TNY263GTL

TNY263 POWERINT | Alldatasheet

Document overview

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Technical content

Enhanced, Energy Efficient, Low Power Off-line Switcher Figure 1. Typical Standby Application.

• Fully integrated auto-restart for short circuit and open loop fault protection – saves external component costs
• Built-in circuitry practically eliminates audible noise with ordinary dip-varnished transformer
• Programmable line under-voltage detect feature prevents power on/off glitches – saves external components
• Frequency jittering dramatically reduces EMI (~10 dB) – minimizes EMI filter component costs
• 132 kHz operation reduces transformer size – allows use of EF12.6 or EE13 cores for low cost and small size
• Very tight tolerances and negligible temperature variation on key parameters eases design and lowers cost
• Lowest component count switcher solution
• Expanded scalable device family for low system cost Better Cost/Performance over RCC & Linears
• Lower system cost than RCC, discrete PWM and other integrated/hybrid solutions
• Cost effective replacement for bulky regulated linears
• Simple ON/OFF control – no loop compensation needed
• No bias winding – simpler, lower cost transformer
• Simple design practically eliminates rework in manufacturing EcoSmart – Extremely Energy Efficient
• No load consumption <50 mW with bias winding and <250 mW without bias winding at 265 V AC input
• Meets California Energy Commission (CEC), Energy Star, and EU requirements
• Ideal for cell-phone charger and PC standby applications High Performance at Low Cost
• High voltage powered – ideal for charger applications
• High bandwidth provides fast turn on with no overshoot
• Current limit operation rejects line frequency ripple
• Built-in current limit and thermal protection improves safety

Description

TinySwitch-II integrates a 700 V power MOSFET, oscillator, high voltage switched current source, current limit and thermal shutdown circuitry onto a monolithic device. The start-up and operating power are derived directly from the voltage on the DRAIN pin, eliminating the need for a bias winding and associated circuitry. In addition, the PI-2684-101700 Wide-Range HV DC Input D S EN/UV BP DC Output TinySwitch-II Optional UV Resistor April 2005 Table 1. Notes: 1. Minimum continuous power in a typical non-ventilated enclosed adapter measured at 50 °C ambient.

1. Minimum practical continuous power in an open frame

and average EMI, minimizing filtering cost.

230 VAC ±15% 85-265 VAC

Figure 2. Functional Block Diagram. Figure 3. Pin Configuration. current for both start-up and steady-state operation. internally generated 5.8 V supply. Output MOSFET source connection for high voltage return.

1.0 V + VT

Figure 4. Frequency Jitter. a simple ON/OFF control to regulate the output voltage.

5.8 V regulator, BYPASS pin under-voltage circuit, over-

block diagram with the most important features. indicates the beginning of each cycle. illustrates the frequency jitter of the TinySwitch-II. adjusts the current limit level accordingly in discrete amounts. is usually connected to this pin. pin is the internal supply voltage node for the TinySwitch-II. high frequency decoupling and energy storage. no-load consumption to about 50 mW. MOSFET when the BYPASS pin voltage drops below 4.8 V . back to 5.8 V to enable (turn-on) the power MOSFET.

Figure 5. TinySwitch-II Auto-Restart Operation. board due to a continuous fault condition. The current limit circuit senses the current in the power MOSFET. by discrete amounts under medium and light loads. operation in the presence of an output short circuit. time until the line under-voltage condition ends. to proceed with the next switching cycle as described earlier. The sequence of cycles is used to determine the current limit. per switch cycle and the delay of the feedback. output voltage is less than the reference voltage.

Figure 14. 2.5 W Constant Voltage, Constant Current Battery Charger with Universal Input (85-265 VAC). eliminates the cost of a bias winding and associated components. power consumption and improving full-load efficiency. constant power delivery independent of input voltage. decoupling the internal power supply of the TinySwitch-II. appliance control and ISDN or a DSL network termination. EF12.6 core transformer while still providing good efficiency. to zero volts on the output.

