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Technical content

  1. Features 2. Applications 3. Dimensions A B C E D A C D 100 1901 4. Part Numbering TMPA2313SP-Series(N)-D 1. Shielded construction. 2. Capable of corresponding high frequency . 3. Low loss realized with low DCR. 4. High performance (Isat) realized by metal dust core. 5. Ultra low buzz noise, due to composite construction. 6. 100% Lead(Pb)-Free and RoHS compliant. 7. Operating temperature -40~+125℃(Including self - temperature rise) 1. DC/DC converters in distributed power systems. 2. DC/DC converter for Field Programmable Gate Array(FPGA). 3. Battery powered devices. 4. Thin type on-board power supply module for exchanger. 5. VRM for server. 6. High current, low profile POL converters. 7. PDA/notebook/desktop/server and battery powered devices. TMPA 2313 SP - 100 MN - D A B C D E F A: Series B: Dimension BxC. C: Type Standard. D: Inductance 100=10.0uH. E: Inductance Tolerance M=±20%. F: Code Marking: Black.100 and 1901(19 YY, 01 WW,follow production date). SMD Power Inductor Recommend PC Board Pattern L G H L(mm) G(mm) H(mm) 24 12.5 19.6 Note: 1. The above PCB layout reference only. 2. Recommend solder paste thickness at 0.20mm and above. Series A(mm) A\`(mm) B(mm) C(mm) D(mm) E(mm) Halogen-free Halogen
  1. Specification 6. Material List NO Items Materials 1 Core Alloy Powder . 2 Wire Polyester Wire or equivalent.

3 Clip 100% Pb free solder(Ni+Sn---Plating)

4 Ink Halogen-free ketone

L0 A(uH) ±20% Heat Rating Current DC Irms ( A ) Saturation Current DC I sat ( A ) DCR (mΩ) Typ DCR (mΩ) Max Typ Max Typ Max TMPA2313SP-1R5MN-D 1.50 62 57 52 48 1.0 1.15 TMPA2313SP-2R0MN-D 2.00 60 54 50 45 1.02 1.20 TMPA2313SP-2R2MN-D 2.20 58 52 48 43 1.05 1.25 TMPA2313SP-3R0MN-D 3.00 51 48 44 39 1.42 1.64 TMPA2313SP-3R3MN-D 3.30 49 47 41 37 1.5 1.75 TMPA2313SP-4R7MN-D 4.70 47 44 38 34 1.9 2.2 TMPA2313SP-6R8MN-D 6.80 40 36 36 32 2.7 3.1 TMPA2313SP-100MN-D 10.0 33 30 28 20 3.8 4.15 TMPA2313SP-220MN-D 22.0 22 18 15 14 9.2 11 TMPA2313SP-230MN-D 23.0 22 18 15 14 9.2 11 TMPA2313SP-330MN-D 33.0 19 16 12 10.5 13.5 15.4 TMPA2313SP-470MN-D 47.0 17 14 12 10 17.3 20.8 TMPA2313SP-680MN-D 68.0 14 12 12 9.0 26.2 29.5 TMPA2313SP-820MN-D 82.0 12 10 9.0 7.7 31 34.2 TMPA2313SP-101MN-D 100 11 9.5 9.0 7.5 36 40 Note: 1. Test frequency : Ls : 100KHz /1.0V. 2. All test data referenced to 25℃ ambient. 3. Testing Instrument(or equ) : L: HP4284A,CH11025,CH3302,CH1320,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER. 4. Heat Rated Current (Irms) will cause the coil temperature rise approximately ΔT of 40℃ 5. Saturation Current (Isat) will cause L0 to drop approximately 30%. 6. The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. 7. Special inquiries besides the above common used types can be met on your requirement.

  1. Typical Performance Curves