분류기준을 참고한다. (예) SZ5M0WWC9 – High-power LED 글씨체는 : Arial, 10pt  Revision numbering 기준:

• 가스펙은 0.0 부터 시작 0.x….
• Final 승인원: 1.0 부터 시작
• 기존에서 일부 수정: +0.1
• 새로운 Data 추가 /또는 기존 것 삭제: +1.0  수정일자 표기형식; YYYY-MM-DD (예) 2013-04-01 LAT801-S - 801 Series Amber Rev3.4, July 2019 Reflow Soldering Characteristics Caution (1) Reflow soldering is recommended not to be done more than two times. In the case of more than 24 hours passed soldering after first, LEDs will be damaged. (2) Repairs should not be done after the LEDs have been soldered. When repair is unavoidable, suitable tools must be used. (3) Die slug is to be soldered. (4) When soldering, do not put stress on the LEDs during heating. (5) After soldering, do not warp the circuit board. IPC/JEDEC J-STD-020 Profile Feature Sn-Pb Eutectic Assembly Pb-Free Assembly Average ramp-up rate (Tsmax to Tp) 3° C/second max. 3° C/second max. Preheat - Temperature Min (Tsmin) - Temperature Max (Tsmax) - Time (Tsmin to Tsmax) (ts) 100 °C 150 °C 60-120 seconds 150 °C 200 °C 60-180 seconds Time maintained above: - Temperature (TL) - Time (tL) 183 °C 60-150 seconds 217 °C 60-150 seconds Peak Temperature (Tp) 215℃ 260℃ Time within 5°C of actual Peak Temperature (tp)2 10-30 seconds 20-40 seconds Ramp-down Rate 6 °C/second max. 6 °C/second max. Time 25°C to Peak Temperature 6 minutes max. 8 minutes max.

www.seoulsemicon.com Product Data Sheet  “제품 명 – 제품 군” 을 기입하십시오. 제품 군은 홈페이지 응용분야 분류기준을 참고한다. (예) SZ5M0WWC9 – High-power LED 글씨체는 : Arial, 10pt  Revision numbering 기준:

• 가스펙은 0.0 부터 시작 0.x….
• Final 승인원: 1.0 부터 시작
• 기존에서 일부 수정: +0.1
• 새로운 Data 추가 /또는 기존 것 삭제: +1.0  수정일자 표기형식; YYYY-MM-DD (예) 2013-04-01 LAT801-S - 801 Series Amber Rev3.4, July 2019 Emitter Tape & Reel Packaging (1) Quantity : Max 2,000pcs/Reel (2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm (3) Adhesion Strength of Cover Tape Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at the angle of 10˚ to the carrier tape. (4) Package : P/N, Manufacturing data Code No. and Quantity to be indicated on a damp proof Package. 3.83±0.1 8±0.1 1.75±0.13.5±0.1 8°1.0±0.1 3.1±0.1 2.0±0.05 4.0±0.1 1.55 ± 0.05 0.22±0.05 2.22±0.1 0.22.0 ± 6030° ±0.2 LABLE 11.4 0.39.0 ± ± 0.1 180 ( Tolerance: ±0.2, Unit: mm ) Package Marking Cathode

www.seoulsemicon.com Product Data Sheet  “제품 명 – 제품 군” 을 기입하십시오. 제품 군은 홈페이지 응용분야 분류기준을 참고한다. (예) SZ5M0WWC9 – High-power LED 글씨체는 : Arial, 10pt  Revision numbering 기준:

• 가스펙은 0.0 부터 시작 0.x….
• Final 승인원: 1.0 부터 시작
• 기존에서 일부 수정: +0.1
• 새로운 Data 추가 /또는 기존 것 삭제: +1.0  수정일자 표기형식; YYYY-MM-DD (예) 2013-04-01 LAT801-S - 801 Series Amber Rev3.4, July 2019 Emitter Tape & Reel Packaging Reel Aluminum Bag Outer Box

Product Data Sheet  “제품 명 – 제품 군” 을 기입하십시오.