G TNY263-268 line sense resistors R2 and R3 sense the DC input voltage for line under-voltage. When the AC is turned off, the under- voltage detect feature of the TinySwitch-II prevents auto-restart glitches at the output caused by the slow discharge of large storage capacitance in the main converter. This is achieved by preventing the TinySwitch-II from switching when the input voltage goes below a level needed to maintain output regulation, and keeping it off until the input voltage goes above the under- voltage threshold, when the AC is turned on again. With R2 and R3, giving a combined value of 2 M Ω, the power up under- voltage threshold is set at 200 VDC, slightly below the lowest required operating DC input voltage, for start-up at 170 V AC, with doubler. This feature saves several components needed to implement the glitch-free turn-off compared with discrete or TOPSwitch-II based designs. During turn-on the rectified DC input voltage needs to exceed 200 V under-voltage threshold for the power supply to start operation. But, once the power supply is on it will continue to operate down to 140 V rectified DC input voltage to provide the required hold up time for the standby output. The auxiliary primary side winding is rectified and filtered by D2 and C2 to create a 12 V primary bias output voltage for the main power supply primary controller. In addition, this voltage is used to power the TinySwitch-II via R4. Although not necessary for operation, supplying the TinySwitch-II externally reduces the device quiescent dissipation by disabling the internal drain derived current source normally used to keep the BYPASS pin capacitor (C3) charged. An R4 value of 10 k Ω provides 600 µA into the BYPASS pin, which is slightly in excess of the current consumption of TinySwitch-II. The excess current is safely clamped by an on-chip active Zener diode to 6.3 V . The secondary winding is rectified and filtered by D3 and C6. For a 15 W design an additional output capacitor, C7, is required due to the larger secondary ripple currents compared to the 10 W standby design. The auto-restart function limits output current during short circuit conditions, removing the need to over rate D3. Switching noise filtering is provided by L1 and C8. The 5 V output is sensed by U2 and VR1. R5 is used to ensure that the Zener diode is biased at its test current and R6 centers the output voltage at 5 V . In many cases the Zener regulation method provides sufficient accuracy (typically ± 6% over a 0 °C to 50 °C temperature range). This is possible because TinySwitch-II limits the dynamic range of the optocoupler LED current, allowing the Zener diode to operate at near constant bias current. However, if higher accuracy is required, a TL431 precision reference IC may be used to replace VR1.

2.5 W CV/CC Cell-Phone Charger

As an example, Figure 14 shows a TNY264 based 5 V ,

0.5 A, cellular phone charger operating over a universal input

range (85 V AC to 265 V AC). The inductor (L1) forms a π-filter in conjunction with C1 and C2. The resistor R1 damps resonances in the inductor L1. Frequency jittering operation of TinySwitch-II allows the use of a simple π-filter described above in combination with a single low value Y1-capacitor (C8) to meet worldwide conducted EMI standards. The addition of a shield winding in the transformer allows conducted EMI to be met even with the output capacitively earthed (which is the worst case condition for EMI). The diode D6, capacitor C3 and resistor R2 comprise the clamp circuit, limiting the leakage inductance turn-off voltage spike on the TinySwitch-II DRAIN pin to a safe value. The output voltage is determined by the sum of the optocoupler U2 LED forward drop (~1 V), and Zener diode VR1 voltage. Resistor R8 maintains a bias current through the Zener diode to ensure it is operated close to the Zener test current. A simple constant current circuit is implemented using the VBE of transistor Q1 to sense the voltage across the current sense resistor R4. When the drop across R4 exceeds the V BE of transistor Q1, it turns on and takes over control of the loop by driving the optocoupler LED. Resistor R6 assures sufficient voltage to keep the control loop in operation down to zero volts at the output. With the output shorted, the drop across R4 and R6 (~1.2 V) is sufficient to keep the Q1 and LED circuit active. Resistors R7 and R9 limit the forward current that could be drawn through VR1 by Q1 under output short circuit conditions, due to the voltage drop across R4 and R6. 10 and 15 W Standby Circuits Figures 15 and 16 show examples of circuits for standby applications. They both provide two outputs: an isolated 5 V and a 12 V primary referenced output. The first, using TNY266P, provides 10 W, and the second, using TNY267P, 15 W of output power. Both operate from an input range of 140 VDC to

375 VDC, corresponding to a 230 V AC or 100/115 V AC with

doubler input. The designs take advantage of the line under- voltage detect, auto-restart and higher switching frequency of TinySwitch-II. Operation at 132 kHz allows the use of a smaller and lower cost transformer core, EE16 for 10 W and EE22 for 15 W. The removal of pin 6 from the 8 pin DIP TinySwitch-II packages provides a large creepage distance which improves reliability in high pollution environments such as fan cooled power supplies. Capacitor C1 provides high frequency decoupling of the high voltage DC supply, only necessary if there is a long trace length from the DC bulk capacitors of the main supply. The

eliminate the need for or reduce the cost of circuit components. Other features simplify the design and enhance performance. Table 2. Comparison Between TinySwitch and TinySwitch-II. *Not available. ** See typical performance curves.

