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  1. Features 2. Applications 3. Dimensions B C E D 100 1536 A A B C E D R22 1536 4. Part Numbering TMHC1205SP-Series(N)-D 1. Shielded construction. 2. Capable of corresponding high frequency . 3. Low loss realized with low DCR. 4. High performance (Isat) realized by metal dust core. 5. Ultra low buzz noise, due to composite construction. 6. 100% Lead(Pb)-Free and RoHS compliant. 7. Operating temperature -40~+125℃(Including self - temperature rise) 1. DC/DC converters in distributed power systems. 2. DC/DC converter for Field Programmable Gate Array(FPGA). 3. Battery powered devices. 4. Thin type on-board power supply module for exchanger. 5. VRM for server. 6. High current, low profile POL converters. 7. PDA/notebook/desktop/server and battery powered devices. TMHC 1205 SP - 100 MN - D A B C D E F A: Series B: Dimension BxC. C: Type Standard. D: Inductance R10=0.1uh，1R0=1.0uh，100=10uh，101=100uh，102=1000uh. E: Inductance Tolerance K=±10%，L=±15%，M=±20%，N=±25%，Y=±30% F: Code Marking: Black.100and 1916H (19:YY, 16:WW, follow production date, H:P/N). SMD Power Inductor Recommend PC Board Pattern L G H L(mm) G(mm) H(mm) 14.5 8.0 5.0 Note: 1. The above PCB layout reference only. 2. Recommend solder paste thickness at 0.15mm and above. Series A A\` B C D E table Unit:mm Halogen-free Halogen 100 1916H R47 1916H
  1. Specification 6. Material List NO Items Materials 1 Core Alloy Powder . 2 Wire Polyester Wire or equivalent.

3 Clip 100% Pb free solder(Ni+Sn---Plating)

4 Ink Halogen-free ketone

1 Core Alloy Powder . 2 Wire Polyester Wire or equivalent.

3 Solder 100% Pb free solder

L0 A(uH) ±20% Heat Rating Current DC I rms( A ) Saturation Current DC I sat ( A ) DCR (mΩ) Typ DCR (mΩ) Max E(mm) ±0.3 Type Typ Max Typ Max TMHC1205SP-R15YN-D 0.15±30% 55 50 100 90 0.36 0.41 4.7 non-leadframe TMHC1205SP-R22MN-D 0.22 48 42 95 85 0.50 0.55 4.7 non-leadframe TMHC1205SP-R36MN-D 0.36 41 37 80 70 0.75 0.83 4.7 non-leadframe TMHC1205SP-R47MN-D 0.47 38 35 65 60 0.96 1.15 4.0 non-leadframe TMHC1205SP-R68MN-D 0.68 32 28 54 50 1.40 1.60 4.0 non-leadframe TMHC1205SP-1R0MN-D 1.00 30 26 50 46 2.00 2.40 4.7 leadframe TMHC1205SP-1R5MN-D 1.50 27 23 48 44 3.00 3.50 4.7 leadframe TMHC1205SP-2R2MN-D 2.20 25 22 40 35 4.30 5.00 4.7 leadframe TMHC1205SP-3R3MN-D 3.30 20 16 32 28 7.30 8.40 4.7 leadframe TMHC1205SP-4R7MN-D 4.70 14 12 27 24 11.4 15.0 4.7 leadframe TMHC1205SP-6R8MN-D 6.80 12 10 23 20 14.5 16.7 4.7 leadframe Note: 1. Test frequency : Ls : 100KHz /1.0V. 2. All test data referenced to 25℃ ambient. 3. Testing Instrument(or equ) : L: HP4284A,CH11025,CH3302,CH1320,CH1320S LCR METER / Rdc:CH16502,Agilent33420A MICRO OHMMETER. 4. Heat Rated Current (Irms) will cause the coil temperature rise approximately ΔT of 40℃ 5. Saturation Current (Isat) will cause L0 to drop approximately 30%. 6. The part temperature (ambient + temp rise) should not exceed 125℃under worst case operating conditions.Circuit design,component,PCB trace size and thickness,airflow and other cooling provisions all affect the part temperature. Part temperature should be verified in the end application. 7. Special inquiries besides the above common used types can be met on your requirement.

  1. Typical Performance Curves