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  1. Features 2. Applications 3. Dimensions A B C E D 2.2 4. Part Numbering TMPC0312H-Series(G) Note PC power system，incl. IMVP-6 DC/DC converter . TMPC 0312 H - 2R2 MG A B C D E A: Series B: Dimension BxC C: Type Carbonyl Powder. D: Inductance 2R2=2.2uH E: Inductance Tolerance M=±20%,Y=±30% One-way Black marking SMD Power Inductor Recommend PC Board Pattern L G H L(mm) G(mm) H(mm) 4.1 1.9 1.45 Note: 1. The above PCB layout reference only. 2. Recommend solder paste thickness at 0.12mm and above. Series A(mm) B(mm) C(mm) D(mm) E(mm) Halogen-free Halogen 1. Carbonyl Powder. 2. Compact design. 3. High current，low DCR，high efficiency. 4. Very low acoustic noise and very low leakage flux noise. 5. High reliability. 6. 100% Lead(Pb)-Free and RoHS compliant. 7. Operating temperature -40~+125℃(Including self - temperature rise)
  1. Specification Part Number Inductance L0 (uH)±20% I rms ( A ) Typ I sat ( A ) Typ DCR(mΩ) Typ.@25℃ DCR(mΩ) Max.@25℃ TMPC0312H-R15YG 0.15±30% 10 14 9.6 11 TMPC0312H-R22MG 0.22 6.5 10 14 17 TMPC0312H-R33MG 0.33 6.2 9.2 16 20 TMPC0312H-R36MG 0.36 6.0 8.5 18.5 23 TMPC0312H-R47MG 0.47 5.0 7.2 25 30 TMPC0312H-R56MG 0.56 4.5 6.6 31 36 TMPC0312H-R68MG 0.68 4.0 6.1 34 40 TMPC0312H-R82MG 0.82 3.5 5.8 41 48 TMPC0312H-1R0MG 1.00 3.3 5.5 50 60 TMPC0312H-1R5MG 1.50 3.0 4.0 71 85 TMPC0312H-2R2MG 2.20 2.7 3.4 98 115 TMPC0312H-3R3MG 3.30 2.0 3.1 191 210 TMPC0312H-4R7MG 4.70 1.6 2.8 266 293 TMPC0312H-5R6MG 5.6 1.5 2.2 310 360 TMPC0312H-6R8MG 6.80 1.4 2.0 360 400 TMPC0312H-8R2MG 8.20 1.2 1.7 420 463 TMPC0312H-100MG 10.0 1.0 1.4 498 550 Note: 1. Test frequency : Ls : 100KHz /1.0V. 2. All test data referenced to 25℃ ambient. 3. Testing Instrument(or equ) : L: HP4284A,CH11025,CH3302,CH1320,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER. 4. Heat Rated Current (Irms) will cause the coil temperature rise approximately ΔT of 40℃ 5. Saturation Current (Isat) will cause L0 to drop approximately 30%. 6. The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. 7. Special inquiries besides the above common used types can be met on your requirement.
  1. Typical Performance Curves