1. The minimum DC input voltage is 90 V or higher for

85 V AC input, or 240 V or higher for 230 V AC input or

for 230 V AC or 115 V AC with doubler input.

• Smaller transformer for low cost
• Ease of design
• Manufacturability
• Optimum design for lower cost Active Frequency Jitter N/A* ±4 kHz • Lower EMI minimizing filter component costs Transformer Audible Noise Reduction N/A* Yes–built into controller • Practically eliminates audible noise with ordinary dip varnished transformer – no special construction or gluing required Line UV Detect N/A* Single resistor programmable
• Prevents power on/off glitches Current Limit Tolerance Temperature Variation (0-100 °C)** ±11% (at 25 °C) -8% ±7% (at 25 °C)
• Increases power capability and simplifies design for high volume manufacturing Auto-Restart N/A* 6% effective on-time • Limits output short-circuit current to less than full load current - No output diode size penalty
• Protects load in open loop fault conditions - No additional components required BYPASS Pin Zener Clamp N/A* Internally clamped to 6.3 V
• Allows TinySwitch-II to be powered from a low voltage bias winding to improve efficiency and to reduce on-chip power dissipation DRAIN Creepage at Package result of dust, debris or other contaminants build-up

G 2. A secondary output of 5 V with a Schottky rectifier diode. 3. Assumed efficiency of 77% (TNY267 & TNY268), 75% (TNY265 & TNY266) and 73% (TNY263 & TNY264). 4. The parts are board mounted with SOURCE pins soldered to sufficient area of copper to keep the die temperature at or below 100 °C. In addition to the thermal environment (sealed enclosure, ventilated, open frame, etc.), the maximum power capability of TinySwitch-II in a given application depends on transformer core size and design (continuous or discontinuous), efficiency, minimum specified input voltage, input storage capacitance, output voltage, output diode forward drop, etc., and can be different from the values shown in Table 1. Audible Noise The TinySwitch-II practically eliminates any transformer audio noise using simple ordinary varnished transformer construction. No gluing of the cores is needed. The audio noise reduction is accomplished by the TinySwitch-II controller reducing the current limit in discrete steps as the load is reduced. This minimizes the flux density in the transformer when switching at audio frequencies. Worst Case EMI & Efficiency Measurement Since identical TinySwitch-II supplies may operate at several different frequencies under the same load and line conditions, care must be taken to ensure that measurements are made under worst case conditions. When measuring efficiency or EMI verify that the TinySwitch-II is operating at maximum frequency and that measurements are made at both low and high line input voltages to ensure the worst case result is obtained. Layout Single Point Grounding Use a single point ground connection at the SOURCE pin for the BYPASS pin capacitor and the Input Filter Capacitor (see Figure 17). Primary Loop Area The area of the primary loop that connects the input filter capacitor, transformer primary and TinySwitch-II together should be kept as small as possible. Primary Clamp Circuit A clamp is used to limit peak voltage on the DRAIN pin at turn-off. This can be achieved by using an RCD clamp (as shown in Figure 14). A Zener and diode clamp (200 V) across the primary or a single 550 V Zener clamp from DRAIN to SOURCE can also be used. In all cases care should be taken to minimize the circuit path from the clamp components to the transformer and TinySwitch-II. Thermal Considerations Copper underneath the TinySwitch-II acts not only as a single point ground, but also as a heatsink. The hatched areas shown in Figure 17 should be maximized for good heat sinking of TinySwitch-II and the same applies to the output diode. EN/UV pin If a line under-voltage detect resistor is used then the resistor should be mounted as close as possible to the EN/UV pin to minimize noise pick up. The voltage rating of a resistor should be considered for the under- voltage detect (Figure 15: R2, R3) resistors. For 1/4 W resistors, the voltage rating is typically 200 V continuous, whereas for 1/2 W resistors the rating is typically 400 V continuous. Y-Capacitor The placement of the Y-capacitor should be directly from the primary bulk capacitor positive rail to the common/return terminal on the secondary side. Such placement will maximize the EMI benefit of the Y-capacitor and avoid problems in common-mode surge testing. Optocoupler It is important to maintain the minimum circuit path from the optocoupler transistor to the TinySwitch-II EN/UV and SOURCE pins to minimize noise coupling. The EN/UV pin connection to the optocoupler should be kept to an absolute minimum (less than 12.7 mm or 0.5 in.), and this connection should be kept away from the DRAIN pin (minimum of 5.1 mm or 0.2 in.). Output Diode For best performance, the area of the loop connecting the secondary winding, the output diode and the output filter capacitor, should be minimized. See Figure 17 for optimized layout. In addition, sufficient copper area should be provided at the anode and cathode terminals of the diode for adequate heatsinking. Input and Output Filter Capacitors There are constrictions in the traces connected to the input and output filter capacitors. These constrictions are present for two reasons. The first is to force all the high frequency currents to flow through the capacitor (if the trace were wide then it could flow around the capacitor). Secondly, the constrictions minimize the heat transferred from the TinySwitch-II to the input filter capacitor and from the secondary diode to the output filter capacitor. The common/return (the negative output terminal in Figure 17) terminal of the output filter capacitor should be connected with a short, low impedance path to the secondary winding. In addition, the common/return output connection should be taken directly from the secondary winding pin and not from the Y-capacitor connection point.

