UPGT801 SEOUL | Alldatasheet

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Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Document No. : SSC-QP-7-07-24 (Rev.00) Specification UPGT801 CUSTOMER ApprovalApprovalDrawn SSC

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Document No. : SSC-QP-7-07-24 (Rev.00) UPGT801 1. Features 2. Absolute Maximum Ratings 3. Electro Characteristics 4. Optical characteristics 5. Outline Dimension 6. Packing 7. Soldering 8. Precaution for use

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Document No. : SSC-QP-7-07-24 (Rev.00) UPGT801 UPGT801 Description Features 사진 • Industry Standard PLCC SMT package

  • High brightness using AlInGaP and InGaN dice technologies
  • Available in multiple colors
  • High volume, high reliability This surface-mount LED comes in PLCC standard package dimension. It has a substrate made up of a molded plastic reflector sitting on top of a bent lead frame. The die is attached within the reflector cavity and the cavity is encapsulated by epoxy or silicone The package design coupled with careful selection of component materials allow these products to perform with high reliability in a larger temperature range -40℃ to 100℃. The high reliability feature is crucial to Automotive interior and Indoor ESS.

Applications

  • Interior automotive
  • Electronic Signs and Signals
  • Office Automation, Electrical Appliances, Industrial Equipment

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Document No. : SSC-QP-7-07-24 (Rev.00) 1. Features

  • Green colored SMT package
  • Material AlInGaP
  • Suitable for all SMT assembly methods Suitable for all soldering methods
  • RoHS Compliant

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Document No. : SSC-QP-7-07-24 (Rev.00) 2. Absolute maximum ratings oC-40 ~ +100TstgStorage Temperature oC-40 ~ +100ToprOperating Temperature V5VRReverse Voltage mA90IFM *2Peak Forward Current mA30IFForward Current mW123PdPower Dissipation UnitValueSymbolParameter *1 Care is to be taken that power dissipation does not exceed the absolute maximum rating of the product. *2 IFM was measured at TW ≤ 1msec of pulse width and D ≤ 1/10 of duty ratio. 3. Electric characteristics deg.-120-IF =20mA2θ ½Viewing Angle *2 nm-30-IF =20mA∆λSpectral Bandwidth 50% nm566562554IF =20mAλdDominant Wavelength nm-557-IF =20mAλPPeak Wavelength mcd361712IF =20mAIVLuminance Intensity *1 µA10--VR=5VIRReverse Current V2.72.21.7IF =20mAVFForward Voltage UnitMaxTypMinConditionSymbolParameter *1. The luminous intensity IV was measured at the peak of the spatial pattern which may not be aligned with the mechanical axis of the LED package. Luminous Intensity Measurement allowance is ±10% *2. 2θ½ is the off-axis where the luminous intensity is 1/2 of the peak intensity.

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Document No. : SSC-QP-7-07-24 (Rev.00) 4. Optical characteristics 0 5 10 15 20 25 30 0. 0 0. 2 0. 4 0. 6 0. 8 1. 0 1. 2 1. 4 1. 6 (Ta=25 OC ) Forward Current vs. Forward Voltage (Ta=25 OC ) Forward Voltage VF (V) Forward Current IF [mA] Radiation DiagramForward Current Derating Curve -40 -20 0 20 40 60 80 100 120 Ambient Temperature TA [OC] Forward Current IF [mA] (Ta=25 OC ) -90 -60 -30 Relative Lum inous Intens ity Iv/Iv [Rel] Relative Luminous Intensity vs Forward Current Forward Current IF [mA]

