TN2222A TEL | Alldatasheet
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NPN SILICON PLANAR SWITCHING TRANSISTOR TN2222A TO-237 Plastic Package For use as a Medium Power Amplifier ABSOLUTE MAXIMUM RATINGS DESCRIPTION SYMBOL Collector Emitter Voltage VCEO Collector Base Voltage VCBO Emitter Base Voltage VEBO Collector Current Continuous IC Power Dissipation @ Ta=25ºC Power Dissipation @ Tc=25ºC @ Ta=25ºC PCB Land Area for Collector Lead >1 sq inch @ Ta=25ºC with heat sink Operating And Storage Junction Temperature Range Tj, Tstg THERMAL RESISTANCE Junction to Case R th (j-c) Junction to Ambient in free air Rth (j-a) Thermal Resistance >with PCB land area for collector lead >1 sq inch Rth (j-a) Thermal Resistance Junction to Ambient with heat sink Rth (j-a) ELECTRICAL CHARACTERISTICS (Ta=25ºC unless specified otherwise ) DESCRIPTION SYMBOL TEST CONDITION MIN UNIT Collector Emitter Voltage *VCEO IC=10mA, IB=0 40 V Collector Base Voltage VCBO IC=10µA, IE=0 75 V Emitter Base Voltage VEBO IE=10µA, IC=0 6 V Collector Cut Off Current ICEX VCE=60V, VEB(off)=3V nA Collector Cut Off Current ICBO VCB=60V, IE=0 nA VCB=60V, IE=0, Ta=150ºC µA Emitter Cut Off Current IEBO VEB=3V, IC=0 nA Base Cut Off Current IBL VCE=60V, VEB(off)=3V nA DC Current Gain hFE IC=0.1mA, VCE=10V 35 IC=1mA, VCE=10V 50 IC=10mA, VCE=10V 75 IC=150mA, VCE=10V 100 IC=150mA, VCE=1V 50 IC=500mA, VCE=10V 40 *Pulse Test: Pulse Width < 300mms, Duty Cycle < 2% PD 57 ºC/W 167 ºC/W 0.75 W 2.2 W MAX 104 - 55 to +150 ºC ºC/W ºC/W 300 800 mA 1.2 W 1.5 W VALUE UNIT 40 V 75 V 6.0 V E B C Transys Electronics LI M ITE D
NPN SILICON PLANAR SWITCHING TRANSISTOR TN2222A TO-237 Plastic Package ELECTRICAL CHARACTERISTICS (Ta=25ºC unless specified otherwise) DESCRIPTION SYMBOL TEST CONDITION MIN UNIT Collector Emitter Saturation Voltage *VCE (sat) IC=150mA, IB=15mA V IC=500mA, IB=50mA V Base Emitter Saturation Voltage *VBE (sat) IC=150mA, IB=15mA 0.6 V IC=500mA, IB=50mA V SMALL SIGNAL CHARACTERISTICS DESCRIPTION SYMBOL TEST CONDITION MIN UNIT Output Capacitance Cobo VCB=10V, IE=0, f=100KHz pF Input Capacitance Cibo VEB=0.5V, IC=0, f=100KHz pF Small Signal Current Gain hfe IC=1mA, VCE=10V, f=1KHz 50 IC=10mA, VCE=10V, f=1KHz 75 Collector Base Time Constant rb'CC IE=20mA, VCE=20V, f=31.8MHz pS Noise Figure NF IC=100µA, VCE=10V, RS=IKΩ, f=1KHz, Bw=1KHz dB Real Part of Common Emitter High Frequency Input Impedance Re(hie) IC=20mA, VCE=20V, f=300MHz Ω SWITCHING TIME DESCRIPTION SYMBOL TEST CONDITION MIN UNIT Delay Time t d ns Rise Time tr ns Storage Time ts ns Fall Time tf ns *Pulse Test: Pulse Width < 300mms, Duty Cycle < 2% MAX 4.0 225 IC=150mA, IB1=15mA, VCC=30V, VBE(off)=0.5V IC=150mA, IB1= IB2=15mA, VCC=30V 300 375 150 0.3 8.0 1.0 MAX MAX 1.2 2.0 E B C