Figure 17. Recommended Circuit Board Layout for TinySwitch-II with Under-Voltage Lock Out Resistor. PI website at: www.powerint.com.

G Parameter Symbol Conditions SOURCE = 0 V; TJ = -40 to 125 °C See Figure 18 (Unless Otherwise Specified) Min Typ Max Units CONTROL FUNCTIONS Output Frequency fOSC TJ = 25 °C See Figure 4 Average 124 132 140 kHz Peak-Peak Jitter 8 Maximum Duty Cycle DCMAX S1 Open 62 65 68 % EN/UV Pin Turnoff Threshold Current IDIS TJ = -40 °C to 125 °C -300 -240 -170 µA EN/UV Pin Voltage VEN IEN/UV = -125 µA 0.4 1.0 1.5 V IEN/UV = 25 µA 1.3 2.3 2.7 DRAIN Supply Current IS1 VEN/UV = 0 V 430 500 µA IS2 EN/UV Open (MOSFET Switching) See Note A, B TNY263 200 250 µA TNY264 225 270 TNY265 245 295 TNY266 265 320 TNY267 315 380 TNY268 380 460 BYPASS Pin Charge Current ICH1 VBP = 0 V, TJ = 25 °C See Note C, D mA ICH2 VBP = 4 V, TJ = 25 °C See Note C, D ABSOLUTE MAXIMUM RATINGS(1,4) Notes: 1. All voltages referenced to SOURCE, T A = 25 °C. 2. Normally limited by internal circuitry. 3. 1/16 in. from case for 5 seconds. 4. Maximum ratings specified may be applied one at a time, without causing permanent damage to the product. Exposure to Absolute Maximum Rating conditions for extended periods of time may affect product reliability. THERMAL IMPEDANCE Thermal Impedance: P or G Package: Notes: 1. Measured on the SOURCE pin close to plastic interface.

G TNY263-268 Parameter Symbol Conditions SOURCE = 0 V; TJ = -40 to 125 °C See Figure 18 (Unless Otherwise Specified) Min Typ Max Units CONTROL FUNCTIONS (cont.) BYPASS Pin Voltage VBP See Note C 5.6 5.85 6.15 V BYPASS Pin Voltage Hysteresis VBPH 0.80 0.95 1.20 V EN/UV Pin Line Under-Voltage Threshold ILUV TJ = 25 °C 44 49 54 µA CIRCUIT PROTECTION Current Limit ILIMIT TNY263 TJ = 25 °C di/dt = 42 mA/µs See Note E 195 210 225 mA TNY264 TJ = 25 °C di/dt = 50 mA/µs See Note E 233 250 267 TNY265 TJ = 25 °C di/dt = 55 mA/µs See Note E 255 275 295 TNY266 TJ = 25 °C di/dt = 70 mA/µs See Note E 325 350 375 TNY267 TJ = 25 °C di/dt = 90 mA/µs See Note E 419 450 481 TNY268 TJ = 25 °C di/dt = 110 mA/µs See Note E 512 550 588 Initial Current Limit IINIT See Figure 21 TJ = 25 °C 0.65 x ILIMIT(MIN) mA Leading Edge Blanking Time tLEB TJ = 25 °C See Note F 170 215 ns Current Limit Delay tILD TJ = 25 °C See Note F, G 150 ns Thermal Shutdown Temperature 125 135 150 °C Thermal Shutdown Hysteresis 70 °C

