TN3904

TN3904 TEL | Alldatasheet

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NPN SILICON PLANAR SWITCHING TRANSISTOR TN3904 TO-237 Plastic Package General Purpose Transistor ABSOLUTE MAXIMUM RATINGS DESCRIPTION SYMBOL Collector Emitter Voltage VCEO Collector Base Voltage VCBO Emitter Base Voltage VEBO Collector Current Continuous IC Power Dissipation @ Ta=25ºC Power Dissipation @ Tc=25ºC @ Ta=25ºC PCB Land Area for Collector Lead >1 sq inch @ Ta=25ºC with heat sink Operating And Storage Junction Temperature Range Tj, Tstg THERMAL RESISTANCE Junction to Case Rth (j-c) Junction to Ambient in free air Rth (j-a) Thermal Resistance >with PCB land area for collector lead >1 sq inch Rth (j-a) Thermal Resistance Junction to Ambient with heat sink Rth (j-a) ELECTRICAL CHARACTERISTICS (Ta=25ºC unless specified otherwise ) DESCRIPTION SYMBOL TEST CONDITION MIN UNIT Collector Emitter Voltage *VCEO IC=1mA, IB=0 40 V Collector Base Voltage VCBO IC=10µA, IE=0 60 V Emitter Base Voltage VEBO IE=10µA, IC=0 6 V Base Cut Off Current IBL VCE=30V, VEB(off)=3V nA Collector Cut Off Current ICEX VCE=30V, VEB(off)=3V nA DC Current Gain *hFE IC=0.1mA, VCE=1V 40 IC=1mA, VCE=1V 70 IC=10mA, VCE=1V 100 IC=50mA, VCE=1V 60 IC=100mA, VCE=1V 30 Collector Emitter Saturation Voltage *VCE (sat) IC=10mA, IB=1mA V IC=50mA, IB=5mA V Base Emitter Saturation Voltage *VBE (sat) IC=10mA, IB=1mA 0.65 V IC=50mA, IB=5mA V *Pulse Test: Pulse Width < 300mms, Duty Cycle < 2% 104 ºC/W PD 0.75 W 1.5 W 1.0 W 1.2 W 0.3 0.85 0.95 0.2 MAX 167 ºC/W - 55 to +150 ºC 125 ºC/W 200 mA 83 ºC/W 300 VALUE UNIT 40 V 60 V 6.0 V E B C Transys Electronics LI M ITE D

NPN SILICON PLANAR SWITCHING TRANSISTOR TN3904 TO-237 Plastic Package ELECTRICAL CHARACTERISTICS (Ta=25ºC unless specified otherwise) SMALL SIGNAL CHARACTERISTICS DESCRIPTION SYMBOL TEST CONDITION MIN UNIT Transistion Frequency fT IC=10mA, VCE=20V, f=100MHz 300 MHz Output Capacitance Cobo VCB=5V, IE=0, f=1MHz pF Input Capacitance Cibo VEB=0.5V, IC=0, f=1MHz pF Input Impedance hie IC=1mA, VCE=10V, f=1KHz 1.0 KΩ Voltage Feedback Ratio hre IC=1mA, VCE=10V, f=1KHz 0.5 x10 -4 Small Signal Current Gain hfe IC=1mA, VCE=10V, f=1KHz 100 Output Admittance hoe IC=1mA, VCE=10V, f=1KHz 1.0 µmhos Noise Figure NF IC=100µA, VCE=5V, RS=IKΩ, f=10Hz to 15KHz dB SWITCHING TIME DESCRIPTION SYMBOL TEST CONDITION MIN UNIT Delay Time t d ns Rise Time tr ns Storage Time ts ns Fall Time tf ns 200 VCC=3V, VBE=0.5V, IC=10mA, IB1=1mA VCC=3V, IC=10mA, IB1= IB2=1mA 400 MAX MAX E B C

