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- Features 2. Applications 3. Dimensions A B C 1R0 1930 E D 4. Part Numbering Note PC power system，incl. IMVP-6 DC/DC converter . TMPC 0502 HP - 1R0 MG - D A B C D E F A: Series B: Dimension BxC C: Type HP:H:Carbonyl Powder. P:PAD broaden. D: Inductance 1R0=1.00uH E: Inductance Tolerance M=±20%，Y=±30% F: Code Marking: Black.1R0 and 1930(19 YY,30 WW,follow production date). SMD Power Inductor Recommend PC Board Pattern L G H L(mm) G(mm) H(mm) 6.2 2.2 2.8 Note: 1. The above PCB layout reference only. 2. Recommend solder paste thickness at 0.12mm and above. Series A(mm) B(mm) C(mm) D(mm) E(mm) Halogen-free Halogen 1. Carbonyl Powder. 2. Compact design. 3. High current，low DCR，high efficiency. 4. Very low acoustic noise and very low leakage flux noise. 5. High reliability. 6. 100% Lead(Pb)-Free and RoHS compliant. 7. Operating temperature -40~+125℃(Including self - temperature rise) TMPC0502HP-Series(G)-D
- Specification Part Number Inductance L0 (uH)±20% I rms ( A ) Typ I sat ( A ) Typ DCR(mΩ) Typ.@25℃ DCR(mΩ) Max.@25℃ TMPC0502HP-R10YG-D 0.10±30% 18 45 3.6 4.0 TMPC0502HP-R15YG-D 0.15±30% 16 27 3.8 4.6 TMPC0502HP-R22MG-D 0.22 15 25 4.0 5.5 TMPC0502HP-R24MG-D 0.24 13 23 6.0 7.0 TMPC0502HP-R33MG-D 0.33 12 21.3 6.3 7.3 TMPC0502HP-R47MG-D 0.47 11.5 18 7.3 8.6 TMPC0502HP-R68MG-D 0.68 10 12.8 11 12.4 TMPC0502HP-1R0MG-D 1.00 7.0 13.7 17.5 20 TMPC0502HP-1R2MG-D 1.20 6.2 11.0 23 28 TMPC0502HP-3R3MG-D 3.30 3.3 7.3 66.0 76 TMPC0502HP-4R7MG-D 4.70 2.8 5.0 103 116 TMPC0502HP-5R6MG-D 5.60 2.5 4.0 112 122 TMPC0502HP-6R8MG-D 6.80 2.4 3.8 130 150 TMPC0502HP-8R2MG-D 8.2 2.3 3.5 148 171 TMPC0502HP-100MG-D 10.0 2.3 3.4 180 199 TMPC0502HP-150MG-D 15.0 1.9 2.8 240 270 TMPC0502HP-220MG-D 22 1.5 1.8 350 390 Note: 1. Test frequency : Ls : 100KHz /1.0V. 2. All test data referenced to 25℃ ambient. 3. Testing Instrument(or equ) : L: HP4284A,CH11025,CH3302,CH1320,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER. 4. Heat Rated Current (Irms) will cause the coil temperature rise approximately ΔT of 40℃ 5. Saturation Current (Isat) will cause L0 to drop approximately 30%. 6. The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. 7. Special inquiries besides the above common used types can be met on your requiremen
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