G Parameter Symbol Conditions SOURCE = 0 V; TJ = -40 to 125 °C See Figure 18 (Unless Otherwise Specified) Min Typ Max Units OUTPUT ON-State Resistance RDS(ON) TNY263 ID = 21 mA TJ = 25 °C 33 38 Ω TJ = 100 °C 50 57 TNY264 ID = 25 mA TJ = 25 °C 28 32 TJ = 100 °C 42 48 TNY265 ID = 28 mA TJ = 25 °C 19 22 TJ = 100 °C 29 33 TNY266 ID = 35 mA TJ = 25 °C 14 16 TJ = 100 °C 21 24 TNY267 ID = 45 mA TJ = 25 °C 7.8 9.0 TJ = 100 °C 11.7 13.5 TNY268 ID = 55 mA TJ = 25 °C 5.2 6.0 TJ = 100 °C 7.8 9.0 OFF-State Drain Leakage Current IDSS VBP = 6.2 V, VEN/UV = 0 V, VDS = 560 V, TJ = 125 °C TNY263-266 50 µA TNY267-268 100 Breakdown Voltage BVDSS VBP = 6.2 V, VEN/UV = 0 V, See Note H, TJ = 25 °C 700 V Rise Time tR Measured in a Typical Flyback Converter Application 50 ns Fall Time tF 50 ns Drain Supply Voltage 50 V Output EN/UV Delay tEN/UV See Figure 20 10 µs Output Disable Setup Time tDST 0.5 µs Auto-Restart ON-Time tAR TJ = 25 °C See Note I 50 ms Auto-Restart Duty Cycle DCAR 5.6 %

G TNY263-268 NOTES: A. Total current consumption is the sum of IS1 and IDSS when EN/UV pin is shorted to ground (MOSFET not switching) and the sum of IS2 and IDSS when EN/UV pin is open (MOSFET switching). B Since the output MOSFET is switching, it is difficult to isolate the switching current from the supply current at the DRAIN. An alternative is to measure the BYPASS pin current at 6.1 V. C. BYPASS pin is not intended for sourcing supply current to external circuitry. D. See Typical Performance Characteristics section for BYPASS pin start-up charging waveform. E. For current limit at other di/dt values, refer to Figure 25. F. This parameter is derived from characterization. G. This parameter is derived from the change in current limit measured at 1X and 4X of the di/dt shown in the I LIMIT specification. H. Breakdown voltage may be checked against minimum BVDSS specification by ramping the DRAIN pin voltage up to but not exceeding minimum BVDSS. I. Auto-restart on time has the same temperature characteristics as the oscillator (inversely proportional to frequency).

Figure 19. TinySwitch-II Duty Cycle Measurement. Figure 20. TinySwitch-II Output Enable Timing. Figure 18. TinySwitch-II General Test Circuit.

5 W S2

NOTE: This test circuit is not applicable for current limit or output characteristic measurements. Figure 21. Current Limit Envelope.

G TNY263-268 Notes: 1. Package dimensions conform to JEDEC specification MS-001-AB (Issue B 7/85) for standard dual-in-line (DIP) package with .300 inch row spacing. 2. Controlling dimensions are inches. Millimeter sizes are shown in parentheses. 3. Dimensions shown do not include mold flash or other protrusions. Mold flash or protrusions shall not exceed .006 (.15) on any side. 4. Pin locations start with Pin 1, and continue counter-clock- wise to Pin 8 when viewed from the top. The notch and/or dimple are aids in locating Pin 1. Pin 6 is omitted. 5. Minimum metal to metal spacing at the package body for the omitted lead location is .137 inch (3.48 mm). 6. Lead width measured at package body. 7. Lead spacing measured with the leads constrained to be perpendicular to plane T. .008 (.20) .015 (.38) .300 (7.62) BSC (NOTE 7) .300 (7.62) .390 (9.91) .367 (9.32) .387 (9.83) .240 (6.10) .260 (6.60) .125 (3.18) .145 (3.68) .057 (1.45) .068 (1.73) .120 (3.05) .140 (3.56) .015 (.38) MINIMUM .048 (1.22) .053 (1.35) .100 (2.54) BSC .014 (.36) .022 (.56) -E- Pin 1 SEATING PLANE -D- -T- P08B DIP-8B PI-2551-121504 D S .004 (.10)⊕ T E D S .010 (.25) M⊕ (NOTE 6) .137 (3.48) MINIMUM PART ORDERING INFORMATION TinySwitch Product Family Series Number Package Identifier G Plastic Surface Mount SMD-8B P Plastic DIP-8B Lead Finish Blank Standard (Sn Pb) N Pure Matte Tin (Pb-Free) Tape & Reel and Other Options Blank Standard Configurations TL Tape & Reel, 1 k pcs minimum, G Package onlyTNY 264 G N - TL