• 가스펙은 0.0 부터 시작 0.x….
• Final 승인원: 1.0 부터 시작
• 기존에서 일부 수정: +0.1
• 새로운 Data 추가 /또는 기존 것 삭제: +1.0  수정일자 표기형식; YYYY-MM-DD (예) 2013-04-01 LAT801-S - 801 Series Amber Rev3.4, July 2019 Product Nomenclature  제품 명명법 (nomenclature) Part Number Code Description Part Number Value X1 Company L SSC Code X2 Color A Amber X7 Encapsulating type S Silicone Molded Lot Number Code Description Lot Number Value Y1Y2 Year Y3 Month Y4Y5 Day Y6 Top View LED series Y7Y8Y9Y10 Mass order Y11Y12Y13Y14Y15Y16Y17 Internal Number

Table 4. Part Numbering System : X1X2X3X4X5X6-X7 Table 5. Lot Numbering System :Y1Y2Y3Y4Y5Y6Y7Y8Y9Y10–Y11Y12Y13Y14Y15Y16Y17

www.seoulsemicon.com Product Data Sheet  “제품 명 – 제품 군” 을 기입하십시오. 제품 군은 홈페이지 응용분야 분류기준을 참고한다. (예) SZ5M0WWC9 – High-power LED 글씨체는 : Arial, 10pt  Revision numbering 기준:

• 가스펙은 0.0 부터 시작 0.x….
• Final 승인원: 1.0 부터 시작
• 기존에서 일부 수정: +0.1
• 새로운 Data 추가 /또는 기존 것 삭제: +1.0  수정일자 표기형식; YYYY-MM-DD (예) 2013-04-01 LAT801-S - 801 Series Amber Rev3.4, July 2019 Handling of Silicone Resin for LEDs (1) During processing, mechanical stress on the surface should be minimized as much as possible. Sharp objects of all types should not be used to pierce the sealing compound. (2) In general, LEDs should only be handled from the side. By the way, this also applies to LEDs without a silicone sealant, since the surface can also become scratched. (3) When populating boards in SMT production, there are basically no restrictions regarding the form of the pick and place nozzle, except that mechanical pressure on the surface of the resin must be prevented. This is assured by choosing a pick and place nozzle which is larger than the LED’s reflector area. (4) Silicone differs from materials conventionally used for the manufacturing of LEDs. These conditions must be considered during the handling of such devices. Compared to standard encapsulants, silicone is generally softer, and the surface is more likely to attract dust. As mentioned previously, the increased sensitivity to dust requires special care during processing. In cases where a minimal level of dirt and dust particles cannot be guaranteed, a suitable cleaning solution must be applied to the surface after the soldering of components. (5) Seoul Semiconductor suggests using isopropyl alcohol for cleaning. In case other solvents are used, it must be assured that these solvents do not dissolve the package or resin. Ultrasonic cleaning is not recommended. Ultrasonic cleaning may cause damage to the LED. (6) Please do not mold this product into another resin (epoxy, urethane, etc) and do not handle this. product with acid or sulfur material in sealed space.

www.seoulsemicon.com Product Data Sheet  “제품 명 – 제품 군” 을 기입하십시오. 제품 군은 홈페이지 응용분야 분류기준을 참고한다. (예) SZ5M0WWC9 – High-power LED 글씨체는 : Arial, 10pt  Revision numbering 기준:

• 가스펙은 0.0 부터 시작 0.x….
• Final 승인원: 1.0 부터 시작
• 기존에서 일부 수정: +0.1
• 새로운 Data 추가 /또는 기존 것 삭제: +1.0  수정일자 표기형식; YYYY-MM-DD (예) 2013-04-01 LAT801-S - 801 Series Amber Rev3.4, July 2019 Precaution for Use (1) Storage To avoid the moisture penetration, we recommend store in a dry box with a desiccant. The recommended storage temperature range is 5℃ to 30℃ and a maximum humidity of RH50%. (2) Use Precaution after Opening the Packaging Use proper SMT techniques when the LED is to be soldered dipped as separation of the lens may affect the light output efficiency. Pay attention to the following: a. Recommend conditions after opening the package - Sealing - Temperature : 5 ~ 30℃ Humidity : less than RH60% b. If the package has been opened more than 4 week(MSL_2a) or the color of the desiccant changes, components should be dried for 10-24hr at 65±5℃ (3) Do not apply mechanical force or excess vibration during the cooling process to normal temperature after soldering. (4) Do not rapidly cool device after soldering. (5) Components should not be mounted on warped (non coplanar) portion of PCB. (6) Radioactive exposure is not considered for the products listed here in. (7) Gallium arsenide is used in some of the products listed in this publication. These products are dangerous if they are burned or shredded in the process of disposal. It is also dangerous to drink the liquid or inhale the gas generated by such products when chemically disposed of. (8) This device should not be used in any type of fluid such as water, oil, organic solvent and etc. When washing is required, IPA (Isopropyl Alcohol) should be used. (9) When the LEDs are in operation the maximum current should be decided after measuring the package temperature. (10) LEDs must be stored in a clean environment. We recommend LEDs store in nitrogen-filled container.

www.seoulsemicon.com Product Data Sheet  “제품 명 – 제품 군” 을 기입하십시오. 제품 군은 홈페이지 응용분야 분류기준을 참고한다. (예) SZ5M0WWC9 – High-power LED 글씨체는 : Arial, 10pt  Revision numbering 기준:

• 가스펙은 0.0 부터 시작 0.x….
• Final 승인원: 1.0 부터 시작
• 기존에서 일부 수정: +0.1
• 새로운 Data 추가 /또는 기존 것 삭제: +1.0  수정일자 표기형식; YYYY-MM-DD (예) 2013-04-01 LAT801-S - 801 Series Amber Rev3.4, July 2019 Precaution for Use (11) The appearance and specifications of the product may be modified for improvement without notice. (12) Long time exposure of sunlight or occasional UV exposure will cause lens discoloration. (13) VOCs (Volatile organic compounds) emitted from materials used in the construction of fixtures can penetrate silicone encapsulants of LEDs and discolor when exposed to heat and photonic energy. The result can be a significant loss of light output from the fixture. Knowledge of the properties of the materials selected to be used in the construction of fixtures can help prevent these issues. (14) Attaching LEDs, do not use adhesives that outgas organic vapor. (15) The driving circuit must be designed to allow forward voltage only when it is ON or OFF. If the reverse voltage is applied to LED, migration can be generated resulting in LED damage. (16) Similar to most Solid state devices; LEDs are sensitive to Electro-Static Discharge (ESD) and Electrical Over Stress (EOS). Below is a list of suggestions that Seoul Semiconductor purposes to minimize these effects. a. ESD (Electro Static Discharge) Electrostatic discharge (ESD) is the defined as the release of static electricity when two objects come into contact. While most ESD events are considered harmless, it can be an expensive problem in many industrial environments during production and storage. The damage from ESD to an LEDs may cause the product to demonstrate unusual characteristics such as: - Increase in reverse leakage current lowered turn-on voltage - Abnormal emissions from the LED at low current The following recommendations are suggested to help minimize the potential for an ESD event. One or more recommended work area suggestions: - Ionizing fan setup - ESD table/shelf mat made of conductive materials - ESD safe storage containers One or more personnel suggestion options: - Antistatic wrist-strap - Antistatic material shoes - Antistatic clothes Environmental controls: - Humidity control (ESD gets worse in a dry environment)

www.seoulsemicon.com Product Data Sheet  “제품 명 – 제품 군” 을 기입하십시오. 제품 군은 홈페이지 응용분야 분류기준을 참고한다. (예) SZ5M0WWC9 – High-power LED 글씨체는 : Arial, 10pt  Revision numbering 기준:

• 가스펙은 0.0 부터 시작 0.x….
• Final 승인원: 1.0 부터 시작
• 기존에서 일부 수정: +0.1
• 새로운 Data 추가 /또는 기존 것 삭제: +1.0  수정일자 표기형식; YYYY-MM-DD (예) 2013-04-01 LAT801-S - 801 Series Amber Rev3.4, July 2019 Precaution for Use b. EOS (Electrical Over Stress) Electrical Over-Stress (EOS) is defined as damage that may occur when an electronic device is subjected to a current or voltage that is beyond the maximum specification limits of the device. The effects from an EOS event can be noticed through product performance like: - Changes to the performance of the LED package (If the damage is around the bond pad area and since the package is completely encapsulated the package may turn on but flicker show severe performance degradation.) - Changes to the light output of the luminaire from component failure - Components on the board not operating at determined drive power Failure of performance from entire fixture due to changes in circuit voltage and current across total circuit causing trickle down failures. It is impossible to predict the failure mode of every LED exposed to electrical overstress as the failure modes have been investigated to vary, but there are some common signs that will indicate an EOS event has occurred: - Damaged may be noticed to the bond wires (appearing similar to a blown fuse) - Damage to the bond pads located on the emission surface of the LED package (shadowing can be noticed around the bond pads while viewing through a microscope) - Anomalies noticed in the encapsulation and phosphor around the bond wires - This damage usually appears due to the thermal stress produced during the EOS event c. To help minimize the damage from an EOS event Seoul Semiconductor recommends utilizing: - A surge protection circuit - An appropriately rated over voltage protection device - A current limiting device

www.seoulsemicon.com Product Data Sheet  “제품 명 – 제품 군” 을 기입하십시오. 제품 군은 홈페이지 응용분야 분류기준을 참고한다. (예) SZ5M0WWC9 – High-power LED 글씨체는 : Arial, 10pt  Revision numbering 기준:

• 가스펙은 0.0 부터 시작 0.x….
• Final 승인원: 1.0 부터 시작
• 기존에서 일부 수정: +0.1
• 새로운 Data 추가 /또는 기존 것 삭제: +1.0  수정일자 표기형식; YYYY-MM-DD (예) 2013-04-01 LAT801-S - 801 Series Amber Rev3.4, July 2019 Company Information Published by Seoul Semiconductor © 2013 All Rights Reserved. Company Information Seoul Semiconductor (www.SeoulSemicon.com) manufacturers and packages a wide selection of light emitting diodes (LEDs) for the automotive, general illumination/lighting, Home appliance, signage and back lighting markets. The company is the world’s fifth largest LED supplier, holding more than 10,000 patents globally, while offering a wide range of LED technology and production capacity in areas such as “nPola”, "Acrich", the world’s first commercially produced AC LED, and "Acrich MJT - Multi-Junction Technology" a proprietary family of high-voltage LEDs. The company’s broad product portfolio includes a wide array of package and device choices such as Acrich and Acirch2, high-brightness LEDs, mid-power LEDs, side-view LEDs, and through-hole type LEDs as well as custom modules, displays, and sensors. Legal Disclaimer Information in this document is provided in connection with Seoul Semiconductor products. With respect to any examples or hints given herein, any typical values stated herein and/or any information regarding the application of the device, Seoul Semiconductor hereby disclaims any and all warranties and liabilities of any kind, including without limitation, warranties of non-infringement of intellectual property rights of any third party. The appearance and specifications of the product can be changed to improve the quality and/or performance without notice. ※ 주의사항 1) Revision은 내부 관리용으로 사용하고 홈페이지 등록 또는 고객사 제출시에는 이 페이지는 빼고 PDF로 변환하여 제출 2) Data Sheet 제출시에는 누락된 부분이 없는지 다시 한번 확인