The TO-237 Package, Tape and Ammo Pack Drawings are correct as on the date of issue/revision of this Data Sheet. The currently valid dimensions and information, may please be confimed from the TO-237 Drawing in the Package and Packing Section of the Product Catalogue. TO-237 Plastic Package TO-237 Bulk TO-237 T&A 1K/polybag 2K/ammo box 240 gm/1K pcs 725 gm/2K pcs 3" x 7.5" x 7.5" 12.5" x 8" x 1.8" 17" x 15" x 13.5" 17" x 15" x 13.5" 80K 32K 26.2 kgs 13.8 kgs PACKAGE Net Weight/QtyDetails STANDARD PACK INNER CARTON BOX Qty OUTER CARTON BOX Qty Gr WtSize Size Packing Details 3 2 1 D SEC AA E F B D G A A H AK M Dimension With 'M' Uncontrolled Solderability Ensured Beyond 'M' L Mold Parting Line L 123 N J C DIM A B C D E F G H K L J M N MIN. 4.32 4.45 3.18 0.41 0.35 1.14 12.70 1.03 1.982 1.20 MAX. 5.33 5.20 4.19 0.55 0.50 5.40 1.40 2.54 1.20 2.082 1.40

5 DEG

1. COLLECTOR 2. BASE 3. EMITTER PIN CONFIGURATION

Flat Side of Transistor and Adhesive Tape Visible 2000 pcs./Ammo Pack Label Carrier Strip 186 (7.3") 332 (13") FEED 43(1.7") Tape Mechanical Data A A1 A2 B P (p) C2 W2 DoF2 F Po W1Wo W H2H3 L Ho h1 h1 t hh ITEM SYMBOL SPECIFICATION PULL - OUT FORCE (p) 6N MIN. NOM. BODY WIDTH A1 4.0 4.8 BODY HEIGHT A 4.8 5.2 BODY THICKNESS T 3.9 4.2 COMPONENT ALIGNMENT SIDE VIEW h 0 1.0 COMPONENT ALIGNMENT FRONT VIEW h1 0 1.3 COMPONENT HEIGHT H1 23.25 LENGTH OF SNIPPED LEADS L 11.0 TOTAL TAPE THICKNESS t 1.2 CLINCH HEIGHT HEAT SINK WIDTH HEAT SINK HEIGHT HEAT SINK THICKNESS B 3.0 5.40 2.54 0.45 LEAD PARALLELISM | C1 - C2 | 0.22 MAX. PITCH OF COMPONENT P 12.7 ± 1.0 FEED HOLE PITCH Po 12.7 ± 0.3 FEED HOLE CENTRE TO COMPONENT CENTRE P2 6.35 ± 0.4 DISTANCE BETWEEN OUTER LEADS F 5.08 + 0.6 - 0.2 TAPE WIDTH W 18 ± 0.5 HOLD-DOWN TAPE WIDTH Wo 6 ± 0.2 HOLE POSITION W1 9 + 0.7 - 0.5 HOLD-DOWN TAPE POSITION W2 0.5 ± 0.2 LEAD WIRE CLINCH HEIGHT Ho 16 ± 0.5 FEED HOLE DIAMETER Do 4 ± 0.2 LEAD - TO - LEAD DISTANCE F1, F2 2.54 + 0.4 STAND OFF H2 0.45 1.45 TOL . - 0.1 All dimensions are in mm At top of body3* At top of body4* t1 0.3 – 0.6 mm5* 1 Cumulative pitch error 1.0 mm/20 pitch* *2 To be measured at bottom of clinch REMARKS NOTES Maximum alignment deviation between leads will not to be greater than 0.2mm. Maximum non-cumulative variation between tape feed holes shall not exceed 1 mm in 20 pitches. Holddown tape will not exceed beyond the edge(s) of carrier tape and there shall be no exposure of adhesive. There will be no more than three (3) consecutive missing components in a tape. A tape trailer, having at least three feed holes are provided after the last component in a tape. Splices should not interfere with the sprocket feed holes.