G SMD-8B PI-2546-121504 .004 (.10) .012 (.30) .036 (0.91) .044 (1.12) .004 (.10) 0 - ° 8° .367 (9.32) .387 (9.83) .032 (.81) .037 (.94) .125 (3.18) .145 (3.68) -D- Notes: 1. Controlling dimensions are inches. Millimeter sizes are shown in parentheses. 2. Dimensions shown do not include mold flash or other protrusions. Mold flash or protrusions shall not exceed .006 (.15) on any side. 3. Pin locations start with Pin 1, and continue counter-clock- wise to Pin 8 when viewed from the top. Pin 6 is omitted. 4. Minimum metal to metal spacing at the package body for the omitted lead location is .137 inch (3.48 mm). 5. Lead width measured at package body. 6. D and E are referenced datums on the package body ..057 (1.45) .068 (1.73) (NOTE 5) E S .100 (2.54) (BSC) .137 (3.48) MINIMUM -E- Pin 1 D S .004 (.10)⊕ G08B .420 .046 .060 .060 .046 .080Pin 1 .086 .186 .286 Solder Pad Dimensions

G TNY263-268

G Revision Notes Date A - 3/01 B 1) Corrected first page spacing and sentence in description describing innovative design. 2) Corrected Frequency Jitter in Figure 4 and Frequency Jitter in Parameter Table. 3) Added last sentence to Over Temperature Protection section. 4) Clarified detecting when there is no external resistor connected to the EN/UV pin. 5) Corrected Figure 6 and its description in the text. 6) Corrected formatting, grammer and style errors in text and figures. 7) Corrected and moved Worst Case EMI & Efficiency Measurement section. 8) Added PC Board Cleaning section. 9) Replaced Figure 21 and SMD-8B Package Drawing. C 1) Corrected θJA for P/G package. 2) Updated Figures 15 and 16 and text description for Zener performance. 3) Corrected DIP-8B and SMD-8B Package Drawings. D 1) Corrected EN/UV under-voltage threshold in text. 2) Corrected 2 MΩ connected between positive DC input to EN/UV pin in text and Figures 15 and 16. E 1) Added TNY263 and TNY265. 4/04 F 1) Added lead-free ordering information. 12/04 G 1) Typographical correction in OFF-STATE Drain Leakage Current parameter condition. 2) Removed IDS condition from BVDSS parameter and added new Note H. 3) Added Note 4 to Absolute Maximum Ratings specifications.

G TNY263-268 For the latest updates, visit our website: www.powerint.com Power Integrations reserves the right to make changes to its products at any time to improve reliability or manufacturability. Power Integrations does not assume any liability arising from the use of any device or circuit described herein. POWER INTEGRATIONS MAKES NO WARRANTY HEREIN AND SPECIFICALLY DISCLAIMS ALL WARRANTIES INCLUDING, WITHOUT LIMITATION, THE IMPLIED WARRANTIES OF MERCHANTABILITY , FITNESS FOR A PARTICULAR PURPOSE, AND NON-INFRINGEMENT OF THIRD PARTY RIGHTS. PATENT INFORMATION The products and applications illustrated herein (including transformer construction and circuits external to the products) may be covered by one or more U.S. and foreign patents, or potentially by pending U.S. and foreign patent applications assigned to Power Integrations. A complete list of Power Integrationsʼ patents LIFE SUPPORT POLICY POWER INTEGRATIONSʼ PRODUCTS ARE NOT AUTHORIZED FOR USE AS CRITICAL COMPONENTS IN LIFE SUPPORT DEVICES OR SYSTEMS WITHOUT THE EXPRESS WRITTEN APPROV AL OF THE PRESIDENT OF POWER INTEGRATIONS. As used herein: 1. A Life support device or system is one which, (i) is intended for surgical implant into the body, or (ii) supports or sustains life, and (iii) whose failure to perform, when properly used in accordance with instructions for use, can be reasonably expected to result in significant injury or death to the user. 2. A critical component is any component of a life support device or system whose failure to perform can be reasonably expected to cause the failure of the life support device or system, or to affect its safety or effectiveness. The PI logo, TOPSwitch, TinySwitch, LinkSwitch, DPA-Switch, EcoSmart, PI Expert and PI FACTS are trademarks of Power Integrations, Inc. Other trademarks are property of their respective companies. ©Copyright 2005, Power Integrations, Inc. Power Integrations Worldwide Sales Support Locations WORLD HEADQUARTERS

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