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- Features 2. Applications 3. Dimensions B C 1.0 E DA 4. Part Numbering TMPC0302H-Series(G) Note PC power system，incl. IMVP-6 DC/DC converter . TMPC 0302 H - 1R0 MG A B C D E A: Series B: Dimension BxC C: Type Carbonyl Powder. D: Inductance 1R0=1.00uH E: Inductance Tolerance M=±20%,Y=±30%, One-way Black marking SMD Power Inductor Recommend PC Board Pattern L G H L(mm) G(mm) H(mm) 4.1 1.9 1.45 Note: 1. The above PCB layout reference only. 2. Recommend solder paste thickness at 0.12mm and above. Series A(mm) A\`(mm) B(mm) C(mm) D(mm) E(mm) Halogen-free Halogen 1. Carbonyl Powder. 2. Compact design. 3. High current，low DCR，high efficiency. 4. Very low acoustic noise and very low leakage flux noise. 5. High reliability. 6. 100% Lead(Pb)-Free and RoHS compliant. 7. Operating temperature -40~+125℃(Including self - temperature rise)
- Specification Part Number Inductance L0 (uH)±20% I rms ( A ) Typ I sat ( A ) Typ DCR(mΩ) Typ.@25℃ DCR(mΩ) Max.@25℃ TMPC0302H-R10YG 0.10±30% 10.5 14 6.6 9.0 TMPC0302H-R22YG 0.22±30% 9.0 11.2 11 14 TMPC0302H-R33MG 0.33 8.0 10 17 21 TMPC0302H-R47MG 0.47 7.0 9.0 19.7 23 TMPC0302H-R60MG 0.60 6.0 7.5 24 28 TMPC0302H-R68MG 0.68 5.5 7.0 25.5 29 TMPC0302H-R82MG 0.82 4.8 6.0 27 32 TMPC0302H-1R0MG 1.00 4.0 5.0 32 38 TMPC0302H-1R2MG 1.20 3.9 4.5 39 47 TMPC0302H-1R5MG 1.50 3.8 4.0 42 50 TMPC0302H-2R2MG 2.20 3.5 3.7 65 75 TMPC0302H-3R3MG 3.30 3.0 3.5 125 145 TMPC0302H-4R7MG 4.70 2.6 3.0 172 200 TMPC0302H-5R6MG 5.60 2.2 2.6 205 238 TMPC0302H-6R8MG 6.80 1.9 2.2 260 300 TMPC0302H-8R2MG 8.20 1.6 1.9 340 390 TMPC0302H-100MG 10.0 1.4 1.6 366 422 Note: 1. Test frequency : Ls : 100KHz /1.0V. 2. All test data referenced to 25℃ ambient. 3. Testing Instrument(or equ) : L: HP4284A,CH11025,CH3302,CH1320,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER. 4. Heat Rated Current (Irms) will cause the coil temperature rise approximately ΔT of 40℃ 5. Saturation Current (Isat) will cause L0 to drop approximately 30%. 6. The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. 7. Special inquiries besides the above common used types can be met on your requirement.
- Typical Performance Curves