The TO-237 Package, Tape and Ammo Pack Drawings are correct as on the date of issue/revision of this Data Sheet. The currently valid dimensions and information, may please be confimed from the TO-237 Drawing in the Package and Packing Section of the Product Catalogue. TO-237 Plastic Package TO-237 Bulk TO-237 T&A 1K/polybag 2K/ammo box 240 gm/1K pcs 725 gm/2K pcs 3" x 7.5" x 7.5" 12.5" x 8" x 1.8" 17" x 15" x 13.5" 17" x 15" x 13.5" 80K 32K 26.2 kgs 13.8 kgs PACKAGE Net Weight/QtyDetails STANDARD PACK INNER CARTON BOX Qty OUTER CARTON BOX Qty Gr WtSize Size Packing Details 3 2 1 D SEC AA E F B D G A A H AK M Dimension With 'M' Uncontrolled Solderability Ensured Beyond 'M' L Mold Parting Line L 123 N J C DIM A B C D E F G H K L J M N MIN. 4.32 4.45 3.18 0.41 0.35 1.14 12.70 1.03 1.982 1.20 MAX. 5.33 5.20 4.19 0.55 0.50 5.40 1.40 2.54 1.20 2.082 1.40
5 DEG
- COLLECTOR 2. BASE 3. EMITTER PIN CONFIGURATION
Flat Side of Transistor and Adhesive Tape Visible 2000 pcs./Ammo Pack Label Carrier Strip 186 (7.3") 332 (13") FEED 43(1.7") Tape Mechanical Data A A1 A2 B P (p) C2 W2 DoF2 F Po W1Wo W H2H3 L Ho h1 h1 t hh ITEM SYMBOL SPECIFICATION PULL - OUT FORCE (p) 6N MIN. NOM. BODY WIDTH A1 4.0 4.8 BODY HEIGHT A 4.8 5.2 BODY THICKNESS T 3.9 4.2 COMPONENT ALIGNMENT SIDE VIEW h 0 1.0 COMPONENT ALIGNMENT FRONT VIEW h1 0 1.3 COMPONENT HEIGHT H1 23.25 LENGTH OF SNIPPED LEADS L 11.0 TOTAL TAPE THICKNESS t 1.2 CLINCH HEIGHT HEAT SINK WIDTH HEAT SINK HEIGHT HEAT SINK THICKNESS B 3.0 5.40 2.54 0.45 LEAD PARALLELISM | C1 - C2 | 0.22 MAX. PITCH OF COMPONENT P 12.7 ± 1.0 FEED HOLE PITCH Po 12.7 ± 0.3 FEED HOLE CENTRE TO COMPONENT CENTRE P2 6.35 ± 0.4 DISTANCE BETWEEN OUTER LEADS F 5.08 + 0.6 - 0.2 TAPE WIDTH W 18 ± 0.5 HOLD-DOWN TAPE WIDTH Wo 6 ± 0.2 HOLE POSITION W1 9 + 0.7 - 0.5 HOLD-DOWN TAPE POSITION W2 0.5 ± 0.2 LEAD WIRE CLINCH HEIGHT Ho 16 ± 0.5 FEED HOLE DIAMETER Do 4 ± 0.2 LEAD - TO - LEAD DISTANCE F1, F2 2.54 + 0.4 STAND OFF H2 0.45 1.45 TOL . - 0.1 All dimensions are in mm At top of body3* At top of body4* t1 0.3 – 0.6 mm5* 1 Cumulative pitch error 1.0 mm/20 pitch* *2 To be measured at bottom of clinch REMARKS NOTES Maximum alignment deviation between leads will not to be greater than 0.2mm. Maximum non-cumulative variation between tape feed holes shall not exceed 1 mm in 20 pitches. Holddown tape will not exceed beyond the edge(s) of carrier tape and there shall be no exposure of adhesive. There will be no more than three (3) consecutive missing components in a tape. A tape trailer, having at least three feed holes are provided after the last component in a tape. Splices should not interfere with the sprocket feed holes.