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Document No. : SSC-QP-7-07-24 (Rev.00) 5.outline dimension 2.8 2.2 3.2 2.4 1.6 0.8 1.9 0.8 0.15 Cathode Mark Anode Cathode Recommended Solder Pattern 1.6 2.2 1.8 1.8 6. packing 3.83±0.1 8±0.1 1.75±0.13.5±0.1 8°1.0± 0. 1 3. 1± 0. 1 1. 55 ± 0.05 0. 22±0.05 2. 22± 0. 1 0.22.0 ± 6030° ±0.2 LABLE 11.4 0.39.0 ± ±0 .1 180 ( Tolerance: ±0.2, Unit: mm ) (1) Quantity : 2000pcs/Reel (2) Cumulative Tolerance : Cumulative Tolerance/10 pitches to be ±0.2mm (3) Adhesion Strength of Cover Tape : Adhesion strength to be 0.1-0.7N when the cover tape is turned off from the carrier tape at the angle of 10º to the carrier tape (4) Package : P/N, Manufacturing data Code No. and quantity to be indicated on a damp proof Package

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Document No. : SSC-QP-7-07-24 (Rev.00)

  • Reel Packing Structure ca b

1 SIDE

SIZE (mm) Outer Box Structure Material : Paper(SW3B(B)) TYPE a b c HUMIDITY INDICATOR Aluminum Vinyl Bag Reel DESI PAK PART NUMBER : LOT NUMBER : XXXXXXXXX X QUANTITY : XXXX SEOUL SEMICONDUCTOR CO., LTD. PART NUMBER : LOT NUMBER : XXXXXXXXXX QUANTITY : XXXX SEOUL SEMICONDUCTOR CO., LTD. PART NUMBER : LOT NUMBER : XXXXXXXXXX QUANTITY : XXXX SEOUL SEMICONDUCTOR CO., LTD. RoHS

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Document No. : SSC-QP-7-07-24 (Rev.00) 7. soldering 10 sec. Max.Soldering time Condition 240℃ Max.Peak-Temperature 120 sec. Max.Pre-heat time 120~150℃Pre-heat Lead Solder 10 sec. Max.Soldering time Condition 260℃ Max.Peak-Temperature 120 sec. Max.Pre-heat time 150~200℃Pre-heat Lead Free Solder 260 C Max. 10 sec. Max. o 60sec. Max. Above 220 C 120sec. Max. Pre-heating 150~200 C1~5 C / sec. ooo o1~5 C / sec. Lead Solder 2.5~5 C / sec.o o o Pre-heating 120~150 C 120sec. Max. 60sec. Max. Above 200 C o240 C Max. 10 sec. Max. 2.5~5 C / sec. (1) Lead Solder (2) Lead-Free Solder Lead-frame Solder (3) Hand Soldering conditions Do not exceed 4 seconds at maximum 315ºC under soldering iron. Note : In case that the soldered products are reused in soldering process, we don’t guarantee the products.

Z-Power LED X10490Z-Power LED X10490 Technical Data Sheet Document No. : SSC-QP-7-07-24 (Rev.00) 8. precaution for use (1) Storage In order to avoid the absorption of moisture, it is recommended to store in a dry box (or a desicator) with a desiccant. Otherwise, to store them in the following environment is recommended. Temperature : 5ºC ~30ºC Humidity : maximum 70%RH (2) Attention after open. LED is correspond to SMD, when LED be soldered dip, interfacial separation may affect the light transmission efficiency, causing the light intensity to drop. Attention in followed; Keeping of a fraction Temperature : 5 ~ 40ºC Humidity : less than 10% (3) In the case of more than 1 week passed after opening or change color of indicator on desiccant, components shall be dried 10-12hr. at 60±5ºC. (4) Any mechanical force or any excess vibration shall not be accepted to apply during cooling process to normal temperature after soldering. (5) Quick cooling shall be avoided. (6) Components shall not be mounted on warped direction of PCB. (7) Anti radioactive ray design is not considered for the products. (8) This device should not be used in any type of fluid such as water, oil, organic solvent etc. When washing is required, IPA should be used. (9) When the LEDs are illuminating, operating current should be decided after considering the ambient maximum temperature. (10) The LEDs must be soldered within seven days after opening the moisture-proof packing. (11) Repack unused products with anti-moisture packing, fold to close any opening and then store in a dry place. (12) The appearance and specifications of the product may be modified for improvement without notice.